KBU6005 HDSEMI | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 3
Technical content
Features
o 6.0A
- VRRM 50V-1000V
- High surge current capability
Applications
Polarity: Color band denotes cathode K BU6XX H igh Diode Semiconductor KBU Plastic-Encapsulate Bridge Rectifier General purpose 1 phase Bridge rectifier applications K BU +~~_ KBU6005 THRU KBU610 Item Symbol Unit Conditions KBU6 005 01 02 04 06 08 10 Repetitive Peak Reverse Voltage V RRM V 50 100 200 400 600 800 1000 Average Rectified Output Current I O A 60H Z sine wave, R- load Tc=115℃ 6 Surge(Non-repetitive)Forward Current I FSM A 60H Z sine wave, 1 cycle, T a =25℃ 175 Current Squared Time I t A s 1ms≤t＜8.3ms T j =25℃,Rating of per diode Storage Temperature T stg -55 ~+150 Junction Temperature T j -55 ~+150
Electrical Characteristics
a =25℃ Unless otherwise specified ） Item Symbol Unit Test Condition Max Peak Forward Voltage V FM V I FM =6A Pulse measu r ement Ratin g of p e r diode 1.0 Peak Reverse Current I RRM μA V RM RRM , Pulse measurement, Rating of per diode Thermal Resistance R θ J-A ℃/W Between junction and ambient (1) R θ J-C Bet w een j unction and case (2)
H igh Diode Semiconductor The cruve graph is for reference only, can't be the basis for judgment FIG.3-MAXIMUM NON-RETETITIVE PEAK FORWARD SURGE CURRENT NUMBER OF CYCLES AT 60H Z PEAK FORWARD SURGE CURRENT AMPERES 250 200 100 150 100 0.1 100 120 140 1.0 FIG.4-TYPICAL REVERSE CHARACTERISTICS PERCENT OF RATED PEAK REVERSE INSTANTANCEOUS REVERSE CURRENT, MICRAMPERES T J =25 T J =100 FIG.2 TYPICAL INSTANTANEOUS FORWARD CHARACTERISTIC INSTANTANCEOUS FORWARD CURRENT, AMPERES INSTANTANEOUS FORWARD VOLTAGE，VOLTS 100 0.1 1.2 1.1 1.0 0.9 0.8 0.7 0.6 4.0 1.0 0.4 0.2 1.3 T J =25 PULSE WIDTH=300S 1%DUTY CYCLE FIG.5-TYPICAL JUNCTION CAPACITANCE PER ELEMENT REVERSE VOLTAGE ,VOLTS CAPACITANCE,(pF) 400 100 100 T J =25 FIG.1-DERATING CURVE FOR OUTPUT RECTIFIED CURRENT AVERAGE FORWARD OUTPUTCURRENT AMPERES CASE TEMPERATURE, 50 1000 150 1.0 5.0 4.0 3.0 2.0 6.0 8.0 7.0 HEAT SINK MOUNTING MOUNTED ON4*4 INCH COPPER PC BOARD.TA .51(1.27mm)LEAD LENGTH
H igh Diode Semiconductor K BU Dimensions in inches and (milimeters) .935(23.7) .895(22.7) .600(16.8) .700(17.8) 300 (7.5) .780(19.8) .740(18.8) (25.4) 1.00 MIN. .052(1.3)DIA. .048(1.2)TYP. .071(1.8) .180(4.6) .256(6.5) .276(7.0) .15 X23L (3.8 X5.7L) HOLE THRU .165(4.2)*45°