L6208PD

L6208 STMICROELECTRONICS | Alldatasheet

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Technical content

■ OPERATING SUPPLY VOLTAGE FROM 8 TO 52V ■ 5.6A OUTPUT PEAK CURRENT (2.8A RMS) ■ R DS(ON) 0.3Ω TYP. VALUE @ Tj = 25°C ■ OPERATING FREQUENCY UP TO 100KHz ■ NON DISSIPATIVE OVERCURRENT PROTECTION ■ DUAL INDEPENDENT CONSTANT t OFF PWM CURRENT CONTROLLERS ■ FAST/SLOW DECAY MODE SELECTION ■ FAST DECAY QUASI-SYNCHRONOUS RECTIFICATION ■ DECODING LOGIC FOR STEPPER MOTOR FULL AND HALF STEP DRIVE ■ CROSS CONDUCTION PROTECTION ■ THERMAL SHUTDOWN ■ UNDER VOLTAGE LOCKOUT ■ INTEGRATED FAST FREE WHEELING DIODES TYPICAL APPLICATIONS ■ BIPOLAR STEPPER MOTOR

DESCRIPTION

The L6208 is a DMOS Fully Integrated Stepper Motor Driver with non-dissipative Overcurrent Protection, realized in MultiPower-BCD technology, which com- bines isolated DMOS Power Transistors with CMOS and bipolar circuits on the same chip. The device in- cludes all the circuitry needed to drive a two-phase bipolar stepper motor including: a dual DMOS Full Bridge, the constant off time PWM Current Controller that performs the chopping regulation and the Phase Sequence Generator, that generates the stepping sequence. Available in PowerDIP24 (20+2+2), PowerSO36 and SO24 (20+2+2) packages, the L6208 features a non-dissipative overcurrent protec- tion on the high side Power MOSFETs and thermal shutdown. BLOCK DIAGRAM GATE LOGIC STEPPING SEQUENCE GENERATION OVER CURRENT DETECTION OVER CURRENT DETECTION GATE LOGIC VCP VBOOT EN CONTROL CW/CCW VREF A VBOOT 5V10V VS A VS B OUT1 A OUT2 A OUT1 B OUT2 B SENSE A CHARGE PUMP VOLTAGE REGULATOR ONE SHOT MONOSTABLE MASKING TIME THERMAL PROTECTION VBOOT VBOOT OCD B OCD A 10V 10V BRIDGE A SENSE COMPARATOR BRIDGE B D01IN1225 RC A SENSE B VREF B RC B HALF/FULL CLOCK RESET PWM ORDERING NUMBERS: L6208N (PowerDIP24) L6208PD (PowerSO36) L6208D (SO24) PowerDIP24 (20+2+2) PowerSO36 SO24 (20+2+2) DMOS DRIVER FOR BIPOLAR STEPPER MOTOR

RECOMMENDED OPERATING CONDITIONS Symbol Parameter Test conditions Value Unit VS Supply Voltage VSA = VSB = VS 60 V VOD Differential Voltage between VS A, OUT1A, OUT2A, SENSEA and VS B, OUT1B, OUT2B, SENSEB VSA = VSB = VS = 60V; VSENSEA = VSENSEB = GND 60 V VBOOT Bootstrap Peak Voltage VSA = VSB = VS VS + 10 V VIN,VEN Input and Enable Voltage Range -0.3 to +7 V VREFA , VREFB Voltage Range at pins VREFA and VREFB -0.3 to +7 V VRCA, VRCB Voltage Range at pins RCA and RC B -0.3 to +7 V VSENSEA, VSENSEB Voltage Range at pins SENSEA and SENSE B -1 to +4 V IS(peak) Pulsed Supply Current (for each VS pin), internally limited by the overcurrent protection VSA = VSB = VS; tPULSE < 1ms 7.1 A IS RMS Supply Current (for each VS pin) VSA = VSB = VS 2.8 A Tstg, TOP Storage and Operating Temperature Range -40 to 150 °C Symbol Parameter Test Conditions MIN MAX Unit VS Supply Voltage VSA = VSB = VS 85 2 V VOD Differential Voltage Between VS A, OUT1A, OUT2A, SENSEA and VS B, OUT1B, OUT2B, SENSEB VSA = VSB = VS; VSENSEA = VSENSEB 52 V VREFA , VREFB Voltage Range at pins VREFA and VREFB -0.1 5 V VSENSEA, VSENSEB Voltage Range at pins SENSEA and SENSE B (pulsed tW < trr) (DC) V V IOUT RMS Output Current 2.8 A Tj Operating Junction T emperature -25 +125 °C fsw Switching Frequency 100 KHz

PIN CONNECTIONS (Top View) (5) The slug is internally connected to pins 1,18,19 and 36 (GND pins). Symbol Description PowerDIP24 SO24 PowerSO36 Unit R th-j-pins Maximum Thermal Resistance Junction-Pins 18 14 - °C/W R th-j-case Maximum Thermal Resistance Junction-Case - - 1 °C/W R th-j-amb1 Maximum Thermal Resistance Junction-Ambient (1) (1) Mounted on a multi-layer FR4 PCB with a dissipating copper surface on the bottom side of 6cm2 (with a thickness of 35µm). 43 51 - °C/W R th-j-amb1 Maximum Thermal Resistance Junction-Ambient (2) (2) Mounted on a multi-layer FR4 PCB with a dissipating copper surface on the top side of 6cm2 (with a thickness of 35µm). -- 3 5 °C/W R th-j-amb1 Maximum Thermal Resistance Junction-Ambient (3) (3) Mounted on a multi-layer FR4 PCB with a dissipating copper surface on the top side of 6cm2 (with a thickness of 35µm), 16 via holes and a ground layer. -- 1 5 °C/W R th-j-amb2 Maximum Thermal Resistance Junction-Ambient (4) (4) Mounted on a multi-layer FR4 PCB without any heat sinking surface on the board. 58 77 62 °C/W GND GND OUT1 B RC B SENSE B HALF/FULL VREF B CONTROL VBOOT EN OUT2 B VS B GND GND19 D99IN1083 CLOCK CW/CCW SENSE A RC A OUT1 A VS A OUT2 A VCP RESET VREF A GND N.C. N.C. VS A RC A OUT1 A N.C. N.C. N.C. N.C. N.C. OUT1 B RC B N.C. VS B N.C. N.C. GND 19GND GND D99IN1084 CLOCK SENSE A CW/CCW SENSE B HALF/FULL VREF B VREF A CONTROL 10 27 OUT2 A RESET VCP EN OUT2 B VBOOT N.C. N.C. 13 24 PowerDIP24/SO24 PowerSO36 (5)

PIN # PIN # 1 10 CLOCK Logic Input Step Clock input. The state machine makes one step on each rising edge. 2 11 CW/CCW Logic Input Selects the direction of the rotation. HIGH logic level sets clockwise direction, whereas LOW logic level sets counterclockwise direction. If not used, it has to be connected to GND or +5V. 3 12 SENSE A Power Supply Bridge A Source Pin. This pin must be connected to Power Ground through a sensing power resistor. 41 3 R C A RC Pin RC Network Pin. A parallel RC network connected between this pin and ground sets the Current Controller OFF-Time of the Bridge A. 5 15 OUT1 A Power Output Bridge A Output 1. 6, 7, 18, 19 1, 18, 19, 36 GND GND Ground terminals. In PowerDIP24 and SO24 packages, these pins are also used for heat dissipation toward the PCB. On PowerSO36 package the slug is connected to these pins. 8 22 OUT1 B Power Output Bridge B Output 1. 92 4 R C B RC Pin RC Network Pin. A parallel RC network connected between this pin and ground sets the Current Controller OFF-Time of the Bridge B. 10 25 SENSE B Power Supply Bridge B Source Pin. This pin must be connected to Power Ground through a sensing power resistor. 11 26 VREF B Analog Input Bridge B Current Controller Reference Voltage. Do not leave this pin open or connected to GND. 12 27 HALF/FULL Logic Input Step Mode Selector. HIGH logic level sets HALF STEP Mode, LOW logic level sets FULL STEP Mode. If not used, it has to be connected to GND or +5V. 13 28 CONTROL Logic Input Decay Mode Selector. HIGH logic level sets SLOW DECAY Mode. LOW logic level sets FAST DECAY Mode. If not used, it has to be connected to GND or +5V. 14 29 EN Logic Input (6) Chip Enable. LOW logic level switches OFF all Power MOSFETs of both Bridge A and Bridge B. This pin is also connected to the collector of the Overcurrent and Thermal Protection to implement over current protection. If not used, it has to be connected to +5V through a resistor. 15 30 VBOOT Supply Voltage Bootstrap Voltage needed for driving the upper Power MOSFETs of both Bridge A and Bridge B. 16 32 OUT2 B Power Output Bridge B Output 2. 17 33 VS B Power Supply Bridge B Power Supply Voltage. It must be connected to the Supply Voltage together with pin VSA 20 4 VS A Power Supply Bridge A Power Supply Voltage. It must be connected to the Supply Voltage together with pin VSB

(6) Also connected at the output drain of the Over current and Thermal protection MOSFET. Therefore, it has to be driven putting in series a resistor with a value in the range of 2.2KΩ - 180KΩ , recommended 100KΩ. PACKAGE Name Type FunctionSO24/ PowerDIP24 PowerSO36 PIN # PIN # 21 5 OUT2 A Power Output Bridge A Output 2. 22 7 VCP Output Charge Pump Oscillator Output. 23 8 RESET Logic Input Reset Pin. LOW logic level restores the Home State (State 1) on the Phase Sequence Generator State Machine. If not used, it has to be connected to +5V. 24 9 VREF A Analog Input Bridge A Current Controller Reference Voltage. Do not leave this pin open or connected to GND.

ELECTRICAL CHARACTERISTICS

(Tamb = 25°C, Vs = 48V, unless otherwise specified) Symbol Parameter Test Conditions Min Typ Max Unit VSth(ON) Turn-on Threshold 6.6 7 7.4 V VSth(OFF) Turn-off Threshold 5.6 6 6.4 V IS Quiescent Supply Current All Bridges OFF; Tj = -25°C to 125°C (7) 51 0 m A Tj(OFF) Thermal Shutdown Temperature 165 °C Output DMOS Transistors R DS(ON) High-Side Switch ON Resistance Tj = 25 °C 0.34 0.4 Ω Tj =125 °C (7) 0.53 0.59 Ω Low-Side Switch ON Resistance Tj = 25 °C 0.28 0.34 Ω Tj =125 °C (7) 0.47 0.53 Ω IDSS Leakage Current EN = Low; OUT = V S 2m A EN = Low; OUT = GND -0.15 mA Source Drain Diodes VSD Forward ON Voltage I SD = 2.8A, EN = LOW 1.15 1.3 V trr Reverse Recovery Time I f = 2.8A 300 ns tfr Forward Recovery Time 200 ns Logic Inputs (EN, CONTROL, HALF/FULL, CLOCK, RESET, CW/CCW) VIL Low level logic input voltage -0.3 0.8 V VIH High level logic input voltage 2 7 V PIN DESCRIPTION (continued)

IIL Low Level Logic Input Current GND Logic Input Voltage -10 µA IIH High Level Logic Input Current 7V Logic Input Voltage 10 µA Vth(ON) Turn-on Input Threshold 1.8 2.0 V Vth(OFF) Turn-off Input Threshold 0.8 1.3 V Vth(HYS) Input Threshold Hysteresis 0.25 0.5 V Switching Characteristics tD(ON)EN Enable to Output Turn-on Delay Time (8) ILOAD =2.8A, Resistive Load 100 250 400 ns tD(OFF)EN Enable to Output T urn-off Delay Time (8) ILOAD =2.8A, Resistive Load 300 550 800 ns tRISE Output Rise Time (8) ILOAD =2.8A, Resistive Load 40 250 ns tFALL Output Fall Time (8) ILOAD =2.8A, Resistive Load 40 250 ns tDCLK Clock to Output Delay Time (9) ILOAD =2.8A, Resistive Load 2 µs tCLK(min)L Minimum Clock Time (10) 1µ s tCLK(min) H Minimum Clock Time (10) 1µ s fCLK Clock Frequency 100 KHz tS(MIN) Minimum Set-up Time (11) 1µ s tH(MIN) Minimum Hold Time (11) 1µ s tR(MIN) Minimum Reset Time (11) 1µ s tRCLK(MIN Minimum Reset to Clock Delay Time (11) 1µ s tDT Dead Time Protection 0.5 1 µs fCP Charge Pump Frequency Tj = -25°C to 125°C (7) 0.6 1 MHz PWM Comparator and Monostable IRCA, IRCB Source Current at pins RCA and RC B VRCA = VRCB = 2.5V 3.5 5.5 mA Voffset Offset Voltage on Sense Comparator VREFA, VREFB = 0.5V ±5 mV tPROP Turn OFF Propagation Delay (12) 500 ns tBLANK Internal Blanking Time on SENSE pins 1µ s tON(MIN) Minimum On Time 1.5 2 µs ELECTRICAL CHARACTERISTICS (continued) (Tamb = 25°C, Vs = 48V, unless otherwise specified) Symbol Parameter Test Conditions Min Typ Max Unit

(7) Tested at 25°C in a restricted range and guaranteed by characterization. (12) Measured applying a voltage of 1V to pin SENSE and a voltage drop from 2V to 0V to pin VREF. Figure 1. Switching Characteristic Definition

Figure 5. Overcurrent Detection Timing Definition supply voltage is in the range from 8V to 12V (see Fig. 34 and 35). circuit are shown in Table 1. Table 1. Charge Pump External Components Values

monostable time plus the dead time. Figure 10. PWM Current Controller Simplified Schematic the output stage configuration are included in the next section. comparator output so that this current spike cannot prematurely re-trigger the monostable.

2 PHASE

APPLICATION INFORMATION

A typical Bipolar Stepper Motor Driver application using L6208 is shown in Fig. 23. Typical component values for the application are shown in Table 2. A high quality ceramic capacitor in the range of 100 to 200 nF should be placed between the power pins (VS A and VSB) and ground near the L6208 to improve the high frequency filtering on the power supply and reduce high frequency transients generated by the switching. The capacitor connected from the EN input to ground sets the shut down time when an over current is detected (see Overcur- rent Protection). The two current sensing inputs (SENSE A and SENSE B) should be connected to the sensing resistors with a trace length as short as possible in the layout. The sense resistors should be non-inductive re- sistors to minimize the di/dt transients across the resistor. To increase noise immunity, unused logic pins (except EN) are best connected to 5V (High Logic Level) or GND (Low Logic Level) (see pin description). It is recom- mended to keep Power Ground and Signal Ground separated on PCB. Table 2. Component Values for Typical Application Figure 23. Typical Application

DIM. mm inch A 3.60 0.141 a1 0.10 0.30 0.004 0.012 a2 3.30 0.130 a3 0 0.10 0 0.004 b 0.22 0.38 0.008 0.015 c 0.23 0.32 0.009 0.012 D (1) 15.80 16.00 0.622 0.630 D1 9.40 9.80 0.370 0.385 E 13.90 14.50 0.547 0.570 e 0.65 0.0256 e3 11.05 0.435 E1 (1) 10.90 11.10 0.429 0.437 E2 2.90 0.114 E3 5.80 6.20 0.228 0.244 E4 2.90 3.20 0.114 0.126 G 0 0.10 0 0.004 H 15.50 15.90 0.610 0.626 h 1.10 0.043 L 0.80 1.10 0.031 0.043 N1 0 °(max.) S8 °(max.) (1): "D" and "E1" do not include mold flash or protrusions - Mold flash or protrusions shall not exceed 0.15mm (0.006 inch) - Critical dimensions are "a3", "E" and "G". PowerSO36 e a2 A E PSO36MEC DETAIL A D 11 8 1936 E1E2 h x 45˚ DETAIL Alead sluga3 S Gage Plane 0.35 L DETAIL B DETAIL B (COPLANARITY) GC - C - SEATING PLANE c NN ¯ M0.12 ABb B A H BOTTOM VIEW OUTLINE AND MECHANICAL DATA

DIM. mm inch A 4.320 0.170 A1 0.380 0.015 A2 3.300 0.130 E 7.620 8.260 0.300 0.325 e 2.54 0.100 e1 7.620 0.300 L 3.180 3.430 0.125 0.135 M 0˚ min, 15˚ max. Powerdip 24 B eB1 D L A c SDIP24L M OUTLINE AND MECHANICAL DATA

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners © 2003 STMicroelectronics - All rights reserved STMicroelectronics GROUP OF COMPANIES Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States L6208 OUTLINE AND MECHANICAL DATA DIM. mm inch A 2.35 2.65 0.093 0.104 A1 0.10 0.30 0.004 0.012 B 0.33 0.51 0.013 0.200 C 0.23 0.32 0.009 0.013 D (1) 15.20 15.60 0.598 0.614 E 7.40 7.60 0.291 0.299 e 1.27 0.050 H 10.0 10.65 0.394 0.419 h 0.25 0;75 0.010 0.030 L 0.40 1.27 0.016 0.050 k 0˚ (min.), 8˚ (max.) ddd 0.10 0.004 (1) “D” dimension does not include mold flash, protusions or gate burrs. Mold flash, protusions or gate burrs shall not exceed 0.15mm per side. SO24 0070769 C Weight: 0.60gr

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners © 2003 STMicroelectronics - All rights reserved STMicroelectronics GROUP OF COMPANIES Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States L6208