KSG60ZM81T02

DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 21

Technical content

Copyright © 2017 Toshiba Memory Corporation. All rights reserved. Client SSD SG6 Series Brochure Rev.1.00 Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using, customers must refer to and comply with the latest versions of the product specifications. SSD ｆ Standard Models 2.5-type (7.0 mm height) M.2 2280-S2 Single-sided M.2 2280-D2 Double-sided Model Number KSG60ZSE256G KSG60ZSE512G KSG60ZSE1T02 KSG60ZMV256G KSG60ZMV512G KSG60ZM81T02 Memory TLC (BiCS FLASHTM) Interface SATA Rev. 3.3 Maximum Speed 6.0 Gbit/s Command ACS-4 Connector Type Standard SATA M.2 B-M Formatted Capacity1) 256 GB 512 GB 1024 GB 256 GB 512 GB 1024 GB Perfor- mance2) Sequential Read 550 MB/s {524 MiB/s} 550 MB/s {524 MiB/s} Sequential Write

340 MB/s {324

MiB/s}

535 MB/s

{510 MiB/s}

340 MB/s

{324 MiB/s} {510 MiB/s} Supply Voltage 5.0 V ±5 % 3.3 V ±5 % Power Comsump- tion DevSleep 6 mW max. 5 mW max. Size 100.0 mm x 69.85 mm x 7.0 mm 80.0 mm x 22.0 mm x 2.23 mm 80.0 mm x 22.0 mm x 3.58 mm KEY FEATURES  64-layer, 3-bit-per-cell (TLC) BiCS FLASH™  Capacities up to 1024GB  SATA Revision 3.3, 6.0 Gbit/s interface  2.5-type and M.2 2280 form factor options

APPLICATIONS

 Desktop PCs  Notebook PCs SG6 SERIES (Non-SED Model) CLIENT SSD SG6 Series is a Client SATA SSD lineup using 64 -layer, 3-bit-per-cell(TLC) BiCS FLASHTM. The SG6 series SSDs with up to 1024GB capacity, delivers performance of up to 550MB/s sequential read and 535MB/s sequential write. Furthermore, active power consumption was decreased by up to 40% compared to previous SG5 series, enabling increased battery life for mobile computing. Offered in both traditional 2.5-type(7mm height) and compact M.2 2280 form factors, SG6 series is engineered for mainstream desktop PCs and notebook PCs as well as consumer upgrades. Product image may represent a design model SPECIFICATIONS

Copyright © 2017 Toshiba Memory Corporation. All rights reserved. Client SSD SG6 Series Brochure Rev.1.00 Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using, customers must refer to and comply with the latest versions of the product specifications. Note: 1) Definition of capacity: Toshiba Memory Corporation defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1GB = 230 = 1,073,741,824 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, such as Microsoft Operating System and/or pre-installed software applications, or media content. Actual formatted capacity may vary. 2) 1 MiB (mebibyte) = 220 bytes = 1,048,576 bytes, and 1 MB (megabyte) = 1,000,000 bytes. 3) MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean failure rates for a large number of products which may not accurately reflect actual operation. Actual operating life of the product may be different from the MTTF. * Product image may represent a design model. * Read and write speed may vary depending on the host device, read and write conditions, and file size. * Company names, product names, and service names mentioned herein may be trademarks of their respective companies. Standard Models 2.5-type (7.0 mm Height) M.2 2280-S2 Single-sided M.2 2280-D2 Double-sided Tempera- ture Operating 0 to 70 °C (Case Temperature) 0 to 80 °C (Components Temperature) Non- operating -40 to 85 °C Reliability3) Mean Time to Failure (MTTF): 1,500,000 hours Product Life: Approximately 5 years More Features Strong & highly-efficient ECC named QSBCTM is supported. Firmware security feature (only digitally signed firmware can be installed) is supported. Compliance UL, cUL, TÜV, KC, FCC, BSMI, CE, RCM, ISED, VCCI

Copyright © 2017 Toshiba Memory Corporation. All rights reserved. Client SSD SG6 Series Brochure Rev.1.00 Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using, customers must refer to and comply with the latest versions of the product specifications.

ORDERING INFORMATION

1. Product Name K: SSD product 2. Prodct Category SG: SG Series 3. Development Generation 6: Generation 6 4. Option Code 1 0: Non-SED 5. Option Code 2 Z: No-option 6. Connector Type S: Standard SATA M: M.2 B-M 7. Form Factor E: 2.5-type 7 mm H V: M.2 2280 Single Sided 8: M.2 2280 Double Sided 8. Capacity 256G / 512G /1T02 256G is 256 GB, 512G is 512 GB and 1T02 is 1024 GB (1 GB = 1,000,000,000 bytes)

Copyright © 2017 Toshiba Memory Corporation. All rights reserved. Client SSD SG6 Series Brochure Rev.1.00 Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using, customers must refer to and comply with the latest versions of the product specifications. Note: 1) 7mm Height 2) Single Sided 3) Double Sided Note: 1 GB (Gigabyte) = 1,000,000,000 bytes Note: 1) Under the condition of measurement with 128 KiB unit sequential access and 4KiB align and queue depth is 32. (1KiB=1024 bytes.) Model Number Formatted Capacity Form Factor/Connect Type Function Note KSG60ZSE256G 256 GB 2.5-type1) Standard SATA Non-SED KSG60ZSE512G 512 GB KSG60ZSE1T02 1,024 GB KSG60ZMV256G 256 GB M.2 2280-S22) -B-M Non-SED KSG60ZMV512G 512 GB KSG60ZM81T02 1,024 GB M.2 2280-D23) -B-M Capacity Total Number of User Addressable Sectors in LBA Mode 512 bytes sector

256 GB 500,118,192

512 GB 1,000,215,216

1,024 GB 2,000,409,264 Standard Models KSG60ZSE256G KSG60ZMV256G KSG60ZSE512G KSG60ZMV512G KSG60ZSE1T02 KSG60ZM81T02 Interface Speed 6.0 Gbit/s max. Sequential Read1) 550 MB/s {524 MiB/s} Sequential Write1) 340 MB/s {324 MiB/s} {510 MiB/s} {510 MiB/s} PRODUCT LINE UP CAPACITY PERFORMANCE

Copyright © 2017 Toshiba Memory Corporation. All rights reserved. Client SSD SG6 Series Brochure Rev.1.00 Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using, customers must refer to and comply with the latest versions of the product specifications. Standard Models 2.5-type M.2 2280 Module Allowable voltage 5.0 V ±5 % 3.3 V ±5 % Allowable noise/ripple 100 mV p-p or less Allowable supply rise time 2 –100 ms Note: The drive has over current protection circuit. (Rated current: 3.15A) Note: 1) Ambient Temperature 2) The values are specified at the condition causing maximum power consumption, i.e., maximum workload, default maximum parallel number of flash memory operation and no thermal control effect. 3) The values are based on using SATA power management features. The Slumber mode is used for the power consumption measurements. 4) The drive may internally write to flash memory. Therefore, drive power consumption may temporally change up to write power. Operation (Ta1)=25°C) 2.5-type KSG60ZSE256G KSG60ZSE512G KSG60ZSE1T02 Idle 33)4) 60 mW typ. 65 mW typ. 70 mW typ. Standby3)4) 60 mW typ. 65 mW typ. 70 mW typ. Sleep3) 60 mW typ. 65 mW typ. 70 mW typ. DevSleep 6 mW max. Operation (Ta 1)=25°C) M.2 2280 Module KSG60ZMV256G KSG60ZMV512G KSG60ZM81T02 Idle 33)4) 55 mW typ. 60 mW typ. 65 mW typ. Standby3)4) 55 mW typ. 60 mW typ. 65 mW typ. Sleep3) 55 mW typ. 60 mW typ. 65 mW typ. DevSleep 5 mW max. SUPPLY VOLTAGE POWER CONSUMPTION

Copyright © 2017 Toshiba Memory Corporation. All rights reserved. Client SSD SG6 Series Brochure Rev.1.00 Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using, customers must refer to and comply with the latest versions of the product specifications. ENVIRONMENTAL CONDITIONS Note: 1) Ta: Ambient Temperature, Tc: Case or Components Temperature 2) Packaged in Toshiba Memory Corporation’s original shipping package Note: 1) Packaged in Toshiba Memory Corporation’s original shipping package Note: 1) Apply shocks in each direction of the drive’s three mutually perpendicular axes, one axis at a time. Packaged in Toshiba Memory Corporation’s original shipping package Condition Range Gradient 2.5-type M.2 2280 Module Operating1) 0 °C (Tc) – 70 °C (Tc) (Case Temperature) 0 °C (Tc) – 80 °C (Tc) (Components Temperature) 30 °C (Ta) / h maximum Non-operating -40 °C – 85 °C 30 °C / h maximum Under Shipment2) -40 °C – 85 °C 30 °C / h maximum Condition Range Operating 8 % – 90 % R.H. (No condensation) Non-operating 8 % – 95 % R.H. (No condensation) Under Shipment1) 5 % – 95 % R.H. Max. wet bulb 32.5 °C (Operating) 40.0 °C (Non-operating / Shipping) Condition Range Operating 14.709 km/s2 {1,500 G}, 0.5 ms half sine wave Non-operating Under Shipment1) 100 cm free drop Condition Range Operating 196 m/s2 {20 G} Peak, 10 - 2,000 Hz (20 minutes per axis) x 3 axis Non-operating TEMPERATURE HUMIDITY SHOCK STANDARDS VIBRATION STANDARDS

Copyright © 2017 Toshiba Memory Corporation. All rights reserved. Client SSD SG6 Series Brochure Rev.1.00 Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using, customers must refer to and comply with the latest versions of the product specifications. COMPLIANCE Note: 1) UL certification is basically on a voluntary basis. Title Description Region UL (Underwriters Laboratories) UL 60950-1 USA1) cUL (Underwriters Laboratories of Canada) CSA-C22.2 No.60950-1-07 Canada TÜV (Technischer Überwachungs Verein) EN 60950-1 EURO KC KN32, KN35 Korea FCC FCC part 15 Subpart B USA BSMI (Bureau of Standards, Metrology and Inspection) CNS13438 (CISPR Pub. 22) Taiwan CE EN 55032, EN 55024 EURO RCM AS/NZS CISPR 32 Australia, New Zealand ISED ICES-003 Canada VCCI Class B Japan Parameter Value Mean Time to Failure 1,500,000 hours Product Life Approximately 5 years SAFETY / EMI STANDARDS RELIABILITY

Copyright © 2017 Toshiba Memory Corporation. All rights reserved. Client SSD SG6 Series Brochure Rev.1.00 Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using, customers must refer to and comply with the latest versions of the product specifications. MECHANICAL SPECIFICATIONS Figure 1: Dimensions of KSG60ZSExxxx (2.5-type) Model Number Weight Width Height Length KSG60ZSE256G 41 g typ. 69.85 mm 7.0 mm 100.0 mm KSG60ZSE512G 42 g typ. KSG60ZSE1T02 43 g typ.

2.5 TYPE

Copyright © 2017 Toshiba Memory Corporation. All rights reserved. Client SSD SG6 Series Brochure Rev.1.00 Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using, customers must refer to and comply with the latest versions of the product specifications. Dimension SFF-8200 Rev3.21) SFF-8201 Rev3.3 SFF-8223 Rev2.5 SG6 Series SSD (Differences only) Millimeters Inches Millimeters Inches A1 7.00 0.276 A2 0.20 0.008 0.00 0.000 A3 0.50 0.020 A4 69.85 2.750 A5 0.25 0.010 A7 3.5 0.138 A103) - - 30.125 ± 0.28 1.186 ± 0.011 A12 0.38 0.015 A26 M3 N/A A32 M3 N/A A38 3# 3# A41 2.5# 2.5# * = maximum # = minimum number of threads Note:1) SFF-8200: Small Form Factor Standard 2) PCA, Connector not included 3) Connector center defined the same as SFF-8223 All DIMENSIONS OF KSG60ZSExxxx

Copyright © 2017 Toshiba Memory Corporation. All rights reserved. Client SSD SG6 Series Brochure Rev.1.00 Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using, customers must refer to and comply with the latest versions of the product specifications. Unit:mm Figure 2: Dimensions of KSG60ZMVxxxx (M.2 2280-S2 Module) Model Number Weight Width Height Length KSG60ZMV256G 6.9 g typ. 22.00 mm 2.23 mm 80.00 mm KSG60ZMV512G 6.9 g typ. KSG60ZM81T02 8.3 g typ. 3.58 mm M.2 2280 MODULE

Copyright © 2017 Toshiba Memory Corporation. All rights reserved. Client SSD SG6 Series Brochure Rev.1.00 Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using, customers must refer to and comply with the latest versions of the product specifications. Unit:mm Figure 3: Dimensions of KSG60ZM81T02 (M.2 2280-D2 Module)

Copyright © 2017 Toshiba Memory Corporation. All rights reserved. Client SSD SG6 Series Brochure Rev.1.00 Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using, customers must refer to and comply with the latest versions of the product specifications. Unit:mm Figure 4: 2.5-type Serial ATA Interface Connector

Copyright © 2017 Toshiba Memory Corporation. All rights reserved. Client SSD SG6 Series Brochure Rev.1.00 Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using, customers must refer to and comply with the latest versions of the product specifications.

2.5 TYPE DRIVE CONNECTER PIN ASSIGNMENT1)

Note: 1) The Mate orders are for backplane usage. Hot-Plug and OS-Aware Hot Removal are supported when using with a backplane connector. 2) Previously, 3.3 V was assigned to pins P1, P2 and P3 by Serial ATA International Organization. 3) Direct connect to non pre-charge pins. Segment Pin Position Name Description Signal Segment S1 GND 2nd Mate S2 A+ Differential Signal Pair A (Device Rx), 3rd Mate S3 A- S4 GND 2nd Mate S5 B- Differential Signal Pair B (Device Tx), 3rd Mate S6 B+ S7 GND 2nd Mate Signal segment “L” Central connector polarizer Power segment “L” Power Segment P1 Retired2) P2 Retired2) P3 DEVSLP2) Enter/Exit DevSleep P4 GND 1st Mate P5 GND 2nd Mate P6 GND 2nd Mate P7 V5 5 V power, pre-charge3), 2nd Mate P8 V5 5 V power, 3rd Mate P9 V5 5 V power, 3rd Mate P10 GND 2nd Mate P11 DAS/DSS Drive Activity Signal / Disable Staggered Spin-up, 3rd Mate P12 GND 1st Mate P13 V12 12 V power, pre-charge, 2nd Mate (Unused) P14 V12 12 V power (Unused), 3rd Mate P15 V12 12 V power (Unused), 3rd Mate Power segment key

Copyright © 2017 Toshiba Memory Corporation. All rights reserved. Client SSD SG6 Series Brochure Rev.1.00 Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using, customers must refer to and comply with the latest versions of the product specifications. M.2 2280 MODULE Unit:mm Figure 5: Interface Dimensions of KSG60ZMVxxxx (M.2 2280-S2 Module)

Copyright © 2017 Toshiba Memory Corporation. All rights reserved. Client SSD SG6 Series Brochure Rev.1.00 Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using, customers must refer to and comply with the latest versions of the product specifications. Unit:mm Figure 6: Interface Dimensions of KSG60ZM81T02 (M.2 2280-D2 Module)

Copyright © 2017 Toshiba Memory Corporation. All rights reserved. Client SSD SG6 Series Brochure Rev.1.00 Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using, customers must refer to and comply with the latest versions of the product specifications. M.2 2280 MODULE CONNECTOR PIN ASSIGNMENT Pin # Name Description Pin # Name Description 1 CONFIG_3 Defines module type(GND) 2 +3.3V 3.3 V Source 3 GND GND 4 +3.3V 3.3 V Source

5 Reserved NC 6 Reserved NC

7 Reserved NC 8 Reserved NC

9 Reserved NC 10 DAS/DSS Drive Activity Signal /

11 Reserved NC Notch

20 Reserved NC

21 CONFIG_0 Defines module type(GND) 22 Reserved NC

23 Reserved NC

24 Reserved NC

25 Reserved NC 26 Reserved NC

27 GND GND 28 Reserved NC

29 Reserved NC 30 Reserved NC

31 Reserved NC 32 Reserved NC

33 GND GND 34 Reserved NC

35 Reserved NC 36 Reserved NC

37 Reserved NC 38 DEVSLP DEVSLP signal

39 GND GND 40 Reserved NC

41 B+ Host Receiver Differential

42 Reserved NC

43 B- 44 Reserved NC

45 GND GND 46 Reserved NC

47 A- Host Transmitter

48 Reserved NC

49 A+ 50 Reserved NC

51 GND GND 52 Reserved NC

53 Reserved NC 54 Reserved NC

55 Reserved NC 56 MFG1 Manufacturing pin. Must be a no-connect on the host board. 57 GND GND 58 MFG2 Notch Notch

67 Reserved NC 68 Reserved NC

69 CONFIG_1 Defines module type(GND) 70 +3.3V 3.3 V Source 71 GND GND 72 +3.3V 3.3 V Source 73 GND GND 74 +3.3V 3.3 V Source

75 CONFIG_2 Defines module type(GND)

Copyright © 2017 Toshiba Memory Corporation. All rights reserved. Client SSD SG6 Series Brochure Rev.1.00 Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using, customers must refer to and comply with the latest versions of the product specifications. COMMAND TABLE Op-Code Command Name 00h NOP 06h DATA SET MANAGEMENT 10h RECALIBRATE 20h READ SECTOR(S) 21h READ SECTOR(S) without retries 24h READ SECTOR(S) EXT 25h READ DMA EXT 27h READ NATIVE MAX ADDRESS EXT 29h READ MULTIPLE EXT 2Fh READ LOG EXT 30h WRITE SECTOR(S) 31h WRITE SECTOR(S) without retries 34h WRITE SECTOR(S) EXT 35h WRITE DMA EXT 37h SET MAX ADDRESS EXT 39h WRITE MULTIPLE EXT 3Dh WRITE DMA FUA EXT 3Fh WRITE LOG EXT 40h READ VERIFY SECTOR(S) 41h READ VERIFY SECTOR(S) without retries 42h READ VERIFY SECTOR(S) EXT 45h WRITE UNCORRECTABLE EXT 45h 55h Create a pseudo-uncorrectable error with logging 45h AAh Create a flagged error without logging 47h READ LOG DMA EXT 57h WRITE LOG DMA EXT 5Bh TRUSTED NON-DATA 5Ch TRUSTED RECEIVE 5Dh TRUSTED RECEIVE DMA 5Eh TRUSTED SEND 5Fh TRUSTED SEND DMA 60h READ FPDMA QUEUED 61h WRITE FPDMA QUEUED 70h SEEK 90h EXECUTE DEVICE DIAGNOSTIC 91h INITIALIZE DEVICE PARAMETERS

Copyright © 2017 Toshiba Memory Corporation. All rights reserved. Client SSD SG6 Series Brochure Rev.1.00 Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using, customers must refer to and comply with the latest versions of the product specifications. Op-Code Feature Name 92h DOWNLOAD MICROCODE 92h 03h Download with offsets and save microcode for immediate and future use 92h 07h Download and save microcode for immediate and future use 92h 0Eb Download with offsets and save microcode for future use 92h 0Fb Activate downloaded microcode 93h DOWNLOAD MICROCODE DMA 93h 03h Download with offsets and save microcode for immediate and future use 93h 07h Download and save microcode for immediate and future use 93h 0Eb Download with offsets and save microcode for future use 93h 0Fb Activate downloaded microcode B0h SMART B0h D0h SMART READ DATA B0h D1h SMART READ ATTRIBUTE THRESHOLDS B0h D2h SMART ENABLE/DISABLE ATTRIBUTE AUTOSAVE B0h D3h SMART SAVE ATTRIBUTE VALUES B0h D4h SMART EXECUTE OFF-LINE IMMEDIATE B0h D5h SMART READ LOG B0h D6h SMART WRITE LOG B0h D8h SMART ENABLE OPERATIONS B0h D9h SMART DISABLE OPERATIONS B0h DAh SMART RETURN STATUS B0h DBh SMART ENABLE/DISABLE AUTOMATIC OFF-LINE B1h DEVICE CONFIGURATION OVERLAY B1h C0h DEVICE CONFIGURATION RESTORE B1h C1h DEVICE CONFIGURATION FREEZE LOCK B1h C2h DEVICE CONFIGURATION IDENTIFY B1h C3h DEVICE CONFIGURATION SET B1h C4h DEVICE CONFIGURATION IDENTIFY DMA B1h C5h DEVICE CONFIGURATION SET DMA B4h SANITIZE DEVICE B4h 00h SANITIZE STATUS EXT B4h 11h CRYPTO SCRAMBLE EXT B4h 12h BLOCK ERASE EXT B4h 20h SANITIZE FREEZE LOCK EXT

Copyright © 2017 Toshiba Memory Corporation. All rights reserved. Client SSD SG6 Series Brochure Rev.1.00 Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using, customers must refer to and comply with the latest versions of the product specifications. Op-Code Feature Name C4h READ MULTIPLE C5h WRITE MULTIPLE C6h SET MULTIPLE MODE C8h READ DMA C9h READ DMA without retries CAh WRITE DMA CBh WRITE DMA without retries CEh WRITE MULTIPLE FUA EXT E0h STANDBY IMMEDIATE E1h IDLE IMMEDIATE E2h STANDBY E3h IDLE E4h READ BUFFER E5h CHECK POWER MODE E6h SLEEP E7h FLUSH CACHE E8h WRITE BUFFER E9h READ BUFFER DMA EAh FLUSH CACHE EXT EBh WRITE BUFFER DMA ECh IDENTIFY DEVICE EFh SET FEATURES EFh 02h Enable volatile write cache EFh 03h Set transfer mode EFh 05h Enable the APM feature set EFh 10h Enable use of SATA feature set EFh 55h Disable read look-ahead EFh 66h Disable reverting to power-on defaults EFh 82h Disable volatile write cache EFh 85h Disable the APM feature set EFh 90h Disable use of SATA feature set EFh AAh Enable read look-ahead EFh CCh Enable reverting to power-on defaults

Copyright © 2017 Toshiba Memory Corporation. All rights reserved. Client SSD SG6 Series Brochure Rev.1.00 Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using, customers must refer to and comply with the latest versions of the product specifications. Op-Code Feature Name F1h SECURITY SET PASSWORD F2h SECURITY UNLOCK F3h SECURITY ERASE PREPARE F4h SECURITY ERASE UNIT F5h SECURITY FREEZE LOCK F6h SECURITY DISABLE PASSWORD F8h READ NATIVE MAX ADDRESS F9h SET MAX ADDRESS F9h 01h SET MAX SET PASSWORD F9h 02h SET MAX LOCK F9h 03h SET MAX UNLOCK F9h 04h SET MAX FREEZE LOCK F9h 05h SET MAX SET PASSWORD DMA F9h 06h SET MAX UNLOCK DMA

Copyright © 2017 Toshiba Memory Corporation. All rights reserved. Client SSD SG6 Series Brochure Rev.1.00 Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using, customers must refer to and comply with the latest versions of the product specifications. RESTRICTIONS ON PRODUCT USE Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as “TOSHIBA”. Hardware, software and systems described in this document are collectively referred to as “Product”.  TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.  This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.  Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.  PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MA Y CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales representative.  Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.  Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations.  The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.  ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.  Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.  Product may include products subject to foreign exchange and foreign trade control laws.  Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.