L6235 STMICROELECTRONICS | Alldatasheet
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Technical content
■ OPERATING SUPPLY VOLTAGE FROM 8 TO 52V ■ 5.6A OUTPUT PEAK CURRENT (2.8A DC) ■ R DS(ON) 0.3Ω TYP. VALUE @ Tj = 25 °C ■ OPERATING FREQUENCY UP TO 100KHz ■ NON DISSIPATIVE OVERCURRENT DETECTION AND PROTECTION ■ DIAGNOSTIC OUTPUT ■ CONSTANT t OFF PWM CURRENT CONTROLLER ■ SLOW DECAY SYNCHR. RECTIFICATION ■ 60° & 120° HALL EFFECT DECODING LOGIC ■ BRAKE FUNCTION ■ TACHO OUTPUT FOR SPEED LOOP ■ CROSS CONDUCTION PROTECTION ■ THERMAL SHUTDOWN ■ UNDERVOLTAGE LOCKOUT ■ INTEGRATED FAST FREEWEELING DIODES
DESCRIPTION
The L6235 is a DMOS Fully Integrated Three-Phase Motor Driver with Overcurrent Protection. Realized in MultiPower-BCD technology, the device combines isolated DMOS Power Transistors with CMOS and bipolar circuits on the same chip. The device includes all the circuitry needed to drive a three-phase BLDC motor including: a three-phase DMOS Bridge, a constant off time PWM Current Con- troller and the decoding logic for single ended hall sensors that generates the required sequence for the power stage. Available in PowerDIP24 (20+2+2), PowerSO36 and SO24 (20+2+2) packages, the L6235 features a non- dissipative overcurrent protection on the high side Power MOSFETs and thermal shutdown. BLOCK DIAGRAM CHARGE PUMP VOLTAGE REGULATOR HALL-EFFECT SENSORS DECODING LOGIC THERMAL PROTECTION TACHO MONOSTABLE OCD1 OCD OCD OCD2 10V 5V VCP VS A GATE LOGIC VBOOT V BOOT OUT 1 OUT 2 SENSE A VS B OUT 3 SENSE B DIAG EN FWD/REV BRAKE H 3 H 1 RCPULSE D99IN1095B TACHO RCOFF H 2 OCD3 ONE SHOT MONOSTABLE MASKING TIME VBOOT OCD1 10V VBOOT OCD2 10V VBOOT OCD3 10V SENSE COMPARATOR PWM VREF ORDERING NUMBERS: L6235N L6235PD L6235D PowerDIP24 (20+2+2) PowerSO36 SO24 (20+2+2) DMOS DRIVER FOR THREE-PHASE BRUSHLESS DC MOTOR
RECOMMENDED OPERATING CONDITION Symbol Parameter Test conditions Value Unit VS Supply Voltage V SA = VSB = VS 60 V VOD Differential Voltage between: VS A, OUT1, OUT2, SENSEA and VSB, OUT3, SENSEB VSA = VSB = VS = 60V; VSENSEA = VSENSEB = GND 60 V VBOOT Bootstrap Peak Voltage V SA = VSB = VS VS + 10 V VIN, VEN Logic Inputs Voltage Range -0.3 to 7 V VREF Voltage Range at pin VREF -0.3 to 7 V VRCOFF Voltage Range at pin RCOFF -0.3 to 7 V VRCPULSE Voltage Range at pin RCPULSE -0.3 to 7 V VSENSE Voltage Range at pins SENSEA and SENSE B -1 to 4 V IS(peak) Pulsed Supply Current (for each VS A and VSB pin) VSA = VSB = VS; TPULSE < 1ms 7.1 A IS DC Supply Current (for each VS A and VSB pin) VSA = VSB = VS 2.8 A Tstg, TOP Storage and Operating Temperature Range -40 to 150 °C Symbol Parameter Test Conditions MIN MAX Unit VS Supply Voltage V SA = VSB = VS 12 52 V VOD Differential Voltage between: VS A, OUT1, OUT2, SENSEA and VS B, OUT3, SENSEB VSA = VSB = VS; VSENSEA = VSENSEB 52 V VREF Voltage Range at pin VREF -0.1 5 V VSENSE Voltage Range at pins SENSEA and SENSE B (pulsed tW < trr) (DC) V V IOUT DC Output Current V SA = VSB = VS 2.8 A TJ Operating Junction Temperature -25 125 °C fSW Switching Frequency 100 KHz
PIN CONNECTIONS (Top view) (5) The slug is internally connected to pins 1, 18, 19 and 36 (GND pins). Symbol Description PDIP24 SO24 PowerSO36 Unit R th(j-pins) Maximum Thermal Resistance Junction-Pins 18 14 °C/W R th(j-case) Maximum Thermal Resistance Junction-Case 1 °C/W R th(j-amb)1 MaximumThermal Resistance Junction-Ambient (1) (1) Mounted on a multi-layer FR4 PCB with a dissipating copper surface on the bottom side of 6 cm2 (with a thickness of 35 µm). 43 51 - °C/W R th(j-amb)1 Maximum Thermal Resistance Junction-Ambient (2) (2) Mounted on a multi-layer FR4 PCB with a dissipating copper surface on the top side of 6 cm2 (with a thickness of 35 µm). -- 3 5 °C/W R th(j-amb)1 MaximumThermal Resistance Junction-Ambient (3) (3) Mounted on a multi-layer FR4 PCB with a dissipating copper surface on the top side of 6 cm2 (with a thickness of 35 µm), 16 via holes and a ground layer. -- 1 5 °C/W R th(j-amb)2 Maximum Thermal Resistance Junction-Ambient (4) (4) Mounted on a multi-layer FR4 PCB without any heat-sinking surface on the board. 58 77 62 °C/W GND GND TACHO RCPULSE SENSE B EN FWD/REV VREF VBOOT BRAKE OUT 3 VS B GND GND19 D01IN1194A H 1 DIAG SENSE A RCOFF OUT 1 VS A OUT 2 VCP H 2 H 3 GND N.C. N.C. VS A RCOFF OUT 1 N.C. N.C. N.C. N.C. N.C. TACHO RCPULSE N.C. VS B N.C. N.C. GND1 GND GND D01IN1195A H 1 SENSE A DIAG SENSE B EN FWD/REV H 3 VREF9 28 OUT 2 H 2 VCP BRAKE OUT 3 VBOOT N.C. N.C.6 31 PowerSO36 (5)PowerDIP24/SO24
PIN # PIN # 11 0 H 1 Sensor Input Single Ended Hall Effect Sensor Input 1. 2 11 DIAG Open Drain Output Overcurrent Detection and Thermal Protection pin. An internal open drain transistor pulls to GND when an overcurrent on one of the High Side MOSFETs is detected or during Thermal Protection. 3 12 SENSE A Power Supply Half Bridge 1 and Half Bridge 2 Source Pin. This pin must be connected together with pin SENSEB to Power Ground through a sensing power resistor. 4 13 RCOFF RC Pin RC Network Pin. A parallel RC network connected between this pin and ground sets the Current Controller OFF-Time. 5 15 OUT 1 Power Output Output 1 6, 7, 18, 19 1, 18, 19, 36 GND GND Ground terminals. On PowerDIP24 and SO24 packages, these pins are also used for heat dissipation toward the PCB. On PowerSO36 package the slug is connected on these pins. 8 22 TACHO Open Drain Output Frequency-to-Voltage open drain output. Every pulse from pin H1 is shaped as a fixed and adjustable length pulse. 9 24 RCPULSE RC Pin RC Network Pin. A parallel RC network connected between this pin and ground sets the duration of the Monostable Pulse used for the Frequency-to-Voltage converter. 10 25 SENSE B Power Supply Half Bridge 3 Source Pin. This pin must be connected together with pin SENSEA to Power Ground through a sensing power resistor. At this pin also the Inverting Input of the Sense Comparator is connected. 11 26 FWD/REV Logic Input Selects the direction of the rotation. HIGH logic level sets Forward Operation, whereas LOW logic level sets Reverse Operation. If not used, it has to be connected to GND or +5V.. 12 27 EN Logic Input Chip Enable. LOW logic level switches OFF all Power MOSFETs. If not used, it has to be connected to +5V. 13 28 VREF Logic Input Current Controller Reference Voltage. Do not leave this pin open or connect to GND. 14 29 BRAKE Logic Input Brake Input pin. LOW logic level switches ON all High Side Power MOSFETs, implementing the Brake Function. If not used, it has to be connected to +5V. 15 30 VBOOT Supply Voltage Bootstrap Voltage needed for driving the upper Power MOSFETs. 16 32 OUT 3 Power Output Output 3. 17 33 VS B Power Supply Half Bridge 3 Power Supply Voltage. It must be connected to the supply voltage together with pin VSA.
PIN # PIN # 20 4 VS A Power Supply Half Bridge 1 and Half Bridge 2 Power Supply Voltage. It must be connected to the supply voltage together with pin VSB. 21 5 OUT 2 Power Output Output 2. 22 7 VCP Output Charge Pump Oscillator Output. 23 8 H 2 Sensor Input Single Ended Hall Effect Sensor Input 2. 24 9 H 3 Sensor Input Single Ended Hall Effect Sensor Input 3.
ELECTRICAL CHARACTERISTICS
(VS = 48V , Tamb = 25 °C , unless otherwise specified) Symbol Parameter Test Conditions Min Typ Max Unit VSth(ON) Turn ON threshold 6.6 7 7.4 V VSth(OFF) Turn OFF threshold 5.6 6 6.4 V IS Quiescent Supply Current All Bridges OFF; Tj = -25 to 125°C (6) 51 0 m A TJ(OFF) Thermal Shutdown Temperature 165 °C Output DMOS Transistors R DS(ON) High-Side Switch ON Resistance Tj = 25 °C 0.34 0.4 Ω Tj =125 °C (6) 0.53 0.59 Ω Low-Side Switch ON Resistance Tj = 25 °C 0.28 0.34 Ω Tj =125 °C (6) 0.47 0.53 Ω IDSS Leakage Current EN = Low; OUT = V CC 2m A EN = Low; OUT = GND -0.15 mA Source Drain Diodes VSD Forward ON Voltage I SD = 2.8A, EN = LOW 1.15 1.3 V trr Reverse Recovery Time I f = 2.8A 300 ns tfr Forward Recovery Time 200 ns Logic Input (H1, H2, H3, EN, FWD/REV, BRAKE) VIL Low level logic input voltage -0.3 0.8 V VIH High level logic input voltage 2 7 V IIL Low level logic input current GND Logic Input Voltage -10 µA IIH High level logic input current 7V Logic Input Voltage 10 µA Vth(ON) Turn-ON Input Threshold 1.8 2.0 V Vth(OFF) Turn-OFF Input Threshold 0.8 1.3 V VthHYS Input Thresholds Hysteresys 0.25 0.5 V PIN DESCRIPTION (continued)
(6) Tested at 25°C in a restricted range and guaranteed by characterization. (7) See Fig. 1. (8) Measured applying a voltage of 1V to pin SENSE and a voltage drop from 2V to 0V to pin VREF. (9) See Fig. 2. Symbol Parameter Test Conditions Min Typ Max Unit Switching Characteristics tD(on)EN Enable to out turn-ON delay time (7) ILOAD = 2.8 A, Resistive Load 110 250 400 ns tD(off)EN Enable to out turn-OFF delay time (7) ILOAD = 2.8 A, Resistive Load 300 550 800 ns tD(on)IN Other Logic Inputs to Output Turn- ON delay Time ILOAD = 2.8 A, Resistive Load 2 µs tD(off)IN Other Logic Inputs to out Turn-OFF delay Time ILOAD = 2.8 A, Resistive Load 2 µs tRISE Output Rise Time (7) ILOAD = 2.8 A, Resistive Load 40 250 ns tFALL Output Fall Time (7) ILOAD = 2.8 A, Resistive Load 40 250 ns tDT Dead Time 0.5 1 µs fCP Charge Pump Frequency Tj = -25 to 125°C (6) 0.6 1 MHz PWM Comparator and Monostable IRCOFF Source current at pin RCOFF V RCOFF = 2.5 V 3.5 5.5 mA VOFFSET Offset Voltage on Sense Comparator Vref = 0.5 V ±5 mV tprop Turn OFF Propagation delay (8) Vref = 0.5 V 500 ns tblank Internal Blanking Time on Sense Comparator 1µ s tON(min) Minimum on Time 1.5 2 µs tOFF PWM RecirculationTime R OFF = 20kΩ ; COFF =1nF 13 µs R OFF = 100kΩ ; COFF =1nF 61 µs IBIAS Input Bias Current at pin VREF 10 µA Tacho Monostable IRCPULSE Source Current at pin RCPULSE VRCPULSE = 2.5V 3.5 5.5 mA tPULSE Monostable of Time R PUL = 20kΩ ; CPUL =1nF 12 µs R PUL = 100kΩ ; CPUL =1nF 60 µs R TACHO Open Drain ON Resistance 40 60 Ω Over Current Detection & Protection ISOVER Supply Overcurrent Protection Threshold TJ = -25 to 125°C (6) 4.0 5.6 7.1 A ROPDR Open Drain ON Resistance I DIAG = 4mA 40 60 Ω IOH OCD high level leakage current VDIAG = 5V 1 µA tOCD(ON) OCD Turn-ON Delay Time (9) IDIAG = 4mA; CDIAG < 100pF 200 ns tOCD(OFF) OCD Turn-OFF Delay Time (9) IDIAG = 4mA; CDIAG < 100pF 100 ns ELECTRICAL CHARACTERISTICS (continued) (VS = 48V , Tamb = 25 °C , unless otherwise specified)
Figure 8. Output Current Regulation Waveforms These values allow a sufficient range of tOFF to implement the drive circuit for most motors. can not be smaller than the minimum on time tON(MIN).
0 Slow Decay Slow Decay
- For component values refer to Application Information section.
where CPUL should be chosen in the range 1nF … 100nF and RPUL in the range 20KΩ … 100KΩ . REF , which sets the speed of the motor. Figure 14. Tacho Operation Waveforms.
APPLICATION INFORMATION
A typical application using L6235 is shown in Figure 21. Typical component values for the application are shown in Table 3. A high quality ceramic capacitor (C2) in the range of 100nF to 200nF should be placed between the power pins VSA and VSB and ground near the L6235 to improve the high frequency filtering on the power supply and reduce high frequency transients generated by the switching. The capacitor (CEN ) connected from the EN input to ground sets the shut down time when an over current is detected (see Overcurrent Protection). The two current sensing inputs (SENSE A and SENSEB) should be connected to the sensing resistor RSENSE with a trace length as short as possible in the layout. The sense resistor should be non-inductive resistor to minimize the di/ dt transients across the resistor. To increase noise immunity, unused logic pins are best connected to 5V (High Logic Level) or GND (Low Logic Level) (see pin description). It is recommended to keep Power Ground and Signal Ground separated on PCB. Table 3. Component Values for Typical Application. Figure 21. Typical Application
DIM. mm inch A 3.60 0.141 a1 0.10 0.30 0.004 0.012 a2 3.30 0.130 a3 0 0.10 0 0.004 b 0.22 0.38 0.008 0.015 c 0.23 0.32 0.009 0.012 D (1) 15.80 16.00 0.622 0.630 D1 9.40 9.80 0.370 0.385 E 13.90 14.50 0.547 0.570 e 0.65 0.0256 e3 11.05 0.435 E1 (1) 10.90 11.10 0.429 0.437 E2 2.90 0.114 E3 5.80 6.20 0.228 0.244 E4 2.90 3.20 0.114 0.126 G 0 0.10 0 0.004 H 15.50 15.90 0.610 0.626 h 1.10 0.043 L 0.80 1.10 0.031 0.043 N1 0 °(max.) S8 °(max.) (1): "D" and "E1" do not include mold flash or protrusions - Mold flash or protrusions shall not exceed 0.15mm (0.006 inch) - Critical dimensions are "a3", "E" and "G". PowerSO36 e a2 A E PSO36MEC DETAIL A D 11 8 1936 E1E2 h x 45˚ DETAIL Alead sluga3 S Gage Plane 0.35 L DETAIL B DETAIL B (COPLANARITY) GC - C - SEATING PLANE c NN ¯ M0.12 ABb B A H BOTTOM VIEW OUTLINE AND MECHANICAL DATA
DIM. mm inch A 4.320 0.170 A1 0.380 0.015 A2 3.300 0.130 E 7.620 8.260 0.300 0.325 e 2.54 0.100 e1 7.620 0.300 L 3.180 3.430 0.125 0.135 M 0˚ min, 15˚ max. Powerdip 24 B eB1 D L A c SDIP24L M OUTLINE AND MECHANICAL DATA
DIM. mm inch A 2.35 2.65 0.093 0.104 A1 0.10 0.30 0.004 0.012 B 0.33 0.51 0.013 0.200 C 0.23 0.32 0.009 0.013 D (1) 15.20 15.60 0.598 0.614 E 7.40 7.60 0.291 0.299 e 1.27 0.050 H 10.0 10.65 0.394 0.419 h 0.25 0;75 0.010 0.030 L 0.40 1.27 0.016 0.050 k 0˚ (min.), 8˚ (max.) ddd 0.10 0.004 (1) “D” dimension does not include mold flash, protusions or gate burrs. Mold flash, protusions or gate burrs shall not exceed 0.15mm per side. SO24 0070769 C Weight: 0.60gr
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