KBJ602G ETC2 | Alldatasheet
Document overview
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Technical content
Features
y Glass passivated die construction y Ideal for printed circuit boards y Plastic material used carries UL flammability recognition 94V-0 y High surge current capability y High temperature soldering guaranteed: 265℃ /10 seconds, 0.375” (9.5mm) lead length, 5lbs. (2.3kg) tension Circuit Mechanical Data Case: Molded plastic case Terminals: Plated leads solderable per MIL-STD-750, Method 2026 Polarity: Marked on Body Mounting Position: Any Module Type TYPE VRRM VRSM KBJ602G KBJ604G KBJ606G KBJ608G KBJ610G 200V 400V 600V 800V 1000V 300V 500V 700V 900V 1100V Maximum Ratings and Thermal Characteristics (TA = 25℃ unless otherwise noted) Symbol Conditions Values Units IF(AV) Maximum average forward output rectified current Tc =50 ℃ 6.0 A IFSM Peak forward surge current single half sine-wave superimposed on rated load (JEDEC Method) 180 A i2t Rating for fusing (t<8.3ms) 134 A2s RθJA RθJC Maximum thermal resistance per leg 26(1) 5.0 (2) ℃/W Tj, TSTG Operating Junction and storage temperature range -55 to +150 ℃ Weight Approximate Weight 4.0 g Electrical Characteristics (TA = 25℃ unless otherwise noted) Symbol Conditions Values Units VF Maximum Instantaneous Forward Voltage per leg I FM =3.0A 1.05 V IR Maximum DC reverse current at rated T A = 25℃ DC blocking voltage per leg T A = 125℃ 5.0 500 µA Notes: (1) Junction to ambient without heatsink (2) Junction to case with heatsink (3) Recommended mounting position is to bolt down on heatsink with silicone thermal compound for maximum heat transfer with M3 screw
D o c u m e n t N u m b e r : K B J 6 0 2 G t h r u K B J 6 1 0 G www. J a n . 1 2 , 2 0 1 1 2 smsemi.com Performance Curves Tj=25ºC f =1MHZ 400 100 Cj, CAPACITANCE (pF) Tj=150ºC 8.3ms Single Half Sine-Wave IF, INSTANTANEOUS FWD CURRENT (A) 100 1.0 0.1 0 50 100 150 TA, AMBIENT TEMPERATURE (ºC) Fig.1 Forward Current Derating Curve Mounted on 4x4 inch Copper PC Board 12.7mm lead length VF, INSTANTANEOUS FORWARD VOLTAGE (V) Fig.2 Typical Fwd Characteristics, per element Tj=25ºC Pulse Width=300μs I (AV), AVERAGE FWD CURRENT (A) IFSM, PEAK FORWARD SURGE CURRENT (A) 180 1 10 100 NUMBER OF CYCLES AT 60Hz Fig.3 Max Non-Repetitive Peak Fwd Surge Current 0.1 1.0 10 100 VR, REVERSE VOLTAGE (V) Fig.4 Typical Junction Capacitance per element Tj=125ºC Tj=25ºC 0 20 40 60 80 100 120 140 RATED PERCENT OF PEAK REVERSE VOLTAGE (%) Fig.5 Typical Reverse Characteristics 1.0 0.1 0.01 IR, INSTANTANEOUS REVERSE CURRENT (μA)
D o c u m e n t N u m b e r : K B J 6 0 2 G t h r u K B J 6 1 0 G www. J a n . 1 2 , 2 0 1 1 3 smsemi.com Package Outline Information + ~ ~ - 0.996(25.3) 0.972(24.7) 0.492 (12.5) 0.602(15.3) 0.669(17.0) 0.157(4.0) 0.059 (1.50) 0.146(3.7) 0.130(3.3) 0.078(1.98) 0.062(1.58) 0.042(1.07) 0.038(0.96) 0.057(1.45) 0.041(1.05) 0.150(3.8) 0.134(3.4) 0.382(9.7) 0.366(9.3) 0.709(18.0) 0.669(17.0) 0.126(3.2) 0.110(2.8) 0.189(4.8) 0.173(4.4) 0.118(3.0)×45° Chamfer 0.303(7.7) 0.287(7.3) (3×) 0.134(3.4) 0.122(3.1) Dia. 0.030(0.77) 0.024(0.62) CASE: KBJ Dimensions in inches (mm)