KBL00 DEC | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 2

Technical content

FEATURES

Data Sheet No. BKBL-400-1C MECHANICAL SPECIFICATION

4 AMP SILICON BRIDGE RECTIFIERS

Case: Terminals: Round silver plated pins Soldering: Per MIL-STD 202 Method 208 guaranteed Polarity: Marked on case Mounting Position: Any Weight: 0.2 Ounces (5.6 Grams) Molded Epoxy (UL Flammability Rating 94V-0) E17 Tel.: (310) 767-1052 Fax: (310) 767-7958 DIOTEC ELECTRONICS CORP. Gardena, CA 90248 U.S.A 18020 Hobart Blvd., Unit B MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS $ % & ' % ( ) *,+ % ' $ - ! ' $ ! .$ ) /0 Average Forward Rectified Current @ T = 65 C 1 2 PARAMETER (TEST CONDITIONS) Maximum DC Blocking Voltage Maximum Peak Recurrent Reverse Voltage Maximum RMS Voltage Series Number V4$56 V787$9 V:8; SYMBOL RATINGS UNITS VOLTS KBLKBL KBL KBL KBL KBL KBL 50 100 200 400 1000 35 70 140 280 700 Peak Forward Surge Current. Single 60Hz Half-Sine Wave Superimposed on Rated Load (JEDEC Method). T = 150 C < = Maximum Forward Voltage (Per Diode) at 4 Amps DC VOLTS AMPS V>#? I@AB 200 0.95 (Typical < 0.90) Maximum Average DC Reverse Current At Rated DC Blocking Voltage IC$D °C/W E A@ T = 25 C F G @ T = 125 C H I 19.0 2.4 Operating and Storage Temperature Range TJ ,TK L#M °C-55 to +150 N O P Q P R S T U 600 800 50 100 200 400 1000600 800 420 560 00 01 02 04 06 08 10 ACTUAL SIZE OF KBL PACKAGE V WYX W#Z cYd e#e#c 0.62015.75 16.00 0.630 f g#h i#ikj#l monqpYr psotvuYw u#x#y ›#œ  ž#Ÿ ¡#¢ £ ÁY ÃÄ Å ÆÈÇ É Ê0Ë Ì Í ÎϘÐÒÑ Ó&Ó&Ñ ÐÒÔ ÕÔ$Ö8×ÙØ Ú8ÛÝÜ0Þ ß àÒá â ãÒä åæÈç0è éÈê0ë ì&í î#ï ð#ðñ#òYó ô A + _ L D C B B1 KBLO8 SERIES KBL00 - KBL10 RDIOTEC U+ _ DIOTEC KBLO8 RU UL RECOGNIZED - FILE #E141956 Typical Thermal Resistance Rõ ö,÷ Rø ùoú Junction to Lead (Note 1) ûüý&þoÿ $ %&' ($ *)+' ,-- $ 01%&2 3 $ % BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE SURGE OVERLOAD RATING TO 200 AMPS PEAK IDEAL FOR PRINTED CIRCUIT BOARD APPLICATIONS VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) VOLTSMinimum Insulation Breakdown Voltage (Circuit to Case) V4 576 2500 RoHS COMPLIANT MECHANICAL DATA

FIGURE 1. FORWARD CURRENT DERATING CURVE FIGURE 2. MAXIMUM NON-REPETITIVE SURGE CURRENT FIGURE 5. TYPICAL JUNCTION CAPACITANCE PER DIODE FIGURE 4. TYPICAL REVERSE CHARACTERISTICS FIGURE 3. TYPICAL FORWARD CHARACTERISTIC PER DIODE