L6204 STMICROELECTRONICS | Alldatasheet

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DMOS DUAL FULL BRIDGE DRIVER ADVANCE DATA SUPPLY VOLTAGE UP TO 48V R DS(ON) 1.2Ω (25°C) CROSS CONDUCTION PROTECTION THERMAL SHUTDOWN 0.5A DC CURRENT TTL/CMOS COMPATIBLE DRIVER HIGH EFFICIENCY CHOPPING

DESCRIPTION

The L6204 is a dual full bridge driver for motor control applications realized in BCD technology which combines isolated DMOS power transistors with CMOS and Bipolar circuits on the same chip. By using mixed technology it has been possible to optimize the logic circuitry and the power stage to achieve the best possible performance. The logic inputs are TTL/CMOS compatible. Both channels are controlled by a separate Enable. Each bridge has a sense resistor to control the currenrt level. The L6204 is mounted in an 20-lead Powerdip and SO 24+2+2 packages and the four center pins are used to conduct heat to the PCB. At nor- mal operating temperatures no external heatsink is required. This is advanced information on a new product now in development or undergoing evaluation. Details are subject to change without notice. March 1994 BLOCK DIAGRAM Powerdip 16+2+2 SO 24+2+2 ORDERING NUMBERS: L6204 L6204D MULTIPOWER BCD TECHNOLOGY

(*) DIP Pin Symbols Functions SENSE 1 IN1 ENABLE 1 OUT 1 GND GND OUT 3 ENABLE 2 IN 3 SENSE 2 BOOSTRAP OSC. VCP IN 4 OUT 4 V S 2 GND GND VS 1 OUT 2 IN 2 VBOOT Sense resistor to provide the feedback for motor current control of the bridge A Digital input from the motor controller (bridge A) A logic level low on this pin disable the bridge A Output of one half bridge of the bridge A Common Power Ground Common Power Ground Ouput of one half bridge of the bridge B A logic level low on this pin disable the bridge B Digital input from the motor controller (bridge B) Sense resistor to provide the feedback for motor current control of the bridge B Oscillator output for the external charge pump Digital input from the motor controller (bridge B) Output of one half bridge of the bridge B Supply voltage bridge B Common Power Ground Common Power Ground Supply Voltage bridge A Output of one half bridge of the bridge A Digital input from the motor controller (bridge A) Overvoltage input for driving of the upper DMOS (*) For SO package the pins 4, 5, 10, 11, 18, 19, 24 and 25 are not connected. ABSOLUTE MAXIMUM RATINGS Symbol Parameter Test Conditions Unit VS Supply Voltage 50 V VIN,VEN Input or Enable Voltage Range -0.3 to +7 V Io Pulsed Output Current 3 A VSENSE Sensing Voltage -1 to 4 V VBOOT Bootstrap Supply 60 V Ptot Total power dissipation: (Tpins=8 0°C) Total power dissipation:(Tamb =7 0°C no copper area on PCB) Total power dissipation:(Tamb =7 0°C 8cm2 copper area on PCB) 1.23 W W W Tstg,Tj Storage and Junction Temperature -40 to 150 °C PIN CONNECTIONS (Top view) POWERDIP SO24+2+2 L6204

Symbol Description SO DIP Unit R th j-pins R th j-amb Thermal Resistance Junction-pins Thermal Resistance Junction-ambient Max Max °C/W °C/W ELECTRICAL CHARACTERISTICS (VS = 42V, Tj=2 5°C unless otherwise specified) Symbol Parameter Test Condition Min. Typ. Max. Unit VS Supply Voltage 12 48 V IS Total Quiescent Current EN1=EN2=H; IN1=IN2=IN3=IN4=L EN1 = EN2 = L mA mA fC Commutation Frequency 20 KHz TJ Thermal Shutdown 150 °C Td Dead Time Protection 500 ns TRANSISTORS IDSS Leakage Current OFF 1 mA R DS On Resistance ON 1.2 Ω LOGIC LEVELS VINL,VENL Input Low Voltage -0.3 0.8 V VINH,VENH Input High Voltage 2 7 V IINL,IENL Input Low Current IN1=IN2 =IN3 =IN4=EN1 =EN2=L -10 µA IINH,IENH Input High Current IN1=IN2 =IN3 =IN4=EN1 =EN2=H 50 µA THERMAL DATA APPLICATION DIAGRAM L6204

The last contribution to the energy dissipation is due to the quiescent supply current and is given by : EQUIESCENT =IQUIESCENT • VS • T TOTAL ENERGY PER CYCLE ETOT =( EOFF/ON +E ON +E COM +E ON/OFF )bridge 1+ +(EOFF/ON +E ON +E COM +E ON/OFF )bridge 2+ +E QUIESCENT The Total Power Dissipation PDIS is simply : PDIS =E TOT /T Tr = Rise time TON = ON time Tf= Fall Time Td = Dead time T = Period T=T r +T ON +T f+T d L6204

POWERDIP-20 PACKAGE MECHANICAL DATA DIM. mm inch a1 0.51 0.020 B 0.85 1.40 0.033 0.055 b 0.50 0.020 b1 0.38 0.50 0.015 0.020 D 24.80 0.976 E 8.80 0.346 e 2.54 0.100 e3 22.86 0.900 F 7.10 0.280 I 5.10 0.201 L 3.30 0.130 Z 1.27 0.050 L6204

SO28 PACKAGE MECHANICAL DATA DIM. mm inch A 2.65 0.104 a1 0.1 0.3 0.004 0.012 b 0.35 0.49 0.014 0.019 b1 0.23 0.32 0.009 0.013 C 0.5 0.020 c1 45 ° (typ.) D 17.7 18.1 0.697 0.713 E 10 10.65 0.394 0.419 e 1.27 0.050 e3 16.51 0.65 F 7.4 7.6 0.291 0.299 L 0.4 1.27 0.016 0.050 S8 ° (max.) L6204

Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications men- tioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without ex- press written approval of SGS-THOMSON Microelectronics.  1994 SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thaliand - United Kingdom - U.S.A. L6204