L9332 STMICROELECTRONICS | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 17
Technical content
Datasheet sections
- 1 Block diagram
- 1.1 Block diagram
- 2 Pin description
- 3 Pad description
- 4 Electrical specifications
- 4.1 Thermal data
- 4.2 Absolute maximum ratings
- 4.3 ESD protection
- 4.4 Electrical characteristics
- 4.5 Diagnostic
- 5 Circuit description
- 6 Package information
- 7 Revision history
Features
■ Quad power low side driver with 3 A output current capability ■ Low RDSON typically 200 mΩ and 300 mΩ @ Tj = 25 °C ■ Internal output clamping structures with V FB = 50 V for fast inductive load current re circulation ■ Limited output voltage slew rate for low EMI ■ Protected µP compatible enable and input ■ Wide operating supply voltage range 4.5 V to 32 V ■ Real time diagnostic functions: – Output shorted to GND – Output shorted to V S – Open load detection in ON and OFF condition – Overtemperature detection ■ Device protection functions: – Overload disable – Selective thermal shutdown – Signal- and Power-Ground-loss shutdown
Description
The L9332 is a monolithic integrated quad low side driver realized in an advanced Multipower BCD mixed technology. The device is intended to drive valves in automotive environment. The inputs are µP compatible. Particular care has been taken to protect the device against failures, to avoid electromagnetic interferences and to offer extensive real time diagnostic. PowerSO-20 Die Table 1. Device summary
1 Block diagram
1.1 Block diagram
Figure 1. Block circuit diagram
2 Pin description
Figure 2. Pin connection (top view) Table 2. Pin description
1 GND Power ground
2 Out1 Output 1 (3 A)
3 D1 Diagnostic 1
4 IN4 Input 4
5 VS Supply voltage
6 NC Not connected
7 IN3 Input 3
8 D2 Diagnostic 2
9 Out2 Output 2 (3 A)
10 GND Power ground
11 GND Power ground
12 Out3 Output 3 (3 A)
13 D3 Diagnostic 3
14 IN2 Input 2
15 GND Signal ground
16 EN Common enable
17 IN1 Input 1
18 D4 Diagnostic 4
19 Out4 Output 4 (3 A)
20 GND Power ground
20 PGND
19 OUT4
3 Pad description
Figure 3. Pad position Table 3. Pad coordinates
1 PG1 Power ground 510*150 -136 1846
2 Out1 Output 1 (3 A) 510*150 -1219 1152
3 D1 Diagnostic 1 150 *150 -1093 662
4 IN4 Input 4 150 *150 -1093 452
5 VS Supply voltage 150 *150 -1093 242
7 IN3 Input 3 150 *150 -1093 -446
8 D2 Diagnostic 2 150 *150 -1093 -656
9 Out2 Output 2 (3 A) 510 *150 -1219 -1148
10 PG2 Power ground 510 *150 -138 -1842
11 PG3 Power ground 430 *150 624 -1842
12 Out3 Output 3 (3 A) 430 *150 1195 -1064
13 D3 Diagnostic 3 150 *150 1181 -557
14 IN2 Input 2 150 *150 1181 -347
15 GND Signal ground 150 *150 1181 -137
16 EN Common enable 150 *150 1181 156
17 IN1 Input 1 150 *150 1181 365
18 D4 Diagnostic 4 150 *150 1181 575
19 Out4 Output 4 (3 A) 430 *150 1196 1067
20 PG4 Power ground 430*150 624 1846
4 Electrical specifications
4.1 Thermal data
4.2 Absolute maximum ratings
4.3 ESD protection
Note: Tested according to JEDEC (Norm: JESD22-A114C.01). Table 4. Thermal data Table 5. Absolute maximum ratings Table 6. ESD protection
4.4 Electrical characteristics
VS = 4.5 to 32 V; -40 °C ≤ Tj1 ≤ 175 °C, unless other-wise specified. Table 7. Electrical characteristics
- Open pins (EN, IN) are detected as low
Table 7. Electrical characteristics (continued)
4.5 Diagnostic
Table 8. Diagnostic
5 Circuit description
Z. This active flyback voltage limitation clamps the output voltage during the flyback phase. diodes are used in the application. For the Ron calculation the parallel resistivity is expected. The nominal current is 70% of the sum of the nominal currents of the used channels. below the disable threshold temperature. The overtemperature, overload and groundloss information is stored until IN is low. and disconnected load (see diagnostic table). diagnostic table shows the corresponding filter time for each detected signal. Figure 4. t
Figure 7. Logic diagram
6 Package information
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 8. PowerSO-20 mechanical data and package dimensions (1) “D and E1” do not include mold flash or protusions.
- Critical dimensions: “E”, “G” and “a3”.
7 Revision history
Table 9. Document revision history 14-Feb-2008 1 Initial release.