L6227D

L6227 STMICROELECTRONICS | Alldatasheet

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Technical content

■ OPERATING SUPPLY VOLTAGE FROM 8 TO 52V ■ 2.8A OUTPUT PEAK CURRENT (1.4A DC) ■ R DS(ON) 0.73Ω TYP. VALUE @ Tj = 25 °C ■ OPERATING FREQUENCY UP TO 100KHz ■ NON DISSIPATIVE OVERCURRENT PROTECTION ■ DUAL INDEPENDENT CONSTANT t OFF PWM CURRENT CONTROLLERS ■ SLOW DECAY SYNCHRONOUS RECTIFICATION ■ CROSS CONDUCTION PROTECTION ■ THERMAL SHUTDOWN ■ UNDER VOLTAGE LOCKOUT ■ INTEGRATED FAST FREE WHEELING DIODES TYPICAL APPLICATIONS ■ BIPOLAR STEPPER MOTOR ■ DUAL DC MOTOR

DESCRIPTION

The L6227 is a DMOS Dual Full Bridge designed for motor control applications, realized in MultiPower- BCD technology, which combines isolated DMOS Power Transistors with CMOS and bipolar circuits on the same chip. The device also includes two inde- pendent constant off time PWM Current Controllers that performs the chopping regulation. Available in PowerDIP24 (20+2+2), PowerSO36 and SO24 (20+2+2) packages, the L6227 features a non-dissi- pative overcurrent protection on the high side Power MOSFETs and thermal shutdown. BLOCK DIAGRAM D99IN1085A GATE LOGIC OCD A OCD B OVER CURRENT DETECTION OVER CURRENT DETECTION GATE LOGIC VCP VBOOT EN A IN1A IN2A EN B IN1B IN2B VREF A VBOOT 5V10V VS A VSB OUT1 A OUT2 A OUT1 B OUT2 B SENSE A CHARGE PUMP VOLTAGE REGULATOR ONE SHOT MONOSTABLE MASKING TIME THERMAL PROTECTION VBOOT VBOOT 10V 10V BRIDGE A SENSE COMPARATOR BRIDGE B RC A SENSE B VREF B RC B PWM ORDERING NUMBERS: L6227N (PowerDIP24) L6227PD (PowerSO36) L6227D (SO24) PowerDIP24 (20+2+2) PowerSO36 SO24 (20+2+2) DMOS DUAL FULL BRIDGE DRIVER WITH PWM CURRENT CONTROLLER

RECOMMENDED OPERATING CONDITIONS Symbol Parameter Test conditions Value Unit VS Supply Voltage VSA = VSB = VS 60 V VOD Differential Voltage between VS A, OUT1A, OUT2A, SENSEA and VS B, OUT1B, OUT2B, SENSEB VSA = VSB = VS = 60V; VSENSEA = VSENSEB = GND 60 V VBOOT Bootstrap Peak Voltage VSA = VSB = VS VS + 10 V VIN,VEN Input and Enable Voltage Range -0.3 to +7 V VREFA , VREFB Voltage Range at pins VREFA and VREFB -0.3 to +7 V VRCA, VRCB Voltage Range at pins RCA and RC B -0.3 to +7 V VSENSEA, VSENSEB Voltage Range at pins SENSEA and SENSE B -1 to +4 V IS(peak) Pulsed Supply Current (for each VS pin), internally limited by the overcurrent protection VSA = VSB = VS; tPULSE < 1ms 3.55 A IS RMS Supply Current (for each VS pin) VSA = VSB = VS 1.4 A Tstg, TOP Storage and Operating Temperature Range -40 to 150 °C Symbol Parameter Test Conditions MIN MAX Unit VS Supply Voltage VSA = VSB = VS 85 2 V VOD Differential Voltage Between VS A, OUT1A, OUT2A, SENSEA and VS B, OUT1B, OUT2B, SENSEB VSA = VSB = VS; VSENSEA = VSENSEB 52 V VREFA , VREFB Voltage Range at pins VREFA and VREFB -0.1 5 V VSENSEA, VSENSEB Voltage Range at pins SENSEA and SENSE B (pulsed tW < trr) (DC) V V IOUT RMS Output Current 1.4 A Tj Operating Junction T emperature -25 +125 °C fsw Switching Frequency 100 KHz

PIN CONNECTIONS (Top View) (5) The slug is internally connected to pins 1,18,19 and 36 (GND pins). Symbol Description PowerDIP24 SO24 PowerSO36 Unit R th-j-pins Maximum Thermal Resistance Junction-Pins 19 15 - °C/W R th-j-case Maximum Thermal Resistance Junction-Case - - 2 °C/W R th-j-amb1 Maximum Thermal Resistance Junction-Ambient 1 (1) Mounted on a multi-layer FR4 PCB with a dissipating copper surface on the bottom side of 6cm2 (with a thickness of 35µm). 44 52 - °C/W R th-j-amb1 Maximum Thermal Resistance Junction-Ambient 2 (2) Mounted on a multi-layer FR4 PCB with a dissipating copper surface on the top side of 6cm2 (with a thickness of 35µm). -- 3 6 °C/W R th-j-amb1 Maximum Thermal Resistance Junction-Ambient 3 (3) Mounted on a multi-layer FR4 PCB with a dissipating copper surface on the top side of 6cm2 (with a thickness of 35µm), 16 via holes and a ground layer. -- 1 6 °C/W R th-j-amb2 Maximum Thermal Resistance Junction-Ambient 4 (4) Mounted on a multi-layer FR4 PCB without any heat sinking surface on the board. 59 78 63 °C/W PowerDIP24/SO24 PowerSO36 (5) GND GND OUT1 B RC B SENSE B IN2B IN1B VREF B VBOOT EN B OUT2 B VS B GND GND19 D02IN1346 IN1 A IN2A SENSE A RC A OUT1 A VS A OUT2 A VCP EN A VREF A GND N.C. N.C. VS A RC A OUT1 A N.C. N.C. N.C. N.C. N.C. OUT1 B RC B N.C. VS B N.C. N.C. GND 19GND GND D02IN1347 IN1A SENSE A IN2A SENSE B IN2B IN1B VREF A VREF B 10 27 OUT2 A EN A VCP EN B OUT2 B VBOOT N.C. N.C. 13 24

PIN # PIN # 1 10 IN1 A Logic input Bridge A Logic Input 1. 2 11 IN2 A Logic input Bridge A Logic Input 2. 3 12 SENSE A Power Supply Bridge A Source Pin. This pin must be connected to Power Ground through a sensing power resistor. 41 3 R C A RC Pin RC Network Pin. A parallel RC network connected between this pin and ground sets the Current Controller OFF-Time of the Bridge A. 5 15 OUT1 A Power Output Bridge A Output 1. 6, 7, 18, 19 1, 18, 19, 36 GND GND Signal Ground terminals. In Power DIP and SO packages, these pins are also used for heat dissipation toward the PCB. 8 22 OUT1 B Power Output Bridge B Output 1. 92 4 R C B RC Pin RC Network Pin. A parallel RC network connected between this pin and ground sets the Current Controller OFF-Time of the Bridge B. 10 25 SENSE B Power Supply Bridge B Source Pin. This pin must be connected to Power Ground through a sensing power resistor. 11 26 IN1 B Logic Input Bridge B Input 1 12 27 IN2 B Logic Input Bridge B Input 2 13 28 VREF B Analog Input Bridge B Current Controller Reference Voltage. Do not leave this pin open or connect to GND. 14 29 EN B Logic Input (6) Bridge B Enable. LOW logic level switches OFF all Power MOSFETs of Bridge B. This pin is also connected to the collector of the Overcurrent and Thermal Protection transistor to implement over current protection. If not used, it has to be connected to +5V through a resistor. 15 30 VBOOT Supply Voltage Bootstrap Voltage needed for driving the upper Power MOSFETs of both Bridge A and Bridge B. 16 32 OUT2 B Power Output Bridge B Output 2. 17 33 VS B Power Supply Bridge B Power Supply Voltage. It must be connected to the supply voltage together with pin VSA. 20 4 VS A Power Supply Bridge A Power Supply Voltage. It must be connected to the supply voltage together with pin VSB. 21 5 OUT2 A Power Output Bridge A Output 2. 22 7 VCP Output Charge Pump Oscillator Output.

(6) Also connected at the output drain of the Over current and Thermal protection MOSFET. Therefore, it has to be driven putting in series a resistor with a value in the range of 2.2KΩ - 180KΩ , recommended 100KΩ . 23 8 EN A Logic Input (6) Bridge A Enable. LOW logic level switches OFF all Power MOSFETs of Bridge A. This pin is also connected to the collector of the Overcurrent and Thermal Protection transistor to implement over current protection. If not used, it has to be connected to +5V through a resistor. 24 9 VREF A Analog Input Bridge A Current Controller Reference Voltage. Do not leave this pin open or connect to GND.

ELECTRICAL CHARACTERISTICS

(Tamb = 25 °C, Vs = 48V, unless otherwise specified) Symbol Parameter Test Conditions Min Typ Max Unit VSth(ON) Turn-on Threshold 5.8 6.3 6.8 V VSth(OFF) Turn-off Threshold 5 5.5 6 V IS Quiescent Supply Current All Bridges OFF; Tj = -25°C to 125°C (7) 51 0 m A Tj(OFF) Thermal Shutdown Temperature 165 °C Output DMOS Transistors R DS(ON) High-Side +Low-Side Switch ON Resistance Tj = 25 °C 1.47 1.69 Ω Tj =125 °C (7) 2.35 2.7 Ω IDSS Leakage Current EN = Low; OUT = V S 2m A EN = Low; OUT = GND -0.3 mA Source Drain Diodes VSD Forward ON Voltage I SD = 1.4A, EN = LOW 1.15 1.3 V trr Reverse Recovery Time I f = 1.4A 300 ns tfr Forward Recovery Time 200 ns Logic Input VIL Low level logic input voltage -0.3 0.8 V VIH High level logic input voltage 2 7 V IIL Low Level Logic Input Current GND Logic Input Voltage -10 µA IIH High Level Logic Input Current 7V Logic Input Voltage 10 µA Vth(ON) Turn-on Input Threshold 1.8 2.0 V Vth(OFF) Turn-off Input Threshold 0.8 1.3 V Vth(HYS) Input Threshold Hysteresis 0.25 0.5 V Switching Characteristics tD(on)EN Enable to out turn ON delay time (8) ILOAD =1.4A, Resistive Load 500 800 ns PIN DESCRIPTION (continued)

(7) Tested at 25°C in a restricted range and guaranteed by characterization. (8) See Fig. 1. (9) Measured applying a voltage of 1V to pin SENSE and a voltage drop from 2V to 0V to pin VREF. (10) See Fig. 2. tD(on)IN Input to out turn ON delay timeILOAD =1.4A, Resistive Load (dead time included) 1.9 µs tRISE Output rise time(8) ILOAD =1.4A, Resistive Load 40 250 ns tD(off)EN Enable to out turn OFF delay time (8) ILOAD =1.4A, Resistive Load 500 800 1000 ns tD(off)IN Input to out turn OFF delay timeILOAD =1.4A, Resistive Load 500 800 1000 ns tFALL Output Fall Time (8) ILOAD =1.4A, Resistive Load 40 250 ns tdt Dead Time Protection 0.5 1 µs fCP Charge pump frequency -25°C<Tj <125°C 0.6 1 MHz PWM Comparator and Monostable IRCA, IRCB Source Current at pins RCA and RC B VRCA = VRCB = 2.5V 3.5 5.5 mA Voffset Offset Voltage on Sense Comparator VREFA, VREFB = 0.5V ±5 mV tPROP Turn OFF Propagation Delay (9) 500 ns tBLANK Internal Blanking Time on SENSE pins 1µ s tON(MIN) Minimum On Time 2.5 3 µs tOFF PWM Recirculation Time R OFF = 20KΩ; C OFF = 1nF 13 µs R OFF = 100KΩ; C OFF = 1nF 61 µs IBIAS Input Bias Current at pins VREFA and VREF B 10 µA Over Current Protection ISOVER Input Supply Overcurrent Protection Threshold Tj = -25°C to 125°C (7) 2 2.8 3.55 A R OPDR Open Drain ON Resistance I = 4mA 40 60 Ω tOCD(ON) OCD Turn-on Delay Time (10) I = 4mA; CEN < 100pF 200 ns tOCD(OFF) OCD Turn-off Delay Time (10) I = 4mA; CEN < 100pF 100 ns ELECTRICAL CHARACTERISTICS (continued) (Tamb = 25 °C, Vs = 48V, unless otherwise specified) Symbol Parameter Test Conditions Min Typ Max Unit

Figure 8. Output Current Regulation Waveforms These values allow a sufficient range of tOFF to implement the drive circuit for most motors.

0 Slow Decay Slow Decay

Figure 13. Overcurrent Protection Waveforms

APPLICATION INFORMATION

A typical application using L6227 is shown in Fig. 16. Typical component values for the application are shown in Table 3. A high quality ceramic capacitor in the range of 100 to 200 nF should be placed between the power pins (VSA and VSB) and ground near the L6227 to improve the high frequency filtering on the power supply and reduce high frequency transients generated by the switching. The capacitors connected from the ENA and ENB inputs to ground set the shut down time for the BrgidgeA and BridgeB respectively when an over current is de- tected (see Overcurrent Protection). The two current sensing inputs (SENSE A and SENSEB) should be connect- ed to the sensing resistors with a trace length as short as possible in the layout. The sense resistors should be non-inductive resistors to minimize the di/dt transients across the resistor. To increase noise immunity, unused logic pins (except EN A and ENB) are best connected to 5V (High Logic Level) or GND (Low Logic Level) (see pin description). It is recommended to keep Power Ground and Signal Ground separated on PCB. Table 2. Component Values for Typical Application Figure 16. Typical Application

DIM. mm inch A 3.60 0.141 a1 0.10 0.30 0.004 0.012 a2 3.30 0.130 a3 0 0.10 0 0.004 b 0.22 0.38 0.008 0.015 c 0.23 0.32 0.009 0.012 D (1) 15.80 16.00 0.622 0.630 D1 9.40 9.80 0.370 0.385 E 13.90 14.50 0.547 0.570 e 0.65 0.0256 e3 11.05 0.435 E1 (1) 10.90 11.10 0.429 0.437 E2 2.90 0.114 E3 5.80 6.20 0.228 0.244 E4 2.90 3.20 0.114 0.126 G 0 0.10 0 0.004 H 15.50 15.90 0.610 0.626 h 1.10 0.043 L 0.80 1.10 0.031 0.043 N1 0 °(max.) S8 °(max.) (1): "D" and "E1" do not include mold flash or protrusions - Mold flash or protrusions shall not exceed 0.15mm (0.006 inch) - Critical dimensions are "a3", "E" and "G". PowerSO36 e a2 A E PSO36MEC DETAIL A D 11 8 1936 E1E2 h x 45˚ DETAIL Alead sluga3 S Gage Plane 0.35 L DETAIL B DETAIL B (COPLANARITY) GC - C - SEATING PLANE c NN ¯ M0.12 ABb B A H BOTTOM VIEW OUTLINE AND MECHANICAL DATA

DIM. mm inch A 4.320 0.170 A1 0.380 0.015 A2 3.300 0.130 E 7.620 8.260 0.300 0.325 e 2.54 0.100 e1 7.620 0.300 L 3.180 3.430 0.125 0.135 M 0˚ min, 15˚ max. Powerdip 24 B eB1 D L A c SDIP24L M OUTLINE AND MECHANICAL DATA

DIM. mm inch A 2.35 2.65 0.093 0.104 A1 0.10 0.30 0.004 0.012 B 0.33 0.51 0.013 0.200 C 0.23 0.32 0.009 0.013 D (1) 15.20 15.60 0.598 0.614 E 7.40 7.60 0.291 0.299 e 1.27 0.050 H 10.0 10.65 0.394 0.419 h 0.25 0;75 0.010 0.030 L 0.40 1.27 0.016 0.050 k 0˚ (min.), 8˚ (max.) ddd 0.10 0.004 (1) “D” dimension does not include mold flash, protusions or gate burrs. Mold flash, protusions or gate burrs shall not exceed 0.15mm per side. SO24 0070769 C Weight: 0.60gr

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