LA-A1 CTS | Alldatasheet

Document overview

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Technical content

METAL CASE, CASE-MOUNTED SEMICONDUCTORS Part Number Series LA-A1 Natural Conv. (°C/W): 28.9 Forced Air (°C/W): 8.1 Mounting Envelope: 1.31" x .90" x .25" DESCRIPTION OF CURVES N.C. Horiz. Device Only Mounted to G-10. N.C Horiz. & Vert. With Dissipator. 200 FPM w/Diss. 500 FPM w/Diss. 1000 FPM w/Diss.

  • Thermal Resistance Case to Sink is 0.5-0.7 °C/W w/Joint Compound.
  • Derate 0.3 °C/watt for unplated part in natural convection only.
  • Derate 0.8 °C/watt for Insulube/g226 part in natural convection only.

Ordering Information

CTS IERC PART NO. Unplated Comm'l. Black Anodize Mil. Black Anodize Semiconductor Accommodated Hole patt. ref. no. Max. Weight (Grams) LA000A1U LAD66A1U LAIC66A1U LA000A1CB LAD66A1CB LAIC66A1CB LA000A1B LAD66A1B LAIC66A1B Undrilled TO-66 TO-66IC 1 (see below) 7 (see below) 3.1 3.1 3.1

  1. Hole Pattern no. 248 accommodates TO-66s. Available in LA- A, LA-B and LB series heat dissipators only. 7. Hole pattern no. 191 accommodates To-66 Ics. Available in LA-A, LA-B, and LB series heat dissipators only. CTS IERC, Heat Sinks and Thermal Management Solutions

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Rev. 08-29-03