SLVA340A TI | Alldatasheet
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SLVA340A –June 2009–RevisedMay 2010 High-Integration,High-EfficiencyPower SolutionUsing DC/DC ConvertersWith DVFS ABSTRACT This reference design helps those desiringto design-inthe TMS320C6742, TMS320C6746, TMS320C6748 and OMAP-L138. Thisdesign,employingsequenced power supplies,describesa system withan inputvoltageof5V, and uses a high-efficiencyDC/DC ConverterwithintegratedFETs and DVFS fora small,simplesystem. Sequenced power supplyarchitecturesare becoming commonplace inhigh-performancemicroprocessor and digitalsignalprocessor(DSP) systems.To save power and increaseprocessingspeeds,processor coreshave small-geometrycellsthatrequirelowersupplyvoltagesthanthesystem-busvoltages.Power management inthesesystems requiresspecialattention.Thisapplicationnote addressesthesetopics and suggestssolutionsforoutput-voltagesequencing.
Contents
1 Introduction
Indual-voltagearchitectures,coordinatedmanagement ofpower suppliesisnecessarytoavoidpotential problemsand ensurereliableperformance.Power supplydesignersmust considerthetimingand voltage differencesbetween coreand I/Ovoltagesuppliesduringpower-upand power-down operations. Sequencingreferstotheorder,timingand differentialinwhichthetwo voltagerailsarepowered up and down. A systemdesignedwithoutpropersequencingmay be atriskfortwo typesoffailures.The firstof theserepresentsa threattothelongtermreliabilityofthedual-voltagedevice,whilethesecond ismore immediate,withthepossibilityofdamaging interfacecircuitsintheprocessororsystemdevicessuch as memory, logicordata-converterICs. I2C isa trademarkofPhilipsElectronicsN.V.Corporation. 1SLVA340A –June 2009–RevisedMay 2010 High-Integration,High-EfficiencyPower SolutionUsingDC/DC ConvertersWith DVFS Copyright© 2009–2010,Texas InstrumentsIncorporated
Power Requirements www.ti.com Anotherpotentialproblemwithimpropersupplysequencingisbus contention.Bus contentionisa conditionwhen theprocessorand anotherdevicebothattempttocontrola bi-directionalbus duringpower up.Bus contentionmay alsoaffectI/Oreliability.Power supplydesignersshouldchecktherequirements regardingbus contentionforindividualdevices. The power-onsequencingfortheOMAP-L138, TMS320C6742, TMS320C6746, and TMS320C6748 are shown inthePower Requirementstablebelow.Thereisno specificrequiredvoltageramp rateforany of thesuppliesas longas the3.3Vrailneverexceedsthe1.8Vrailby more than2V. Also,inordertoreducethepower consumptionoftheprocessorcore,theDynamic Voltageand FrequencyScaling(DVFS) isused inthereferencedesign.DVFS isa power management techniqueused whilethesystem-on-chip(SoC)isactivelyprocessing.Thistechniquematches theoperatingfrequencyof thehardwaretotheperformancerequirementoftheactiveapplicationscenario.Whenever clock frequenciesarelowered,operatingvoltagesarealsoloweredas welltoachievepower savings.Inthe referencedesign,theTPS65023 isused thatcan scaleitsoutputvoltage.ItsupportsallfiveDVFS voltage
2 Power Requirements
The power requirementsareas specifyinthetable. VOLTAGE (1)(2) Imax SEQUENCING TIMINGPIN NAME TOLERANCE(V) (mA) ORDER DELAY I/O RTC_CVDD 1.2 1 –25%, +10% 1(3) I/O RVDD, PLL0_VDDA, 1.2 200 –5%, +10% 3 PLL1_VDDA, SATA_VDD, USB_CVDD, USB0_VDDA12 I/O USB0_VDDA18, USB1_VDDA18, 1.8 180 ±5% 4 DDR_DVDD18, SATA_VDDR, DVDD18 I/O USB0_VDDA33, USB1_VDDA33 3.3 24 ±5% 5 DVDD3318_C (1) If1.8-VLVCMOS isused,power railsup withthe1.8-Vrails.If3.3-VLVCMOS isused,power itup withtheANALOG33 rails (VDDA33_USB0/1) (2) Thereisno specificrequiredvoltageramp rateforany ofthesuppliesLVCMOS33 (USB0_VDDA33, USB1_VDDA33) never exceedsSTATIC18 (USB0_VDDA18, USB1_VDDA18, DDR_DVDD18, SATA_VDDR, DVDD18) by more than2 V. (3) IfRTC isnotused/maintainedon a separatesupply,itcan be includedintheSTATIC12 (fixed1.2V) group. (4) IfusingCVDD atfixed1.2V,all1.2-Vrailsmay be combined. (5) IfDVDD3318_A, B,and C arepowered independently,maximum power foreach railwillbe 1/3theabove maximum power. 2 High-Integration,High-EfficiencyPower SolutionUsingDC/DC ConvertersWith SLVA340A –June 2009–RevisedMay 2010 DVFS Copyright© 2009–2010,Texas InstrumentsIncorporated
www.ti.com Features
3 Features
The designuses thefollowinghigh-efficiencyDC/DC ConverterwithintegratedFETs . INPUT VOLTAGE ~5V HIGH EFFICIENCY AND INTEGRATION (w DVFS) COMBINE RTC AND STATIC 1.2 Core 1.2V at600 mA TPS65023 Static1.2V + VRTC at251 mA Static1.8V at230 mA Static3.3V at115 mA Here,VRTC isincludedintheSTATIC12 (fixed1.2V) group. TPS65023
- 1.5-A,90% EfficientStep-Down ConverterforProcessorCore (VDCDC1)
- 2 × 200-mA General-PurposeLDO
- 1.2-A,Up to95% EfficientStep-Down ConverterforSystem Voltage(VDCDC2)
- 1-A,92% EfficientStep-Down ConverterforMemory Voltage(VDCDC3)
- Dynamic VoltageManagement forProcessorCore
- I2C ™ CompatibleSerialInterface More informationon thedevicecan be foundfromthedatasheets
- TPS65023, http://focus.ti.com/lit/ds/symlink/tps65023.pdf 3SLVA340A –June 2009–RevisedMay 2010 High-Integration,High-EfficiencyPower SolutionUsingDC/DC ConvertersWith DVFS Copyright© 2009–2010,Texas InstrumentsIncorporated
Features www.ti.com Figure1.PMP4977 ReferenceDesign Schematic 4 High-Integration,High-EfficiencyPower SolutionUsingDC/DC ConvertersWith SLVA340A –June 2009–RevisedMay 2010 DVFS Copyright© 2009–2010,Texas InstrumentsIncorporated
www.ti.com ListofMaterial Propersequencingisensuredinthedesignwiththeuse ofsimplecircuitsinvolvingtheuse ofNPN transistorsas required.Core 1.2V at600 mA comes first,whichinturnislevel-shiftedtoinputvoltage usingNPN transistorstoenabletheDCDC3_EN ;hence,static1.2V + VRTC at251 mA comes up which alsoenabletheDCDC2_EN and sequentiallystatic1.8V at230 mA comes up.This1.8-Voutputfrom DCDC2 converterenabletheLDO and hence atlaststatic3.3V at115 mA comes up. (1) Use threesuch LDOs topower up DVDDA, DVDDB, and DVDDC. (Itcan eitherbe 1.8V or3.3V.) (2) Rx = 0.499M Ω,Ry = 1 M Ω forVout= 1.8V (3) Rx = 1.8M Ω,Ry = 1 M Ω forVout= 3.3V (4) Forpropersequencingofoutput,enableoftheLDOs arefedeitherfrom1.2-VoutputfromDCDC3 converter ifDVDDX is1.8V orfrom1.8-VoutputfromDCDC2 converterifDVDDX is3.3V. Figure2.OptionalcircuitforDVDD_A, DVDD_B and DVDD_C
4 ListofMaterial
Table1.PMP4977 ListofMaterial Count RefDes Value Description Size PartNumber MFR Area 8 C1 10 mF Capacitor,Ceramic,6.3V,X5R, 10% 805 C2012X5R0J106K TDK 10560 C2 10 mF Capacitor,Ceramic,6.3V,X5R, 10% 805 C2012X5R0J106K TDK 10560 2 C3 2.2F Capacitor,Ceramic,6.3V,X5R, 10% 603 C1608X5R0J225K TDK 5650 C4 2.2F Capacitor,Ceramic,6.3V,X5R, 10% 603 C1608X5R0J225K TDK 5650 C5 10 F Capacitor,Ceramic,6.3V,X5R, 10% 805 C2012X5R0J106K TDK 10560 C6 10 F Capacitor,Ceramic,6.3V,X5R, 10% 805 C2012X5R0J106K TDK 10560 4 C7 1.0F Capacitor,Ceramic,6.3V,X5R,10% 603 C1608X5R0J105K TDK 5650 C8 1.0F Capacitor,Ceramic,6.3V,X5R,10% 603 C1608X5R0J105K TDK 5650 C9 10 F Capacitor,Ceramic,6.3V,X5R, 10% 805 C2012X5R0J106K TDK 10560 C10 10 F Capacitor,Ceramic,6.3V,X5R, 10% 805 C2012X5R0J106K TDK 10560 C11 1.0F Capacitor,Ceramic,6.3V,X5R,10% 603 C1608X5R0J105K TDK 5650
1 C12 1500 pF Capacitor,Ceramic,50V,X7R, 10% 603 C1608X7R1H152K TDK 5650
2 C13 2.2F Capacitor,Ceramic,6.3V,X5R,10% 603 C1608X5R0J225K TDK 5650 C14 2.2F Capacitor,Ceramic,6.3V,X5R,10% 603 C1608X5R0J225K TDK 5650 C15 10 F Capacitor,Ceramic,6.3V,X5R, 10% 805 C2012X5R0J106K TDK 10560 C16 10 F Capacitor,Ceramic,6.3V,X5R, 10% 805 C2012X5R0J106K TDK 10560 C17 1.0F Capacitor,Ceramic,6.3V,X5R,10% 603 C1608X5R0J105K TDK 5650 3 J1 PTC36SAAN Header,2 pin,100milspacing,(36-pinstrip) 0.100x 2 PTC36SAAN Sullins 23100 1 J2 PEC36SAAN Header,Male 5-pin,100milspacing,(36-pin 0.100inchx 5 PEC36SAAN Sullins 60000 strip) J3 PTC36SAAN Header,2 pin,100milspacing,(36-pinstrip) 0.100x 2 PTC36SAAN Sullins 23100 1 J4 PTC36SAAN Header,4 pin,100milspacing,(36-pinstrip) 0.100x 4 PTC36SAAN Sullins 45100 J5 PTC36SAAN Header,2 pin,100milspacing,(36-pinstrip) 0.100x 2 PTC36SAAN Sullins 23100 1 J6 22-05-3041 Header,FrictionLock Ass'y,4 pinRight 0.400x 0.500 22-05-3041 Molex 227,900 Angle 5SLVA340A –June 2009–RevisedMay 2010 High-Integration,High-EfficiencyPower SolutionUsingDC/DC ConvertersWith DVFS Copyright© 2009–2010,Texas InstrumentsIncorporated
ListofMaterial www.ti.com Table1.PMP4977 ListofMaterial(continued) Count RefDes Value Description Size PartNumber MFR Area 1 L3 2.2mH Inductor,SMT, 1.5A,87 m Ω 0.137X 0.147inch VLF4012AT-2R2M1R5 TDK 29320
4 Q1 2N3904 Transistor,NPN, 40V,200mA, 625mW TO-92 2N3904 Fairchild 37800
Q2 2N3904 Transistor,NPN, 40V,200mA, 625mW TO-92 2N3904 Fairchild 37800 Q3 2N3904 Transistor,NPN, 40V,200mA, 625mW TO-92 2N3904 Fairchild 37800 Q4 2N3904 Transistor,NPN, 40V,200mA, 625mW TO-92 2N3904 Fairchild 37800
4 R1 10k Resistor,Chip,1/16W,1% 603 CRCW0603-xxxx-F Vishay 9100
R2 10k Resistor,Chip,1/16W,1% 603 CRCW0603-xxxx-F Vishay 9100 R3 10k Resistor,Chip,1/16W,1% 603 CRCW0603-xxxx-F Vishay 9100 R4 10k Resistor,Chip,1/16W,1% 603 CRCW0603-xxxx-F Vishay 9100
2 R5 100k Resistor,Chip,1/16W,1% 603 CRCW0603-xxxx-F Vishay 9100
R6 100k Resistor,Chip,1/16W,1% 603 CRCW0603-xxxx-F Vishay 9100
5 R7 100k Resistor,Chip,1/16W,1% 603 Std Std 9100
1 R8 10 Resistor,Chip,1/16W,1% 603 Std Std 9100
1 R9 1.65M Resistor,Chip,1/16W,1% 603 Std Std 9100
1 R10 499k Resistor,Chip,1/16W,1% 603 Std Std 9100
1 R11 49.9k Resistor,Chip,1/16W,1% 603 Std Std 9100 R12 100k Resistor,Chip,1/16W,1% 603 Std Std 9100 R13 100k Resistor,Chip,1/16W,1% 603 Std Std 9100 R14 100k Resistor,Chip,1/16W,1% 603 Std Std 9100 R15 100k Resistor,Chip,1/16W,1% 603 Std Std 9100 2 R16 4.75k Resistor,Chip,1/16W,1% 603 Std Std 9100 R17 4.75k Resistor,Chip,1/16W,1% 603 Std Std 9100
2 R18 1M Resistor,Chip,1/16W,1% 603 Std Std 9100
R19 1M Resistor,Chip,1/16W,1% 603 Std Std 9100 1 SW1 KT11P2JM Switch,SPST, PB Momentary,Sealed 0.245X 0.251 KT11P2JM C & K 111,600 Washable
1 U1 TPS65023RSB IC,Power Management IC forLi-Ion QFN TPS65023RSB TI 69696
Notes:1. These assembliesareESD sensitive,ESD precautionsshallbe observed. 2. These assembliesmust be cleanand freefromfluxand allcontaminants. Use ofno cleanfluxisnotacceptable. 3. These assembliesmust complywithworkmanshipstandardsIPC-A-610Class2. 4. Ref designatorsmarked withan asterisk('**')cannotbe substituted. Allothercomponents can be substitutedwithequivalentMFG 's components. 6 High-Integration,High-EfficiencyPower SolutionUsingDC/DC ConvertersWith SLVA340A –June 2009–RevisedMay 2010 DVFS Copyright© 2009–2010,Texas InstrumentsIncorporated
0.01 0.1 1 10 100 1□k 10□k I -□Output□Current□-□mAO Efficiency□-□% T =□25°C V =□1.8□V PWM/PFM□Mode A O V =□4.2□VI V =□2.5□VI V =□3.6□VI V =□5□VI 100 0.01 0.1 1 10 100 1□k 10□k I -□Output□Current□-□mAO Efficiency□-□% T =□25°C V =□1.2□V PWM/PFM□Mode A O V =□4.2□VI V =□2.5□VI V =□3.6□VI V =□5□VI www.ti.com ListofMaterial
4.1 TestResults
The start-upwaveform shown inFigure3 specifiestherequiredsequence. Figure3.Shows Sequencing inStart-UpWaveform Figure4.DCDC1: Efficiencyvs Output Current Figure5.DCDC2: Efficiencyvs Output Current 7SLVA340A –June 2009–RevisedMay 2010 High-Integration,High-EfficiencyPower SolutionUsingDC/DC ConvertersWith DVFS Copyright© 2009–2010,Texas InstrumentsIncorporated
0.01 0.1 1 10 100 1□k 10□k I -□Output□Current□-□mAO Efficiency□-□% T =□25°C V =□1.8□V PWM/PFM□Mode A O V =□4.2□VI V =□2.5□VI V =□3.6□VI V =□5□VI ListofMaterial www.ti.com Figure6.DCDC3: Efficiencyvs Output Current 8 High-Integration,High-EfficiencyPower SolutionUsingDC/DC ConvertersWith SLVA340A –June 2009–RevisedMay 2010 DVFS Copyright© 2009–2010,Texas InstrumentsIncorporated
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