L4952TS

LM4952 NSC | Alldatasheet

Document overview

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Technical content

Features

n Pop & click circuitry eliminates noise during turn-on and turn-off transitions n Low current, active-low shutdown mode n Low quiescent current n Stereo 3.8W output, R L =4 Ω n DC-controlled volume control n Short circuit protection

Applications

n Flat panel TV’s n Computer Sound Cards Connection Diagram 200809E9 Top View Order Number LM4952TS See NS Package Number TS9A U = Wafer Fab Code Z = Assembly Plant Code XY = Date Coce TT = Die Traceability L4952TS = LM4952TS Boomer® is a registered trademark of National Semiconductor Corporation. August 2004 LM4952 3.1W Stereo-SE Stereo Audio Power Amplifier with DC Volume Control © 2004 National Semiconductor Corporation DS200809 www.national.com

FIGURE 1. Typical LM4952 SE Audio Amplifier Application Circuit

Absolute Maximum Ratings(Notes 1, 2) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage (pin 6, referenced to GND, pins 4 and 5) 18.0V Storage Temperature −65˚C to +150˚C Input Voltage pins 4, 6, and 7 −0.3V to V DD + 0.3V pins 1, 2, 3, 8, and 9 −0.3V to 9.5V Power Dissipation (Note 3) Internally limited ESD Susceptibility (Note 4) 2000V ESD Susceptibility (Note 5) 200V Junction Temperature 150˚C Thermal Resistance θ JC (TS) 4˚C/W θJA (TS) (Note 3) 20˚C/W Operating Ratings Temperature Range TMIN ≤ TA ≤ TMAX −40˚C ≤ T A ≤ 85˚C Supply Voltage 9.6V ≤ VDD ≤ 16V Electrical Characteristics VDD = 12V(Notes 1, 2) The following specifications apply for V DD = 12V, AV = 20dB (nominal), R L =4 Ω, and TA = 25˚C unless otherwise noted. Symbol Parameter Conditions LM4952 Units (Limits)Typical (Note 6) Limit (Notes 7, 8) IDD Quiescent Power Supply Current V IN = 0V, IO = 0A, No Load 18 35 mA (max) ISD Shutdown Current V SHUTDOWN = GND (Note 9) 55 85 µA (max) RIN Amplifier Input Resistance V DC VOL =V DD/2 44 k Ω VDC VOL = GND 200 k Ω VIN Amplifier Input Signal V DD/2 V p-p (max) VSDIH Shutdown Voltage Input High 2.0 VDD/2 V (min) V (max) VSDIL Shutdown Voltage Input Low 0.4 V (max) TWU Wake-up Time C B = 4.7µF 440 ms TSD Thermal Shutdown Temperature 170 ˚C P O Output Power f = 1kHz, THD+N = 1% THD+N = 10% 3.1 3.8

2.8 W (min)

THD+N Total Harmomic Distortion + Noise P O = 2.0Wrms, f = 1kHz 0.08 % eOS Output Noise A-Weighted Filter, V IN = 0V, Input Referred 8µ V XTALK Channel Separation f IN = 1kHz, PO = 1W, Input Referred R L =8 Ω RL =4 Ω 72 dB PSRR Power Supply Rejection Ratio V RIPPLE = 200mVp-p, f = 1kHz, Input Referred 89 80 dB (min) IOL Output Current Limit V IN = 0V, RL = 500mΩ 5A LM4952 www.national.com3

Electrical Characteristics for Volume Control(Notes 1, 2) The following specifications apply for V DD = 12V, AV = 20dB (nominal), and T A = 25˚C unless otherwise noted. Symbol Parameter Conditions LM4952 Units (Limits)Typical (Note 6) Limit (Note 7) VOLmax Gain V DC-VOL = Full scale, No Load 20 dB VOLmin Gain V DC-VOL = +1LSB, No Load -46 dB AM Mute Attenuation V DC-VOL = 0V, No Load 75 63 dB (min) Note 1: All voltages are measured with respect to the GND pin, unless otherwise specified. Note 2: Absolute Maximum Ratingsindicate limits beyond which damage to the device may occur. Operating Ratingsindicate conditions for which the device is functional, but do not guarantee specific performance limits.Electrical Characteristicsstate DC and AC electrical specifications under particular test conditions which guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit is given, however, the typical value is a good indication of device performance. Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the ambient temperature, TA. The maximum allowable power dissipation is PDMAX =( TJMAX −T A)/ θJA or the given in Absolute Maximum Ratings, whichever is lower. For the LM4952 typical application (shown in Figure 1) with VDD = 12V, RL =4 Ω stereo operation the total power dissipation is 3.65W. θJA = 20˚C/W for the TO263 package mounted to 16in2 heatsink surface area. Note 4: Human body model, 100pF discharged through a 1.5k Ω resistor. Note 5: Machine Model, 220pF–240pF discharged through all pins. Note 6: Typicals are measured at 25˚C and represent the parametric norm. Note 7: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level). Note 8: Datasheet min/max specification limits are guaranteed by design, test, or statistical analysis. Note 9: Shutdown current is measured in a normal room environment. The Shutdown pin should be driven as close as possible to GND for minimum shutdown current. External Components Description Refer to Figure 1 Components Functional Description 1. CIN This is the input coupling capacitor. It blocks DC voltage at the amplifier’s inverting input. C IN and RIN create a highpass filter. The filter’s cutoff frequency is f C =1 /(2πRINCIN). Refer to the SELECTING EXTERNAL COMPONENTS, for an explanation of determining C IN’s value. 2. CS The supply bypass capacitor. Refer to the POWER SUPPLY BYPASSINGsection for information about properly placing, and selecting the value of, this capacitor. 3. CBYPASS This capacitor filters the half-supply voltage present on the BYPASS pin. Refer to the Application section, SELECTING EXTERNAL COMPONENTS, for information about properly placing, and selecting the value of, this capacitor. LM4952 www.national.com 4

Typical Performance CharacteristicsAV = 20dB and T A = 25˚C, unless otherwise noted. THD+N vs Frequency THD+N vs Frequency 200809F8 VDD = 12V, RL =4 Ω, POUT = 2W, CIN = 1.0µF 200809F9 VDD = 12V, RL =8 Ω, POUT = 1W, CIN = 1.0µF THD+N vs Output Power THD+N vs Output Power 200809G0 VDD = 12V, RL =4 Ω, fIN = 1kHz 200809G1 VDD = 12V, RL =8 Ω, fIN = 1kHz LM4952 www.national.com5

Typical Performance CharacteristicsAV = 20dB and T A = 25˚C, unless otherwise noted. (Continued) Output Power vs Power Supply Voltage Output Power vs Power Supply Voltage 20080909 RL =4 Ω,f IN = 1kHz both channels driven and loaded (average shown), at (from top to bottom at 12V): THD+N = 10%, THD+N = 1% 20080910 RL =8 Ω,f IN = 1kHz both channels driven and loaded (average shown), at (from top to bottom at 12V): THD+N = 10%, THD+N = 1% Power Supply Rejection vs Frequency Total Power Dissipation vs Load Dissipation 200809F7 VDD = 12V, RL =4 Ω, VRIPPLE = 200mVp-p 20080913 VDD = 12V, fIN = 1kHz, at (from top to bottom at 1W): RL =4 Ω,R L =8 Ω Output Power vs Load Resistance Channel-to-Channel Crosstalk vs Frequency 20080914 VDD = 12V, fIN = 1kHz, at (from top to bottom at 15Ω): THD+N = 10%, THD+N = 1% 20080915 VDD = 12V, RL =4 Ω,P OUT = 1W, Input Referred at (from top to bottom at 1kHz): VINB driven, VOUTA measured, VINA driven, VOUTB measured LM4952 www.national.com 6

Typical Performance CharacteristicsAV = 20dB and T A = 25˚C, unless otherwise noted. (Continued) Channel-to-Channel Crosstalk vs Frequency Amplifier Gain vs DC Volume Voltage 20080916 VDD = 12V, RL =8 Ω,P OUT = 1W, Input Referred at (from top to bottom at 1kHz): VINB driven, VOUTA measured, VINA driven, VOUTB measured 200809F5 VDD = 12V, RL =8 Ω, at (from top to bottom at 1.5V): Decreasing DC Volume Voltage, Increasing DC Volume Voltage Amplifier Gain vs Part-to-Part DC Volume Voltage Variation (Five parts) THD+N vs Frequency 200809F6 VDD = 12V, RL =8 Ω, 200809G2 VDD = 9.6V, RL =4 Ω, POUT = 1.1W, CIN = 1.0µF THD+N vs Frequency THD+N vs Output Power 200809G3 VDD = 9.6V, RL =8 Ω, POUT = 850mW, CIN = 1.0µF 200809G4 VDD = 9.6V, RL =4 Ω, fIN = 1kHz LM4952 www.national.com7

Typical Performance CharacteristicsAV = 20dB and T A = 25˚C, unless otherwise noted. (Continued) THD+N vs Output Power Total Power Dissipation vs Load Dissipation 200809G5 VDD = 9.6V, RL =8 Ω, fIN = 1kHz 20080919 VDD = 9.6V, fIN = 1kHz at (from top to bottom at 1W): RL =4 Ω,R L =8 Ω Output Power vs Load Resistance Power Supply Rejection vs Frequency 20080920 VDD = 9.6V, fIN = 1kHz, at (from top to bottom at 15Ω): THD+N = 10%, THD+N = 1% 200809G6 VDD = 9.6V, RL =4 Ω, VRIPPLE = 200mVP-P Channel-to Channel Crosstalk vs Frequency Channel-to Channel Crosstalk vs Frequency 20080921 VDD = 9.6V, RL =4 Ω,P OUT = 1W, Input Referred at (from top to bottom at 1kHz): VINB driven, VOUTA measured; VINA driven, VOUTB measured 20080922 VDD = 9.6V, RL =8 Ω,P OUT = 1W, Input Referred at (from top to bottom at 1kHz): VINB driven, VOUTA measured; VINA driven, VOUTB measured LM4952 www.national.com 8

Typical Performance CharacteristicsAV = 20dB and T A = 25˚C, unless otherwise noted. (Continued) THD+N vs Frequency THD+N vs Frequency 200809G7 VDD = 14V, RL =4 Ω, POUT = 2W, CIN = 1.0µF 200809G8 VDD = 14V, RL =8 Ω, POUT = 1W, CIN = 1.0µF THD+N vs Output Power THD+N vs Output Power 200809G9 VDD = 14V, RL =4 Ω, fIN = 1kHz 200809H0 VDD = 14V, RL =8 Ω fIN = 1kHz Power Supply Rejection vs Frequency Output Power vs Load Resistance 200809H1 VDD = 14V, RL =4 Ω VRIPPLE = 200mVP-P 20080925 VDD = 15V, fIN = 1kHz, at (from top to bottom at 2W): RL =4 Ω,R L =8 Ω LM4952 www.national.com9

Typical Performance CharacteristicsAV = 20dB and T A = 25˚C, unless otherwise noted. (Continued) THD+N vs Output Power THD+N vs Output Power 20080926 VDD = 15V, at (from top to bottom at 15Ω): THD+N = 10%, THD+N = 1%, fIN = 1kHz 20080927 VDD = 16V, RL =4 Ω, fIN = 1kHz Channel-to-Channel Crosstalk vs Frequency Channel-to-Channel Crosstalk vs Frequency 20080928 VDD = 16V, RL =4 Ω,P OUT = 1W, Input Referred at (from top to bottom at 1kHz): VINB driven, VOUTA measured; VINA driven, VOUTB measured 20080929 VDD = 16V, RL =8 Ω,P OUT = 1W, Input Referred at (from top to bottom at 1kHz): VINB driven, VOUTA measured; VINA driven, VOUTB measured Power Supply Current vs Power Supply Voltage Clipping Voltage vs Power Supply Voltage 200809H2 RL =4 Ω, VIN = 0V, RSOURCE =5 0Ω 20080931 RL =4 Ω,f IN = 1kHz at (from top to bottom at 12.5V): positive signal swing, negative signal swing LM4952 www.national.com 10

Typical Performance CharacteristicsAV = 20dB and T A = 25˚C, unless otherwise noted. (Continued) Clipping Voltage vs Power Supply Voltage Power Dissipation vs Ambient Temperature 20080932 RL =8 Ω,f IN = 1kHz at (from to bottom at 12.5V): positive signal swing, negative signal swing 20080933 VDD = 12V, RL =4 Ω (SE), fIN = 1kHz, (from to bottom at 80˚C): 16in2 copper plane heatsink area, 8in2 copper plane heatsink area Power Dissipation vs Ambient Temperature 20080934 VDD = 12V, RL =8 Ω,f IN = 1kHz, (from to bottom at 120˚C): 16in2 copper plane heatsink area, 8in2 copper plane heatsink area LM4952 www.national.com11

Application Information

HIGH VOLTAGE BOOMER WITH INCREASED OUTPUT POWER Unlike previous 5V Boomer ® amplifiers, the LM4952 is de- signed to operate over a power supply voltages range of 9.6V to 16V. Operating on a 12V power supply, the LM4952 will deliver 3.8W into a 4 Ω SE load with no more than 10% THD+N. POWER DISSIPATION Power dissipation is a major concern when designing a successful single-ended or bridged amplifier. Equation (2) states the maximum power dissipation point for a single- ended amplifier operating at a given supply voltage and driving a specified output load. P DMAX-SE =( VDD) 2 / (2π2RL): Single Ended (1) The LM4952’s dissipation is twice the value given by Equa- tion (2) when driving two SE loads. For a 12V supply and two 4Ω SE loads, the LM4952’s dissipation is 1.82W. The maximum power dissipation point given by Equation (1) must not exceed the power dissipation given by Equation (2): P DMAX’=( TJMAX -T A) / θJA (2) The LM4952’s T JMAX = 150˚C. In the TS package, the LM4952’sθJA is 20˚C/W when the metal tab is soldered to a copper plane of at least 16in 2. This plane can be split be- tween the top and bottom layers of a two-sided PCB. Con- nect the two layers together under the tab with a 5x5 array of vias. At any given ambient temperature T A, use Equation (2) to find the maximum internal power dissipation supported by the IC packaging. Rearranging Equation (2) and substituting P DMAX for PDMAX’ results in Equation (3). This equation gives the maximum ambient temperature that still allows maximum stereo power dissipation without violating the LM4952’s maximum junction temperature. T A =T JMAX -P DMAX-SEθJA (3) For a typical application with a 12V power supply and an SE 4Ω load, the maximum ambient temperature that allows maximum stereo power dissipation without exceeding the maximum junction temperature is approximately 77˚C for the TS package. T JMAX =P DMAX-MONOBTLθJA +T A (4) Equation (4) gives the maximum junction temperature TJMAX. If the result violates the LM4952’s 150˚C, reduce the maximum junction temperature by reducing the power sup- ply voltage or increasing the load resistance. Further allow- ance should be made for increased ambient temperatures. The above examples assume that a device is operating around the maximum power dissipation point. Since internal 200809E8 FIGURE 2. Typical LM4952 SE Application Circuit

Application Information (Continued) manner, the ground lead of the capacitor connected between the BYPASS pin and GND should also be connected to the package’s grounded tab. OPTIMIZING CLICK AND POP REDUCTION PERFORMANCE The LM4952 contains circuitry that eliminates turn-on and shutdown transients ("clicks and pops"). For this discussion, turn-on refers to either applying the power supply voltage or when the micro-power shutdown mode is deactivated. As the V DD/4 voltage present at the BYPASS pin ramps to its final value, the LM4952’s internal amplifiers are muted. Once the voltage at the BYPASS pin reaches V DD/4, the amplifiers are unmuted. The gain of the internal amplifiers remains unity until the voltage on the bypass pin reaches V DD/4. As soon as the voltage on the bypass pin is stable, the device becomes fully operational and the amplifier outputs are reconnected to their respective output pins. In order eliminate "clicks and pops", all capacitors must be discharged before turn-on. Rapidly switching V DD may not allow the capacitors to fully discharge, which may cause "clicks and pops". There is a relationship between the value of C IN and CBYPASS that ensures minimum output transient when power is applied or the shutdown mode is deactivated. Best perfor- mance is achieved by selecting a C BYPASS value that is greater than twelve times C IN’s value. RECOMMENDED PRINTED CIRCUIT BOARD LAYOUT Figure 9 through Figure 11 show the recommended two- layer PC board layout that is optimized for the TO263- packaged, SE-configured LM4952 and associated external components. These circuits are designed for use with an external 12V supply and 4 Ω(min)(SE) speakers. These circuit boards are easy to use. Apply 12V and ground to the board’s V DD and GND pads, respectively. Connect a speaker between the board’s OUTA and OUTB outputs and respective GND pins. LM4952 www.national.com 16

FIGURE 13. Recommended TS SE PCB Layout:

Physical Dimensions inches (millimeters) unless otherwise noted Order Number LM4952TS LM4952 www.national.com19

NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. BANNED SUBSTANCE COMPLIANCE National Semiconductor certifies that the products and packing materials meet the provisions of the Customer Products Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain no ‘‘Banned Substances’’ as defined in CSP-9-111S2. National Semiconductor Americas Customer Support Center Email: new.feedback@nsc.com Tel: 1-800-272-9959 National Semiconductor Europe Customer Support Center Fax: +49 (0) 180-530 85 86 Email: europe.support@nsc.com Deutsch Tel: +49 (0) 69 9508 6208 English Tel: +44 (0) 870 24 0 2171 Français Tel: +33 (0) 1 41 91 8790 National Semiconductor Asia Pacific Customer Support Center Email: ap.support@nsc.com National Semiconductor Japan Customer Support Center Fax: 81-3-5639-7507 Email: jpn.feedback@nsc.com Tel: 81-3-5639-7560 www.national.com LM4952 3.1W Stereo-SE Stereo Audio Power Amplifier with DC Volume Control National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the righ t at any time without notice to change said circuitry and specifications.