L6206_V01 STMICROELECTRONICS | Alldatasheet
Document overview
- Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
- PDF pages: 29
Technical content
Datasheet sections
- 1 Block diagram
- 2 Maximum ratings
- 3 Pin connections
- 4 Electrical characteristics
- 5 Circuit description
- 5.1 Power stages and charge pump
- 5.2 Logic inputs
- 5.3 Non-dissipative overcurrent detection and protection
- 5.4 Thermal protection
- 6 Application information
- 6.1 Paralleled operation
- 6.2 Output current capability and IC power dissipation
- 6.3 Thermal management
- 7 Package information
- 7.1 PowerSO36 package information
- 7.2 SO24 package information
- 8 Revision history
Features
Operating supply voltage from 8 to 52 V 5.6 A output peak current (2.8 A DC) RDS(ON) 0.3 typ. value at Tj = 25 °C Operating frequency up to 100 KHz Programmable high-side overcurrent detection and protection Diagnostic output Paralleled operation Cross conduction protection Thermal shutdown Undervoltage lockout Integrated fast freewheeling diodes
Applications
Bipolar stepper motor Dual or quad DC motor
Description
The L6206 device is a DMOS dual full bridge designed for motor control applications, realized in BCD technology, which combines isolated DMOS power transistors with CMOS and bipolar circuits on the same chip. Available in the PowerSO36 and SO24 (20 + 2 + 2) packages, the L6206 device features thermal shutdown and a non-dissipative overcurrent detection on the high- side power MOSFETs plus a diagnostic output that can be easily used to implement the overcurrent protection. 2UGHULQJQXPEHUV 3RZHU',3 /3' 3RZHU62 3RZHU62
1 Block diagram
Figure 1. Block diagram
2 Maximum ratings
Table 1. Absolute maximum ratings Table 2. Recommended operating conditions
Table 3. Thermal data
- Mounted on a multilayer FR4 PCB with a dissipa ting copper surface on the bottom side of 6 cm2
(with a thickness of 35 µm).
- Mounted on a multilayer FR4 PCB with a dissi pating copper surface on the top side of 6 cm2
(with a thickness of 35 µm).
- Mounted on a multilayer FR4 PCB with a dissi pating copper surface on the top side of 6 cm2
(with a thickness of 35 µm), 16 via holes and a ground layer.
- Mounted on a multilayer FR4 PCB without any heatsinking surface on the board.
3 Pin connections
Figure 2. Pin connections (top view)
- The slug is internally connected to pins 1, 18, 19 and 36 (GND pins).
Table 4. Pin description 11 0 I N 1 A Logic input Bridge A logic input 1. 21 1 I N 2 A Logic input Bridge A logic input 2. detected or in case of thermal protection. 51 5 O U T 1 A Power output Bridge A output 1. 82 2 O U T 1 B Power output Bridge B output 1.
detected or in case of thermal protection. all power MOSFETs of Bridge B. If not used, it has to be connected to +5 V. power MOSFETs of both bridge A and bridge B. 16 32 OUT2 B Power output Bridge B output 2. 21 5 OUT2 A Power output Bridge A output 2. 22 7 VCP Output Charge pump oscillator output. all power MOSFETs of bridge A. If not used, it has to be connected to +5 V. Table 4. Pin description (continued)
4 Electrical characteristics
Table 5. Electrical characteristics (Tamb = 25 °C, Vs = 48 V, unless otherwise specified)
Figure 3. Switching characteristic definition
- Tested at 25 °C in a restricted range and guaranteed by characterization.
- See Figure 3: Switching characteristic definition.
- See Figure 4: Overcurrent detection timing definition.
Table 5. Electrical characteristics (Tamb = 25 °C, Vs = 48 V, unless otherwise specified) (continued)
Figure 4. Overcurrent detection timing definition
5 Circuit description
5.1 Power stages and charge pump
and switch on of two power MOS in one leg of a bridge. Figure 5. Charge pump circuit Table 6. Charge pump external components values
5.2 Logic inputs
respectively Vth(ON) = 1.8 V and Vth(OFF) = 1.3 V. Figure 7. If the driver is a standard push-pull structure, the resistor REN and the capacitor overcurrent detection and protection. Figure 6. Logic inputs internal structure Figure 7. ENA and ENB pins open collector driving Figure 8. ENA and ENB pins push-pull driving
5.3 Non-dissipative overcurrent detection and protection
In addition to the PWM current control, an overcurrent detection circuit (OCD) is integrated. overcurrent detection circuit for the bridge A. Bridge B is provided of an analogous circuit. capability of 4 mA connected to OCD pin is turned on. Figure 10 shows the OCD operation. magnitude is reported in Figure 13. Table 7. Truth table
- High Z = high impedance output.
delay time and the REN value should be chosen according to the desired disable time. Figure 9. Overcurrent protection simplified schematic
Figure 12. tDISABLE versus CEN and REN (VDD = 5 V) Figure 13. tDELAY versus CEN (VDD = 5 V)
5.4 Thermal protection
off when the junction temperature reaches 165 °C (typ. value) with 15 °C hysteresis (typ.
6 Application information
recommended to keep power ground and signal ground separated on the PCB. Figure 14. Typical application (with reference to 24-pin packages) Table 8. Component values for typical application
6.1 Paralleled operation
bridge in parallel does not increase the overcurrent detection threshold. Figure 15. The current in the two devices connected in parallel will share very well since the DS(ON) of the devices on the same die is well matched. CLA or RCLB in Figure 15. It is recommended to use RCLA = RCLB. Figure 15. Parallel connection for higher current (with reference to 24-pin packages)
6.2 Output current capabilit y and IC power dissipation
One full bridge ON at a time (Figure 18) in which only one load at a time is energized. Figure 18. IC power dissipation versus output current with one full bridge ON Figure 19. IC power dissipation versus output current with two full bridges ON
6.3 Thermal management
junction to ambient thermal resistance values for the PowerSO36 and SO24 packages. Figure 20. Mounting the PowerSO package Figure 21. PowerSO36 junction ambient thermal resistance versus on-board copper
Figure 22. SO24 junction ambient thermal resistance versus on-board copper area
7 Package information
specifications, grade definitions and product status are available at: www.st.com.
7.1 PowerSO36 package information
Figure 29. PowerSO36 package outline
Table 9. PowerSO36 package mechanical data
- “D” and “E1” do not include mold flash or protrusions.
- Mold flash or protrusions shall not exceed 0.15 mm (0.006 inch).
- Critical dimensions are “a3”, “E” and “G”.
7.2 SO24 package information
Figure 30. SO24 package outline Table 10. SO24 package mechanical data
- “D” dimension does not include mold fl ash, protrusions or gate burrs. Mold flash, protrusions or gate burrs
shall not exceed 0.15 mm per side.
8 Revision history
Table 11. Document revision history 03-Sep-2003 1 Initial release. from “MultiPower-BCD technology”). and moved Figure 1: Block diagram from page 1 to page 3). below Figure 2, added title to Table 4: Pin description. title and number to Table 5, renumbered notes 1 to 3 below Table 5. Renumbered Figure 3 and Figure 4. Table 6. Renumbered Figure 5 to Figure 13. . header to Table 8. Renumbered Figure 14 to Figure 29. SO24 package outline, reversed order of named tables and figures. Added cross-references throughout document. Added Section 8: Revision history and Table 12. Minor modifications throughout document. Updated Table 8 on page 17 (removed CREF row). Updated Figure 14 on page 17 (replaced by new figure and title). on page 20 [added “(with reference to 24-pin packages)” to titles]. Minor modifications throughout document. Removed PowerDIP24 package from the whole document. Removed “Tj“ from Table 2 on page 4. Minor modifications throughout document.