Features
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Technical content
Features
Single-phase full-wave drive (15V, 1.5A transistors are built in) Half predriver with integrated high side transistor Built-in variable speed function controlled by an external input The LB11660FV can implement quiet, low-vibration variable speed control using externally clocked high side transistor direct PWM drive. Minimum speed setting pin Current limiter circuit (The limit value is determined by Rf; IO = 1A when RF = 0.5) Built-in kickback absorption circuit Soft switching circuit makes low current consumption, low loss, and low noise drive possible at phase switching Built-in HB Built-in lock protection and automatic recovery circuits (built-in on/off ratio switching circuit controlled by the supply voltage) FG (speed detection) output Built-in thermal protection circuit (design guarantee) Monolithic Digital IC Half-pre Motor Driver Single-Phase Full-Wave, for Fan Motor SSOP16 (225mil)
www.onsemi.com Specifications Absolute Maximum Ratings at Ta = 25C Parameter Symbol Conditions Ratings Unit VCC maximum supply voltage V CC max 20 V VM maximum supply voltage VM max 20 V OUT pin maximum output current IOUT max Rf 0.39 1.5 A OUT pin output voltage 1 V OUT max 1 20 V OUT pin output voltage 2 V OUT max 2 T 0.4s 26.5 V PRE pin maximum source current IPSO max 30 mA PRE pin maximum sink current IPSI max 7 mA PRE pin output voltage VP max 20 V HB maximum output current HB max 10 mA VTH input pin voltage VTH max 7 V FG output pin voltage VFG max 18 V FG output current IFG max 10 mA Allowable power dissipation Pd max When mounted on a circuit board *1 0.8 W Operating temperature Topr *2 30 to +90 C Storage temperature Tstg 55 to +150 C *1 Specified circuit board : 114.3 76.1 1.6mm3, glass epoxy. *2: Tj max is 150°C. This device must be used under conditions such that the chip temperature does not exceed Tj = 150°C during operation. Recommended Operating Conditions at Ta = 25C Parameter Symbol Conditions Ratings Unit VCC supply voltage V CC 4 to 15 V VM supply voltage VM 3 to 15 V Current limiter operation range ILIM 0.6 to 1.2 V VTH input level voltage range VTH 0 to 6 V Hall sensor input common-mode input voltage range VICM 0.2 to 3 V Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recomme nded Operating Ranges limits mayaffect device reliability.
www.onsemi.com Electrical Characteristics Unless otherwise specified Ta 25C, VCC = 12V Parameter Symbol Conditions Ratings Unit min typ max Circuit current I CC1 Drive mode 9 12 mA HB voltage VHB IHB = 5mA 1.05 1.25 1.40 V 6VREG voltage V6VREG 6VREG = 5mA 5.80 6 6.20 V CT pin high-level voltage VCTH 3.4 3.6 3.8 V CT pin low-level voltage VCTL 1.4 1.6 1.8 V ICT pin charge current 1 ICTC1 V CC = 12V 1.7 2.2 2.7 A ICT pin charge current 2 ICTC2 V CC = 6V 1.3 1.8 2.3 A ICT pin discharge current 1 ICTD1 V CC = 12V 0.11 0.15 0.19 A ICT pin discharge current 2 ICTD2 V CC = 6V 0.34 0.44 0.54 A ICT charge/discharge current ratio 1 RCT1 V CC = 12V 12 15 18 Times ICT charge/discharge current ratio 2 RCT2 V CC = 6V 3 4 5 Times ICT charge/discharge ratio threshold voltage VRCT 6 6.6 7.3 V VTH bias current IBVTH 2 1 0 A OUT output high saturation voltage VOH I O = 200mA, RL = 1 0.6 0.8 V PRE output low saturation voltage VPL I O = 5mA 0.2 0.4 V PRE output high saturation voltage VPH I O = 20mA 0.9 1.2 V Current limiter VRf V CC VM 450 500 550 mV PWM output pin high-level voltage VPWMH 2.2 2.5 2.8 V PWM output pin low-level voltage VPWML 0.4 0.5 0.7 V PWM external C charge current IPWM1 23 18 14 A PWM external C discharge current IPWM2 18 24 30 A PWM oscillator frequency FPWM C = 200pF 19 23 27 kHz Hall sensor input sensitivity VHN Zero peak value (including offset and hysteresis) 15 25 mV FG output pin low-level voltage VFG/RD IFG/RD = 5mA 0.2 0.3 V FG output pin leakage current IFGL/IRDL VFG/RD = 7V 30 A Thermal protection circuit THD Design target value*3 150 180 210 C *3: This is a design guarantee and is not tested in individual units. The thermal protection circuit is included to prevent any thermal damage to the IC. Since this would imply operation outside the IC's guaranteed temperature range, the application thermal design must be such that the thermal protection circuit will not operate if the fan is operating constantly. Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product per formance may not be indicated by the Electrical Characteristics if operated under different conditions.
www.onsemi.com Package Dimensions unit : mm SSOP16 (225mil) CASE 565AM ISSUE A XXXXXXXXXX YMDDD XXXXX = Specific Device Code Y = Year M = Month DDD = Additional Traceability Data GENERIC MARKING DIAGRAM* *This information is generic. Please refer to device data sheet for actual part marking. SOLDERING FOOTPRINT* NOTE: The measurements are not to guarantee but for reference only. (Unit: mm) *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 1.0 5.80 0.32 0.65 to
www.onsemi.com Pin Assignment Truth Table IN- IN+ VTH CPWM CT OUT1 OUT2 PRE1 PRE2 FG Mode High Low Low High Low High Off Low High Low During rotation drive Low High Off High High Low Off High Low High Low Off Off Low High Low During rotation regeneration Low High Off Off High Low Off High Low - - High Off Off Low High Low Lock protection Low High Off Off High Low Off CPWM – High is the state where CPWM > VTH, and CPWM– Low is the state where CPWM < VTH. Top view OUT2 VCC VTH VM RMI CPWM FG IN+ HB IN- CT 6VREG GND OUT1 PRE2 PRE1 LB11660FV
www.onsemi.com Application Circuit Example 1 *1. Power supply and ground lines The IC ground is the control current power supply system ground, and the external n-channel transistor ground is the motor power supply system ground. These two systems should be formed from separate lines and the control system external components should be connected to the IC ground. *2. Regeneration power supply stabilization capacitor Use a 4.7µF/25V capacitor at least for CM, which is the power supply stabilization capacitor for both PWM drive and kickback absorption. The capacitor CM must be connected to prevent destru ction of the IC when power is applied or removed. *3. Speed Control (1) Control voltage The PWM duty is determined by comparing the VTH pin voltage with the PWM oscillator waveform. When the VTH voltage falls, the on duty increases and when the VTH voltage falls below the PWM output low level, the duty will go to 100%. (2) Thermistor For thermistor applications, normally the 6VREG level will be resistor divided and the divided level input to the VTH pin. The PWM duty is changed by changes in the VTH pin voltage due to changes in temperature. *4. Current limiter setting The current limiter circuit operates if the voltage across the resistor between VCC and the VM pin exceeds 0.5V. Since the current limiter circuit applies limitation at a current determined by I O = VRf/Rf (where VRf = 0.5V (typical), Rf: resistance of the current detection resistor), the current limiter will operate at IO = 1A when Rf = 0.5. The resistor RF must be connected in the circuit and it must have a value such that the circuit operates within the recommended current limiter operating range. VCC FG OUT1 OUT2 CT = 0.47 to 1F CT VTH IN+ IN- CPWM CP = 200pF *f = 23kHz CP = 100pF *f = 46kHz H HB GND 6VREG VM Rf*4 Control valtage RMI PRE1 PRE2 CM = 4.7F or more
www.onsemi.com *5. Hall sensor input Lines that are as short as possible must be used to prevent noise from entering the system. The Hall sensor input circuit consists of a comparator with hysteresis (20mV). We recommend that the Hall sensor input level be at least three times this hysteresis, i.e. at least 60mVp-p. *6. PWM oscillator frequency setting capacitor The PWM oscillator osc illates at f = 23kHz when CP is 200pF and at f = 46kHz when CP is 100pF, and this frequency becomes the PWM reference frequency. Note that the PWM frequency is given a pproximately by the following equation. f [kHz] (4.6×106) ÷C [pF] *7. FG output This is an open collector output, and a rotation count det ection function can be implemented using this FG output, which corresponds to the phase switching. This pin must be left open if unused. *8. HB pin This pin provides a Hall effect sensor bias constant-voltage output of 1.25V . *9. RMI pin This pin is the speed control minimum speed setting. The minimum output duty is set by R3 and R4. Leave R4 open to have the motor stop when the duty is 0%. Rotation Control Timing Chart Minimum output duty VTH(V) PWM duty(%) Duty 100% Duty 0% VPWML VPWMH RMI CPWM 2.5V 0.5V PWM control variable speed mode Full speed mode On duty Minimum speed setting rotation RMI voltage VTH voltage ON OFF
www.onsemi.com Application Circuit Example 2 Mounting circuit board (Component values are provided for reference purposes) Parts List D1 : SBM30-03-Tr (Our product) Q1, 2 : CPH3418 (Our product) R1 : 0.51 size 3225 R2 : 15k size 1608 R3 : 39k size 1608 R4 : 20k size 1608 R5 : 2.2 size 1608 C1 : 4.7 F/25V size 3216 C2 : 2.2 F size 1608 C3 : 2.2 F size 1608 C4 : 220pF size 1005 C5 : 0.47 F size 1608 C6, 7 : No connection VCC FG OUT1 OUT2 CT VTH IN+ IN- CPWM H HB GND 6VREG VM Control voltage RMI PRE1 PRE2 (C6) (C7)
www.onsemi.com Application Circuit Example 3 No minimum speed setting, thermistor input used VCC FG OUT1 OUT2 CT = 0.47 to 1F CT VTH IN+ IN- CPWM H HB GND 6VREG VM RL RMI TH RTU PRE1 PRE2 CP = 200pF *f = 23kHz CP = 100pF *f = 43kHz CM = 4.7F or more
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ORDERING INFORMATION
Device Package Wire Bond Shipping (Qty / Packing) LB11660FV-MPB-H SSOP16 (225mil) (Pb-Free / Halogen Free) Au-Wire 90 / Fan-Fold LB11660FV-TLM-H SSOP16 (225mil) (Pb-Free / Halogen Free) Au-Wire 2000 / Tape & Reel LB11660FV-W-AH SSOP16 (225mil) (Pb-Free / Halogen Free) Cu-Wire 2000 / Tape & Reel † For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://www.onsemi.com/pub_link/Collateral/BRD8011-D.PDF Amplifier with hysteresis CPWM M Control circuit HALL IN- IN+ VCC OUT1 FG OUT2 Delay circuit Delay circuit VTHGND 6VREG Thermal protection circuit Oscillator circuit Charge/discharge circuit 1.25V HB RMICT VM Predriver Predriver PRE2 PRE1 Constant voltage