ISL6562
Document overview
- Manufacturer or author: Intersil Corporation
- PDF pages: 5
Technical content
Features
- Two-Phase Power Conversion
- Precision Channel Current Sharing
- Precision CORE Voltage Regulation - ±0.8% Accuracy
- Microprocessor Voltage Identification Input - 5-Bit VID Input - 1.050V to 1.825V in 25mV Steps - Programmable “Droop” Voltage
- Fast Transient Recovery Time
- Over Current Protection
- High Ripple Frequency, (Channel Frequency
Applications
- VRM8.5 Modules
- Intel® Tualatin Processor Voltage Regulator
- Low Output Voltage, High Current DC/DC Converters Related Literature
- Technical Brief TB363 “Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices (SMDs)” Pinout ISL6562 (SOIC) TOP VIEW
Ordering Information
PART NUMBER TEMP. ( oC) PACKAGE PKG. NO. ISL6562CB 0 to 70 16 Ld SOIC M16.15 ISL6562CB-T 16 Ld SOIC Tape and Reel ISL6560/62EVAL1 Evaluation Platform VID3 VID2 VID1 VID0 VID25mV CT PWRGD REF PWM1 PWM2 VCC FB CS- COMP CS+ GND File Number 9012 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143| Intersil and Design is a trademark of Intersil Americas Inc. Intel® is a registered trademark of Intel Corporation.| Copyright © Intersil Americas Inc. 2001, All Rights Reserved ISL6562 Data Sheet March 2001
Simplified Power System Diagram Functional Pin Description VID3 (Pin 1), VID2 (Pin 2), VID1 (Pin 3), VID0 (Pin 4) and VID25mV (Pin 5) Voltage Identification inputs from microprocessor. These pins respond to TTL and 3.3V logic signals. The ISL6562 decodes VID bits to establish the output voltage. See Table 1. COMP (Pin 6) Output of the internal transconductance error amplifier. Voltage at this terminal sets the output current level of the Current Sense Comparator. Pulling this pin to ground disables the oscillator and drives both PWM outputs low. FB (Pin 7) Inverting input of the internal transconductance error amplifier. CT (Pin 8) A capacitor on this terminal sets the frequency of the internal oscillator. GND (Pin 9) Bias and reference ground. All signals are referenced to this pin. PWRGD (Pin 10) Open drain connection. A high voltage level at this pin with a resistor connected to this terminal and VCC indicates that CORE voltage is at the proper level, CS+ (Pin 11) and CS- (Pin 14)These inputs monitor the supply current to the converter positive input voltage. CS+ is connected directly to the decoupled supply voltage and current sampling resistor. CS- is connected to the other end of the current sampling resistor and the upper drains of the series transistors. PWM2 (Pin 12) and PWM1 (Pin 13) PWM outputs connected to the gate driver ICs. REF (Pin 15) Three volt supply used to bias the output of the transconductance amplifier. VCC (Pin 16) Bias supply. Connect this pin to a 12V supply. D/A UV OVP E/A CMP PWM1 PWM2 CS+ CS- GND REF VCC FB VID3 VID2 VID1 VID0 VID25mV COMP OSCILLATOR X1.24 PWRGD 3V REFERENCE BIAS CIRCUITS UVLO and CT CONTROL LOGIC X 0.82 SYNCHRONOUS ISL6562 MICROPROCESSOR FB VID RECTIFIED BUCK CHANNEL SYNCHRONOUS RECTIFIED BUCK CHANNEL PWM 1 PWM 2 VID3 VID2 VID1 VID0 VID25mV CT PWRGD REF PWM1 PWM2 VCC FB CS- COMP CS+ GND ISL6562
Absolute Maximum Ratings Thermal Information ESD Rating Operating Conditions Thermal Resistance (Note 1) θJA (oC/W) (SOIC - Lead Tips Only) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details. Electrical SpecificationsRecommended Operating Conditions, Unless Otherwise Noted PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS VCC SUPPLY CURRENT Input Supply Current I CC VCC = 12V - 5.8 9.0 mA Input Supply Current, UVLO Mode I CC(UVLO) VCC ≤ VUVLO , VCC Rising - 5.7 8.9 mA Undervoltage Lock Out Voltage V UVLO 5.4 6.4 6.9 V Undervoltage Lock Out Hysteresis 0.1 0.4 0.8 V DAC and REFERENCE VOLTAGES Minimum DAC Programed Voltage V FB DAC Programmed to 1.050V 1.042 1.050 1.058 V Middle DAC Programed Voltage V FB DAC Programmed to 1.500V 1.488 1.500 1.512 V Maximum DAC Programed Voltage V FB DAC Programmed to 1.825V 1.811 1.825 1.839 V Line Regulation ∆VFB VCC = 10V to 14V - 0.05 - % Crowbar Trip Point at FB Input V CROWBAR Percent of Nominal DAC Voltage 114 124 134 % Crowbar Reset Point at FB Input V CROWBAR Percent of Nominal DAC Voltage 50 60 70 % Crowbar Response Time I CROWBAR Overvoltage to PWM Going Low - 300 - ns Reference Voltage V REF 0mA ≤ IREF ≤ 1mA 2.952 3.000 3.048 V Output Current I REF 300 - - µA VID INPUTS Input Low Voltage V IL(VID) - - 0.6 V Input High Voltage V IH(VID) 2.2 - - V VID Pull-Up I VID VIDx = 0V or VIDx = 3V 10 20 40 µA Internal Pull-Up Voltage 4.5 5.0 5.5 V OSCILLATOR Maximum Frequency f CT(MAX) 2.0 - - MHz Frequency Variation ∆fCT TA = 25oC, CT = 91pF 430 500 570 kHz CT Charging Current I CT TA = 25oC, VFB in Regulation 130 150 170 µA CT Charging Current I CT TA = 25oC, VFB = 0V 26 36 46 µA ERROR AMPLIFIER Output Resistance R O(ERR) - 200 - k Ω Transconductance g m(ERR) 2.0 2.2 2.4 mS ISL6562
Output Current I O(ERR) FB Forced to VOUT - 3% - 1 - mA Input Bias Current I FB - 5 100 nA Maximum Output Voltage VCOMP(MAX) FB Forced to VOUT - 3% - 3.0 - V Output Disable Threshold VCOMP(OFF) 560 720 800 mV FB Low Foldback Threshold V FB(LOW) 375 425 500 mV -3dB Bandwidth BW ERR COMP = Open - 500 - kHz CURRENT SENSE Threshold Voltage V CS(TH) CS+ = VCC, FB Forced to VOUT - 3% 69 79 89 mV 0.8≤ COMP ≤ 1V - 0 15 mV Current Limit Foldback Voltage V CS(FOLD) FB ≤ 375mV 37 47 58 mV ∆VCOMP /∆VCS ni 1 V≤ VCOMP ≤ 3V - 25 - V/V Input Bias Current I CS+ , ICS- CS+ = CS- = VCC - 0.5 5.0 µA Response Time t CS CS+ - (CS-)≥ 89mV to PWM Going Low - 50 - ns POWER GOOD COMPARATOR Undervoltage Threshold VPWRGD(UV) Percent of Nominal Output 76 82 88 % Overvoltage Threshold VPWRGD(OV) Percent of Nominal Output 114 124 134 % Output Voltage Low VOL(PWRGD) IPWRGD(SINK) = 100µA - 30 200 mV Response Time - 200 - ns PWM OUTPUTS Output Voltage Low V OL(PWM) IPWM(SINK) = 400µA - 100 500 mV Output Voltage High V OH(PWM) IPWM(SOURCE) = 400µA 4.5 5.0 5.5 V Output Current I PWM 0.4 1 - mA Duty Cycle Limit, by Design D MAX Per Phase, Relative to fCT - - 50 % Electrical SpecificationsRecommended Operating Conditions, Unless Otherwise Noted PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS VOLTAGE IDENTIFICATION CODE AT PROCESSOR PINS VCC CORE (VDC)VID25mV VID3 VID2 VID1 VID0 0 0100 1.050 1 0100 1.075 0 0011 1.100 1 0011 1.125 0 0010 1.150 1 0010 1.175 0 0001 1.200 1 0001 1.225 0 0000 1.250 1 0000 1.275 0 1111 1.300 1 1111 1.325 0 1110 1.350 1 1110 1.375 0 1101 1.400 1 1101 1.425 0 1100 1.450 1 1100 1.475 0 1011 1.500 1 1011 1.525 0 1010 1.550 1 1010 1.575 0 1001 1.600 1 1001 1.625 0 1000 1.650 1 1000 1.675 0 0111 1.700 1 0111 1.725 0 0110 1.750 1 0110 1.775 0 0101 1.800 1 0101 1.825 VOLTAGE IDENTIFICATION CODE AT PROCESSOR PINS VCC CORE (VDC)VID25mV VID3 VID2 VID1 VID0 ISL6562
All Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at websitewww .intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. How- ever, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web sitewww.intersil.com Sales Office Headquarters NORTH AMERICA Intersil Corporation 2401 Palm Bay Rd., Mail Stop 53-204 Palm Bay, FL 32905 TEL: (321) 724-7000 FAX: (321) 724-7240 EUROPE Intersil SA Mercure Center 100, Rue de la Fusee
1130 Brussels, Belgium
TEL: (32) 2.724.2111 ASIA Intersil Ltd. 8F-2, 96, Sec. 1, Chien-kuo North, Taipei, Taiwan 104 Republic of China TEL: 886-2-2515-8508 FAX: 886-2-2515-8369 ISL6562 Small Outline Plastic Packages (SOIC) NOTES: 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. INDEX AREA E D N 123 -B- 0.25(0.010) C AM BS e -A- L B M -C- A SEATING PLANE 0.10(0.004) h x 45o C H 0.25(0.010) BM M α M16.15 (JEDEC MS-012-AC ISSUE C)
16 LEAD NARROW BODY SMALL OUTLINE PLASTIC
A 0.0532 0.0688 1.35 1.75 - A1 0.0040 0.0098 0.10 0.25 - B 0.013 0.020 0.33 0.51 9 C 0.0075 0.0098 0.19 0.25 - D 0.3859 0.3937 9.80 10.00 3 E 0.1497 0.1574 3.80 4.00 4 e 0.050 BSC 1.27 BSC - H 0.2284 0.2440 5.80 6.20 - h 0.0099 0.0196 0.25 0.50 5 L 0.016 0.050 0.40 1.27 6 N1 6 1 6 7 α 0o 8o 0o 8o - Rev. 0 12/93