LA-B3 CTS | Alldatasheet

Document overview

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Technical content

METAL CASE, CASE-MOUNTED SEMICONDUCTORS Part Number Series LA-B3 Natural Conv. (°C/W): 12 Forced Air (°C/W): 3.7 Mounting Envelope: 1.63" x 1.29" x .75" DESCRIPTION OF CURVES N.C. Horiz. Device Only Mounted to G-10. N.C Horiz. & Vert. With Dissipator. 200 FPM w/Diss. 500 FPM w/Diss. 1000 FPM w/Diss.

  • Thermal Resistance Case to Sink is 0.1-0.3 °C/W w/Joint Compound.
  • Derate 0.7 °C/watt for unplated part in natural convection only.

Ordering Information

CTS IERC PART NO. Unplated Comm'l. Black Anodize Mil. Black Anodize Semiconductor Accommodated Hole patt. ref. no. Max. Weight (Grams) LA000B3U LAT03B3U LAIC3B3U LA407B3U LA394B3U LA000B3CB LAT03B3CB LAIC3B3CB LA407B3CB LA394B3CB LA000B3B LAT03B3B LAIC3B3B LA407B3B LA394B3B Undrilled TO-3 TO-3 IC TO-3 (4-pin) Universal 10.8 10.8 10.8 10.8 10.8 HOLE PATTERNS 2. Hole Pattern no. 236 accommodates TO-3s. Available in LA- B series heat dissipators only. 4. Hole pattern no. 237 accommodates To-3 ICs. Available in LA-B series heat dissipators only. 5. Hole pattern no. 407 accommodates TO-3s (4-pin). Available in LA-B series heat dissipators only. 8. Hole pattern no. 394 (universal) accommodates TO-3s, TO- 66s, TO-126s, TO-127s, or T)-220s. Available in LA-B series heat dissipators only. CTS IERC, Heat Sinks and Thermal Management Solutions

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Rev. 08-29-03