KP3020O60A1C KODENSHI | Alldatasheet

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AUK CORP. KP3020O60A1C 1. Descriptions The KP3020O60A1C is a small and thin form plastic leaded chip carrier(PLCC) 2-pin package with AlInGaP Orange Chip Orange LED. 2. Features ◆ Small Footprint Surface Mount Package ( 3.0 L × 2.0 W × 1.3 H [mm]) ◆ Typical Forward Voltage(VF) : 2.0 V @ Forward Current(IF)=20mA ◆ Operation Temperature from -40℃ to +85℃ ◆ Soldering methods : IR reflow soldering ◆ Taping : 8㎜ conductive black carrier tape & antistatic clear cover tape 3. Applications ◆ Interior lighting ◆ General lighting ◆ Indoor and out door displays ◆ Architectural / Decorative lighting The contents of this data sheet are subject to change without advance notice for the purpose of improvement. When using this product, would you please refer to the latest specifications. Rev. O date : 01-September-15 AUK-LDM-001(A)

AUK CORP. KP3020O60A1C 4. Outline Dimensions and Material Descriptions ◆ Outline Dimensions ◆ Material Descriptions The contents of this data sheet are subject to change without advance notice for the purpose of improvement. When using this product, would you please refer to the latest specifications. Rev. O date : 01-September-15 AUK-LDM-001(A) Ag Epoxy Material ྙ Frame Resin PPA ITEM AlInGaP / GaAsྛ No. ྚ Paste LED Chip ྜ Wire Au Clear Silicone ᐲ ᐱ Encapsulant Cu alloyElectrode ᐭ ᐮ ᐯ ᐱ ᐲ ᐰ 1.3 ྙ ྚ 2.7 1.6 0.75 1.3

AUK CORP. KP3020O60A1C 5. Absolute Maximums *1. IFP was measured at Tw ≤ 1 msec of pulse width and D ≤ 1/10 of duty ratio. *2. Soldering time : 5 Sec 6. Electro-Optical Characteristics (TA = 25℃) *1. The luminous intensity IV was measured at the peak of the spatial pattern which may not be align ed with the mechanical axis of the LED package. *2. 2Θ1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensi ty. *3. Measuring Tolerance 7. Ranks ◆ VF, IV, WD @ IF = 20 mA 8. Part Numbering K P The contents of this data sheet are subject to change without advance notice for the purpose of improvement. When using this product, would you please refer to the latest specifications. Rev. O date : 01-September-15 AUK-LDM-001(A) Conditions mW Item UnitSymbol Min. Max. IF - 30 mA mA60 ConditionsUnit IF=20mA IF=20mA -120 -40 100 Typ. - 260 Max. VR=5V

150 IF=20mA250 350 mcd

-WD TOP Forward voltage*3 Reverse current 600 2Θ1/2 VF 1.7 -40 Reverse Voltage Operating Temperature Tsol Soldering Temperature*஌ Item 80Power Dissipation VR Luminous intensity* 2.3 Storage Temperature V Symbol Min. Half angle*2 610 deg Forward Current IFP - PD - IF=20mA Peak Forward Current*஋ Ts ȝA V B : 250 ~ 300 C : 300 ~ 350 Luminuous Intensity [mcd]Forward Voltage [V] Wavelength [nm] Dominant nm

3020 O60 A1C

A : 200 ~ 250 A0 : 150 ~ 2001 : 1.7 ~ 1.9 2 : 1.9 ~ 2.1 3 : 2.1 ~ 2.3 Lead, Chip Q'ty, PKG Thickness Color(Orange), WD PKG. Size PKG. Type(P=PLCC) K : AUK a : 600 ~ 605 b : 605 ~ 610

AUK CORP. KP3020O60A1C 9. Characteristic Graphs The contents of this data sheet are subject to change without advance notice for the purpose of improvement. When using this product, would you please refer to the latest specifications. Rev. O date : 01-September-15 AUK-LDM-001(A) Forward Current Vs Ambient Temperature Relative Luminous Intensity vs. Forward Current Relative Luminous Intensity vs. Ambient Temperature Forward Current vs. Forward Voltage Relative Intensity vs. Wavelength Radiant Pattern Forward Current IF Relative Luminous Intensity [arb.] Ambient Temperature Ta Forward Voltage VF Forward Current IF Relative Intensity(%) Angle(deg) (%) +20 +100 100 +80 +40 +60 -80 -100 100 -20 -40 -60 1.50 0.5 1.0 3.02.0 2.5 3.5 (V) 0 5 10 0.5 (IF) 1.5 15 20 25 30 35 100 0.1 -20 40 200 80 60 ࣥ℃ࣤ 700 Wavelength(Ȝ) Relative intensity 400 300 500 600 (%) 100 1000800 900 (㎚) Ambient temperature(Ta) 400 20 60 (℃) Forward current( I )F (㎃) Relative Luminous Intensity [arb.]