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21414HK 20070312-S00010,20060913-S00002/D3098HA(II) No.5839-1/8 http://onsemi.com Semiconductor Components Industries, LLC, 2014 February, 2014 L88M05T Overview The L88M05T is low dropout voltage regulator IC with output current of 0.5 A. Because they can operate with a low input-output voltage difference, they contribute to smaller and more efficient set power supplies, and are optimum for audio-visual and office automation equipment. Functions
- Output voltage : 5V
- 500 mA output current
- Low minimum input-output voltage differential (0.4V typ) enables to save energy and miniaturize transformer size.
- Set size can be miniaturized with compact TP-3H power package.
- Surface mounting on board permits allowable power dissipation to be raised.
- Enhanced mount flexibility with range of formed products. Specifications Maximum Ratings at Ta = 25C Parameter Symbol Conditions Ratings Unit Input voltage V IN max 18 V Allowable power dissipation Pd max Ta ≤ 25°C, no heat sink 1 W Tc = 25°C, with infinite heat sink 6.25 W Thermal resistance (junction-atmosphere) θj-a 125 C/W Thermal resistance (junction-to-case) θj-c 20 C/W Operating temperature Topr 20 to 85 C Storage temperature Tstg 55 to 150 C Monolithic Linear IC 17V, 5V / 0.5A Low Dropout Voltage Regulator
ORDERING INFORMATION
See detailed ordering and shipping information on page 8 of this data sheet. Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Oper ating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. TP3H
Operating Conditions at Ta = 25 °C Parameter Symbol Conditions Ratings Unit Input voltage VIN 5.8 to 17 V Output current lOUT 0 to 500 mA Operating Characteristics at Tj = 25 °C, VIN = 8 V, IO = 500 mA, COUT = 100 μF, CIN = 1 μF, see specified Test Circuit. tinUxampytnimsnoitidnoClobmySretemaraP VegatlovtuptuO OUT 4.85 5.0 5.15 V Dropout voltage VDROP1 0.4 0.6 V VDROP2 lO V3.02.0Am051= Line regulation ΔVOLN 5.8 V VIN Vm0501V71 Load regulation ΔVOLD 5 mA IOUT Vm00103Am005 ltnerructuptuokaeP OP 600 900 mA ltnerructiucric-trohstuptuO OSC 100 300 mA Quiescent current IQ1 IOUT Am0.50.20= IQ2 24 50 mA VegatlovesiontuptuO NO 10 Hz f 04zHk001 μVrms Temperature coefficient of output voltage ΔVOUT/ΔTj Tj = 25 to 125 °C ±0.5 mV/°C V6,zH021=fjerRnoitcejerelppiR VIN 17 V 65 dB L88M00T Series No.5839-2/8
No.5839-3/8 Package Dimensions unit : mm IPAK / TP3H CASE 369AF ISSUE A XXXXXXXXXX YMDDD XXXXX = Specific Device Code Y = Year M = Month DDD = Additional Traceability Data GENERIC MARKING DIAGRAM* *This information is generic. Please refer to device data sheet for actual part marking. may or may not be present. SOLDERING FOOTPRINT* NOTE: The measurements are not to guarantee but for reference only. Through Hole Area *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Package name TP3H (Unit: mm) 1.0 2.6 (0.65) 1.45
Equivalent Circuit Block Diagram (Common to L88M00T Series) Test Circuit (Common to L88M00T Series) Notes: 1. To ensure operational stability, CIN and COUT should be placed as close to the IC as possible. 2. Because the output capacitor COUT is set at over 100μF to prevent oscillation at low temperatures, a capacitor that exhibits little change in capacity with temperature variations should be used (such as a tantalum capacitor). 3. When VIN is minus (–) and GND is plus (+) (reversed connection), excessive current flow will occur. Start-up circuit Reference voltage Error amp Thermal protector Short circuit protector L88M00T L88M00T Series No.5839-4/8
1) The allowable power dissipation is 1.0 W (Ta = 25°C) with no fin attached, but when mounted on a hybrid IC board or printed circuit board, high allowable power dissipation is achieved, despite the compact package. The graph below depicts the relationship between the copper-clad area and allowable power dissipation when mounted on a glass epoxy board (50× 50 × 0.8 tmm3) with a copper thickness of 18μm. 2) Pd is the value for when the solder on the surface of the IC heat sink has melted completely and the surface mount is horizontal. 3) Please be advised that the flow solder application system (full-heat method) cannot be recommended. Lead Formings P dm a x–T a Common for L88M00T Series With infinite heat sink Mounted on copper-clad area of 2,000 mm2 Mounted on copper-clad area 740 mm Mounted on copper-clad area 180 mm Mounted on copper-clad area 36 mm No heat sink Ambient temperature, Ta – °C Allowable power dissipation, Pd max – W P dm a x–S Common for L88M00T series Allowable power dissipation, Pd max – W Copper-clad area, S – mm 2 PCB Copper-clad area, S – (mm2) LR forming FA forming L88M00T Series No.5839-5/8
VO – VIN Output voltage, VO – V VO – VIN Output voltage, VO – V Input voltage, VIN – V Input voltage, VIN – V Output voltage, VO – V VO – VIN Input voltage, VIN – V Dropout voltage, VDROP – V VDROP – IO Common for L88M00T Series Output current, IO – A VO – IO Output voltage, VO – V VO – IO Output voltage, VO – V Output current, IO – A Output current, IO – A Output voltage, VO – V VO – IO Output current, IO – A Quiescent current, IQ – mA IQ – VIN Input voltage, VIN – V L88M00T Series No.5839-6/8
Quiescent current, IQ – mA Output current, IO – A Output voltage, VO – V Ambient temperature, Ta–°C IQ – IO VO – Ta Output voltage, VO – V Ambient temperature, Ta–°C Quiescent current, IQ – mA IQ – Ta Ambient temperature, Ta–°C VO – Ta Peak output current, IOP – A Output short-circuit current, IOSC – A IOP, IOSC – Ta Common for L88M00T Series Ambient temperature, Ta–°C Ripple rejection, Rrej–dB Rrej – f Frequency,f– Hz L88M00T Series No.5839-7/8
PS No.5839-8/8 Device Package Shipping (Qty / Packing) L88M05T-E TP3H (Pb-Free) 500 / Bulk Bag L88M05TL-FA-E TP3H (Pb-Free) 500 / Bulk Bag L88M05TLL-E TP3H (Pb-Free) 500 / Bulk Bag L88M05TL-LR-E TP3H (Pb-Free) 500 / Bulk Bag L88M05TL-TL-E TP3H (Pb-Free) 700 / Tape & Reel L88M05T-TL-E TP3H (Pb-Free) 700 / Tape & Reel ON Semiconductor and the ON logo are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequentia l or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s techn ical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC productsfor any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, anddistributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture oft h e part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.