KTDS-3534UV395B KINGBRIGHT | Alldatasheet

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© 2018 Kingbright. All Rights Reserved. Spec No: DSAP3846 / 1212100222 Rev No: V.1B Date: 01/18/2018 Page 1 / 7

FEATURES

z Dimensions: 3.45 mm x 3.45 mm x 2.0 mm z Small package with high efficiency z Surface mount technology z Package: 1000pcs / reel z Soldering methods: IR reflow soldering z Moisture sensitivity level: 1 z RoHS compliant

APPLICATIONS

z Photocatalytic Purification z Blood and Counterfeit money detection z UV curing in nail salon, dental, and poster printing z Material as follows: Package: Ceramics Encapsulating resin: Silicone resin Electrodes: Au plating ATTENTION Observe precautions for handling electrostatic discharge sensitive devices PACKAGE DIMENSIONS SELECTION GUIDE KTDS-3534UV395B 3.45 x 3.45 mm UV LED With Ceramic Substrate RECOMMENDED SOLDERING PATTERN (units : mm; tolerance : ± 0.1) Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.2(0.008") unless otherwise noted. 3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications. Notes: 1. θ1/2 is the angle from optical centerline where the radiant intensity is 1/2 of the optical peak value. 2. *Radiant flux with asterisk is measured at 700mA; Radiant flux: +/-15%. 3. Radiant flux value is traceable to CIE127-2007 standards. Part Number Emitting Color (Material) Lens Type Φe(mW) [2] @500mA*700mA Viewing Angle [1] Code. Min. Max. Typ. 2θ1/2 KTDS-3534UV395B Ultraviolet (InGaN) Water Clear C14 640 740 120° C15 740 850 C16 850 1000 - - - *1100 800

© 2018 Kingbright. All Rights Reserved. Spec No: DSAP3846 / 1212100222 Rev No: V.1B Date: 01/18/2018 Page 2 / 7 ABSOLUTE MAXIMUM RATINGS at TA=25°C ELECTRICAL / OPTICAL CHARACTERISTICS at TA=25°C KTDS-3534UV395B Notes: 1. Forward voltage: ±0.1V. 2. Wavelength value is traceable to CIE127-2007 standards. 3. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure. Parameter Symbol Value Unit Wavelength at Peak Emission IF = 500mA [Min.] λpeak 390 Wavelength at Peak Emission IF = 500mA [Typ.] 395 Wavelength at Peak Emission IF = 500mA [Max.] 400 Spectral Bandwidth at 50% Φ REL MAX IF = 500mA [Typ.] Δλ 13 nm Forward Voltage IF = 500mA [Typ.] VF [1] 3.4 V Forward Voltage IF = 500mA [Max.] 3.9 Allowable Reverse Current [Max.] IR 85 mA Temperature Coefficient of VF IF = 500mA, -10°C ≤ T ≤ 100°C TCV -3.0 mV/°C nm Parameter Symbol Value Unit Power Dissipation PD 2.8 W Reverse Voltage VR 5 V Junction Temperature Tj [1] 115 °C Operating Temperature Top -40 to +100 °C Storage Temperature Tstg -40 to +115 °C DC Forward Current IF [1] 700 mA Peak Forward Current IFM [2] 1000 mA Thermal Resistance (Junction / Ambient) Rth JA [1] 10 °C/W Thermal Resistance (Junction / Solder point) Rth JS [1] 5 °C/W Notes: 1. Results from mounting on metal core PCB, mounted on pc board-metal core PCB is recommend for lowest thermal resistance. 2. 1/10 Duty Cycle, 0.1ms Pulse Width. 3. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033.

© 2018 Kingbright. All Rights Reserved. Spec No: DSAP3846 / 1212100222 Rev No: V.1B Date: 01/18/2018 Page 3 / 7 TECHNICAL DATA 20% 40% 60% 80% 100% 300 315 330 345 360 375 390 405 420 435 450 Ta = 25 °C Wavelength (nm) Relative radiant Intensity (a. u.) RELATIVE INTENSITY vs. WAVELENGTH ULTRAVIOLET TAPE SPECIFICATIONS (units : mm) REEL DIMENSION (units : mm) 0.5 0.5 0.0 -90° -75° -60° -45° -30° -15° 75° 60° 45° 30° 0° 15° 90° 1.0 1.0 Ta = 25 °C SPATIAL DISTRIBUTION KTDS-3534UV395B 380 385 390 395 400 405 410 - 4 0 - 2 0 0 2 04 06 08 0 1 0 0 Ambient temperature (°C) Peak wavelength (nm) IF = 500 mA 2.5 2.8 3.1 3.4 3.7 4.0 - 4 0 - 2 00 2 04 06 08 0 1 0 0 IF = 500 mA Ambient temperature (°C) Forward voltage (V) 100 200 300 400 500 600 700 800 900 1000 11 0 1 0 0 T a = 25 °C Pulse width ≦0.1ms Duty cycle (%) Permissible forward current (mA) Peak Wavelength vs. Ambient Temperature Forward Voltage vs. Ambient Temperature 100 1000 Ta = 25 °C Forward voltage (V) Forward current (mA) 0.001 0.01 0.1 1 10 100 1000 Ta = 25 °C Forward current (mA) Radiant flux normalised at 500 mA 200 400 600 800 1000 - 4 0 - 2 0 0 2 04 06 08 0 1 0 0 Ambient temperature (°C) Permissible forward current (mA) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 - 4 0 - 2 00 2 04 06 08 0 1 0 0 Ambient temperature (°C) Radiant flux normalised at T a = 25 °C Permissible Forward Current vs. Duty Cycle Forward Current vs. Forward Voltage Radiant Flux vs. Forward Current Forward Current Derating Curve Radiant Flux vs. Ambient Temperature

© 2018 Kingbright. All Rights Reserved. Spec No: DSAP3846 / 1212100222 Rev No: V.1B Date: 01/18/2018 Page 4 / 7 KTDS-3534UV395B HANDLING PRECAUTIONS Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 1. Handle the component along the side surfaces by using forceps or appropriate tools. Designing the Position of LED on a Board 1. No twist / warp / bent / or other stress shall be applied to the board after mounting LED with solder to avoid a crack of LED package. Refer to the following recommended position and direction of LED. 3. Do not split board by hand. Split with exclusive special tool. 4. If an aluminum circuit board is used, a large stress by thermal shock might cause a solder crack. For this reason, it is recommended an appropriate verification should be taken before use. Appropriate LED mounting is to place perpendicularly against the stress affected side 2. Depending on the position and direction of LED, the mechanical stress on the LED package can be changed. Refer to the following figure. JEDEC Moisture Sensitivity Level Floor Life Soak Requirements Standard Accelerated Equivalent Time Conditions Time (hours) Conditions Time (hours) Conditions

1 Unlimited ≤ 30 °C / 85% RH 168

Kingbright recommends keeping the LEDs in the sealed moisture-barrier packaging until immediately prior to use. Any unused LEDs should be returned to the moisture-barrier bag and closed immediately after use. 4-1. There should be enough space inside the nozzle to avoid contact with the dome lens during pick up. 4-2. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. 4-3. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 4-4. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of lead-frame. Special care should be taken if an LED with silicone encapsulation is to be used near such substances.

© 2018 Kingbright. All Rights Reserved. Spec No: DSAP3846 / 1212100222 Rev No: V.1B Date: 01/18/2018 Page 5 / 7 KTDS-3534UV395B REFLOW SOLDERING PROFILE for LEAD-FREE SMD PROCESS Notes: 1. Don't cause stress to the LEDs while it is exposed to high temperature. 2. The maximum number of reflow soldering passes is 2 times. 3. Reflow soldering is recommended. Other soldering methods are not recommended as they might cause damage to the product. ESD Protection During Production Electric static discharge can result when static-sensitive products come in contact with the operator or other conductors. The following procedures may decrease the possibility of ESD damage: 1. Minimize friction between the product and surroundings to avoid static buildup. 2. All production machinery and test instruments must be electrically grounded. 3. Operators must wear anti-static bracelets. 4. Wear anti-static suit when entering work areas with conductive machinery. 5. Set up ESD protection areas using grounded metal plating for component handling. 6. All workstations that handle IC and ESD-sensitive components must maintain an electrostatic potential of 150V or less. 7. Maintain a humidity level of 50% or higher in production areas. 8. Use anti-static packaging for transport and storage. 9. All anti-static equipment and procedures should be periodically inspected and evaluated for proper functionality. Heat Generation 1. Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. 2. Please determine the operating current with consideration of the ambient temperature local to the LED and refer to the plot of Permissible Forward Current vs. Ambient temperature on characteristics in this specification. Please also take measures to remove heat from the area near the LED to improve the operational characteristics on the LED. 3. The equation ① indicates correlation between T j and Ta, and the equation ② indicates correlation between Tj and Ts Tj = Ta + Rth JA *W ……… ① Tj = Ts + Rth JS *W ……… ② Tj = dice junction temperature: °C Ta = ambient temperature: °C Ts = solder point temperature: °C Rth JA = heat resistance from dice junction temperature to ambient temperature: °C / W Rth JS = heat resistance from dice junction temperature to Ts measuring point: °C / W W = inputting power (IF x VF): W

© 2018 Kingbright. All Rights Reserved. Spec No: DSAP3846 / 1212100222 Rev No: V.1B Date: 01/18/2018 Page 6 / 7 KTDS-3534UV395B Criteria For Judging Damage Item Symbol Test Conditions Criteria for Judgement Min. Max. Forward Voltage VF IF = 500mA - Initial Level x 1.1 Radiant Flux Φe IF = 500mA Initial Level x 0.7 - Note: The test is performed after the board is cooled down to the room temperature. RELIABILITY TEST ITEMS AND CONDITIONS The reliability of products shall be satisfied with items listed below Lot Tolerance Percent Defective (LTPD) : 10% No. Test Item Standards Test Condition Test Times / Cycles Number of Damaged

1 Continuous operating test - Ta = 25°C +10/-5°C, RH = 55+/-20%RH

IF = maximum rated current* 1,000 h 0 / 22 2 High Temp. operating test - Ta = 100°C(+/-10°C) IF = maximum rated current* 1,000 h 0 / 22 3 Low Temp. operating test - Ta = -40°C+3/-5°C IF = maximum rated current* 1,000 h 0 / 22 4 High temp. storage test JEITA ED-4701/200 201 Ta = 100°C(+/-10°C) Ta = maximum rated storage temperature 1,000 h 0 / 22 5 Low temp. storage test JEITA ED-4701/200 202 Ta = -40°C+3/-5°C 1,000 h 0 / 22 6 High temp. & humidity storage test JEITA ED-4701/100 103 Ta = 60°C+5/-3°C, RH = 90+5/-10%RH 1,000 h 0 / 22 7 High temp. & humidity operating test IF = maximum rated current* 1,000 h 0 / 22

8 Resistance to Soldering Heat

(Reflow Soldering) JEITA ED-4701/300 301 Tsld = 260°C, 10sec 2 times 0 / 22

9 Solderability

(Reflow Soldering) JEITA ED-4701/303 303A Tsld = 245°C+/-5°C, 5+/-1sec 1 time over 95% 0 / 22

10 Temperature Cycle operating

-40°C(30min) ~ 25°C(5min) ~ 100°C (30min) ~ 25°C(5min) IF = derated current at 100°C 10 cycles 0 / 22

11 Temperature Cycle JEITA ED-4701/100 105 -40°C(30min) ~ 25°C(5min) ~ 100°C

(30min) ~ 25°C(5min) 100 cycles 0 / 22

12 Thermal shock test MIL-STD-202G Ta = -40°C(15min) ~ 100°C(15min) 500 cycles 0 / 22

13 Electric Static Discharge (ESD) JEITA ED-4701/300 304 C = 100pF, R = 1.5KΩ V = 8000V 3 times Negative / Positive 0 / 22

14 Vibration test JEITA ED-4701/400 403

100 ~ 2000 ~ 100HZ Sweep 4min. 200m/s² 3directions, 4cycles 48 min. 0 / 22 Note: Refer to forward current vs. derating curve diagram.

© 2018 Kingbright. All Rights Reserved. Spec No: DSAP3846 / 1212100222 Rev No: V.1B Date: 01/18/2018 Page 7 / 7 KTDS-3534UV395B PACKING & LABEL SPECIFICATIONS Packaging 1.The LEDs are packed in cardboard boxes after taping. 2.The label on the minimum packing unit shows: Part Number, Lot Number, Ranking, Quantity. 3.In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation. 4.The LEDs may be damaged if the boxes are dropped or receive a strong impact against them, so precautions must be taken to prevent any damage. 5.The boxes are not water resistant and therefore must be kept away from water and moisture. 6.When the LEDs are transported, we recommend that you use the same packing methods as Kingbright’s. PRECAUTIONARY NOTES 1. The information included in this document reflects representative usage scenarios and is intended for technical reference on ly. 2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to the latest datasheet for the updated specifications. 3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues. 4. The information in this document applies to typical usage in consumer electronics applications. If customer's application ha s special reliability requirements or have life-threatening liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance. 5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright. 6. All design applications should refer to Kingbright application notes available at http://www.Kingbright.com/application_notes