RHFL4913XX15 STMICROELECTRONICS | Alldatasheet
Document overview
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- PDF pages: 19
Technical content
Datasheet sections
- 1 Diagram
- 2 Pin configuration
- 3 Maximum ratings
- 4 Electrical characteristics
- 5 Device description
- 5.1 Low pin count package limitations
- 5.2 SENSE pin
- 5.3 Inhibit ON-OFF control
- 5.4 Overtemperature protection
- 5.5 Overcurrent protection
- 5.6 OCM pin
- 5.7 Alternate to
- 6 Application information
- 6.1 Remote sensing operation
- 7 Notes about Flat-16 package
- 7.1 Radiation performances
- 7.2 Die information
- 8 Package mechanical data
- 9 Ordering information
- 10 Revision history
Features
■ 2 and 3 A low dropout voltage ■ Embedded overtemperature, overcurrent protections ■ Adjustable current limitation ■ Output overload monitoring/signalling ■ Fixed 1.5 V, 2.5 V; 3.3 V; 5.0 V output voltages ■ Inhibit (ON/OFF) TTL-compatible control ■ Programmable output short-circuit current ■ Remote sensing operation ■ Rad-hard: tested up to 300 krad Mil Std 883E Method 1019.6 and low dose rate conditions ■ Heavy ion, SEL, and SEU immune; able to sustain 2x10 14 protons/cm2 and 2x1014 neutrons/cm2
Description
The RHFL4913 fixed is a high performance Rad- hard positive voltage regulator family. Available into various hermetic ceramic packages, it is specifically intended for space and harsh radiation environments. Input supply range is up to 12 V. RHFL4913 fixed is QML-V qualified, DSCC SMD are 5962F02534 / 02535 / 02536. SMD.5 TO-257 Flat-16 Figure 1. Block diagram for package SMD.5 and TO-257
1 Diagram
Figure 2. Block diagram for package Flat-16
2 Pin configuration
Figure 3. Pin configuration (top view for Flat-16, bottom view for SMD.5) Table 1. Pin description
3 Maximum ratings
Table 2. Absolute maximum ratings (1)
- Exceeding maximum ratings may damage the device.
- Internally limited to about maximum +175 °C by thermal shutdown circuit.
Table 3. Thermal data
4 Electrical characteristics
Table 4. Electrical characteristics
- This value is guaranteed by design. For each application it’s strongly recommended to comply with the maximum current
Table 4. Electrical characteristics (continued) Figure 4. Application diagram for remote sensing operation
Device description RHFL4913XX15 - RHFLXX25 - RHFLXX33 - RHFLXX50
5 Device description
The RHFL4913 fixed voltage contains a PNP type power element controlled by a signal resulting from amplified comparison between the internal temperature compensated band- gap cell and the fraction of the desired output voltage value. This fractional value is obtained from an internal-to-die resistor divider bridge set by STMicroelectronics. The device is protected by several functional blocks.
5.1 Low pin count package limitations
Some functions (INHIBIT, OCM, SENSE) are not available due to lack of pins. Corresponding die pads are by default connected inside silicon.
5.2 SENSE pin
The load voltage is applied by a Kelvin line connected to SENSE pin: Voltage feed-back comes from the internal divider resistor bridge. Therefore possible output voltages are set by manufacturer mask metal options. SENSE pin is not available in 3pin packages.
5.3 Inhibit ON-OFF control
By setting INHIBIT pin TTL-high, the device switches off the output current and voltage. The device is ON when INHIBIT pin is set low. Since INHIBIT pin is internally pulled down, it can be left floating in case inhibit function is not utilized. INHIBIT pin is not available in 3pin packages.
5.4 Overtemperature protection
A temperature detector internally monitors the power element junction temperature. The device goes OFF at approx. 175 °C, returning to ON mode when back to approx. 40 °C. It is worth noting that when the internal temperature detector reaches 175 °C, the active power element can be at 225 °C: device reliability cannot be granted in case of extensive operation under these conditions.
5.5 Overcurrent protection
ISC pin. An internal non-fold back short-circuit limitation is set with ISHORT > 3.8 A (VO is 0 V). This value can be reduced by an external resistor connected between ISC pin and VI pin, with a typical value range of 10 kΩ to 200 kΩ. This adjustment feature is not available in 3 pin packages. To keep excellent VO regulation, it is necessary to set ISHORT 1.6 times greater than the maximum desired application IO. When IO reaches ISHORT – 300 mA, the current limiter overrules regulation and VO starts to drop and the OCM flag is risen. When no current limitation adjustment is required, ISC pin must be left unbiased (as it is in 3 pin packages).
RHFL4913XX15 - RHFLXX25 - RHFLXX33 - RHFLXX50 Device description
5.6 OCM pin
Goes low when current limiter starts to be active, otherwise VOCM = VI. It is bufferized and can sink 10 mA. OCM pin is internally pulled-up by a 5 kΩ resistor. Not available in 3 pin packages.
5.7 Alternate to
RHFL4913 fixed (& custom) voltages replace all 3-terminal industry devices, providing essential benefits - Lower drop-out - High radiation performance - Better SVR - Saving the high stability external setting resistors.
6 Application information
The RHFL4913 fixed voltage is functional as soon as VI-VO voltage difference is slightly above the power element saturation voltage. A minimum 0.5 mA IO ensures perfect “no- load” regulation. All available VI pins must always be externally interconnected, same thing for all available VO pins, otherwise device stability and reliability cannot be granted. All NC pins can be connected to ground. The INHIBIT function switches off the output current in an electronic way, that is very quickly. According to Lenz’s Law, external circuitry reacts with –LdI/dt terms which can be of high amplitude in case some series-inductance exists. The effect would be a large transient voltage developed on both device terminals. It is necessary to protect the device with Schottky diodes preventing negative voltage excursions. In the worst case, a 14 V Zener diode shall protect the device input. The device has been designed for high stability and low drop out operation: minimum 1 µF input and output tantalum capacitors are therefore mandatory. Capacitor ESR range is from 0.5 Ω to over 20 Ω. Such range turns out to be useful when ESR increases at low temperature. When large transient currents are expected, larger value capacitors are necessary. In case of high current operation with expected short-circuit events, caution must be considered relatively to capacitors. They must be connected as close as possible to device terminals. As some tantalum capacitors may permanently fail when submitted to high charge-up surge currents, it is recommended to decouple them with 470 nF polyester capacitors. Being RHFL4913 fixed voltage manufactured with very high speed bipolar technology 6 GHz f T transistors), the PCB lay-out must be performed with extreme care, very low inductance, low mutually coupling lines, otherwise high frequency parasitic signals may be picked-up by the device resulting into self-oscillation. User’s benefit is a SVR performance extended to far higher frequencies.
6.1 Remote sensing operation
In case the load is located far from the regulator, it is recommended to comply with the scheme below. To obtain the best regulation, it is in addition essential to care about: – The wire connecting R2 to the load end must not be crossed by the load current (Kelvin sense). The noise captured by the wires between the load and the chip could bring a noisy output voltage. In case this happens, it is recommended that shielded cables are used for these connections. The external wrap must be used for connecting the ground of the chip with the load ground. It is also recommended to place 1 µF tantalum capacitors between output and ground close to the device and another next to the load.
7 Notes about Flat-16 package
the equipment heater, in order to optimize heat removal performance.
7.1 Radiation performances
1019.6, bipolar section: post radiation parameters are within datasheet pre-rad limits. SEL event has been detected.
7.2 Die information
substrate, they provide full compliance with equivalent packaged product. (*) Die SENSE pad is active in RHFL4913 fixed die. It shall not be left unbonded. It should be bonded to VO pin. unconnected during hybrid bonding. Figure 5. Die size
8 Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Dim. mm. inch. A 2.16 2.72 0.0 85 0.107 b 0.43 0.017 c0 . 1 3 0.005 D 9.910 . 390 E6 . 91 0.272 E2 4. 32 0.170 E3 0.76 0.0 30 e 1.27 0.050 L 6.72 0.265 Q 0.66 1.14 0.026 0.045 S1 0.1 3 0.005 Flat-16 (MIL-STD-1835) mechanical data 7450901A 1 8 e b c L E D S1 Q A L
Dim. mm. inch. D1 0.76 0.0 30 e1 . 91 0.075 SMD.5 mechanical data 7386434B
Dim. mm. inch. A 10.54 0.415 B 10.54 0.415 C 16.64 0.655 D 4.7 5. 33 0.185 0.210 E 1.02 0.40 G1 3.51 0.5 32 H 5.26 0.207 I 0.76 0.0 30 J 3.05 0.120 K 2.54 0.100 L 15.2 16.5 0.5 98 0.650 M2 . 2 9 0.090 N 0.71 0.02 8 R 1.65 0.065 TO-257 mechanical data 0117268C
9 Ordering information
Table 5. Order codes
Note: 3 V version is available on request. Table 6. Part number - SMD equivalent Table 7. Environmental characteristics
Table 8. Document revision history 05-May-2004 4 Mistake in pin description SMD.5 on table 3. 28-Oct-2004 5 New order codes added - tables 4 and 5. 27-May-2005 6 The features, tables 4, 5 and the figures 1, 2 updated.