KBJ2A DAESAN | Alldatasheet

Document overview

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Technical content

Features

  • Glass Passivated Die Construction
  • High Case Dielectric Strength
  • Low Reverse Leakage Current
  • High surge current capability
  • Ideal for Printed Circuit Board Applications
  • Plastic Material - UL Flammability Classification 94V-0 Maximum Ratings And Electrical Characteristics (Ratings at 25¡É ambient temperature unless otherwise specified, Single phase, half wave 60Hz, resistive or inductive load. For capacitive load, derate by 20%) CURRENT 4.0 Amperes VOLTAGE 50 to 1000 Volts Notes: (1) Thermal resistance from junction to case per element. Unit mounted on 300 x 300 x 16mm aluminum plate heat sink. (2) Measured at 1.0MHz and Applied Reverse Voltage of 4.0V DC. Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage RMS Reverse voltage Non-Repetitive Peak Forward Surge Current, 8.3ms single half-sine-wave superimposed on rated load per element (JEDEC method) VoltsForward Voltage (per element) @ IF=4.0 A VRMM VRWM VR

50 Volts

1.0VFM VR(RMS) 4.0 3.0 Amps150IFSM Tj TSTG 500 -55 to +150 ¡É Amps Peak Reverse Current at Rated DC Blocking Voltage Typical Junction Capacitance (Note 1) Operating and Storage Temperature Range KBJ KBJ KBJ KBJ KBJ KBJ KBJ 5.0 100 200 140 400 280 600 420 800 560 1000

700 Volts

¥ìA ¡É/W pF Io IRM Cj R¥èJC @ TC=25¡É @ TC=125¡É Typical Thermal Resistance, Junction to Case (Note 2) 22 0.125 (3.17) x 45 degrees C hamfer 0.080 (2.03) 0.060 (1.50) 0.095 (2.41) 0.080 (2.03) 0.825 (20.9) 0.815 (20.7) 0.050 (1.27) 0.040 (1.02) P olarity shown on front side of case, positive lead beveled corner. 0.040 (1.02) 0.030 (0.76) 0.022 (0.56) 0.018 (0.46) 0.210 0.190 (5.3) (4.8) 0.421 (10.7) 0.411 (10.4) 0.718 (18.2) 0.682 (17.3) 0.140 (3.56) 0.128 (3.25) Lead Depth 0.098 (2.5) 0.075 (1.9) 0.098 (2.5) 0.075 (1.9) 0.022 (0.56) 0.018 (0.46) Dimensions in inches and (millimeters) C as e: Molded plastic body over passivated junctions Terminals : P lated leads solderable per MIL-S T D-750, Method 2026 High temperature soldering guaranteed: 260¡É/10 seconds , 0.375" (9.5mm) lead length, 5lbs. (2.3kg) tension Mounting Pos ition: Any Weight: 0.071 oz., 2.0 g Packaging c odes /options : 1/400 E A. per B ulk Tray S tack Maximum average forward @ T C =50 R ectified output current at @ T A=40¡É

RATING AND CHARACTERISTIC CURVES KBJ2A THRU KBJ2M 0 50 100 150 1.0 2.0 3.0 4.0 5.0 1 10 100 100 150 0.01 0.1 100 0.1 1 10 100 100 1,000 0 20 40 60 80 100 0.01 0.1 100 500 0.01 0.1 1 10 100 0.1 100 F ig. 1 -- Derating C urves Output R ec tified C urrent F ig. 2 -- Maximum Non-R epetitive Peak F orward S urge C urrent Per L eg F ig. 4 -- Typic al R evers e L eakage C harac teris tic s Per L eg F ig. 6 -- Typic al Trans ient T hermal Impedanc e Per L eg F ig. 3 -- Typic al F orward Voltage C harac teris tic s Per L eg F ig. 5 -- Typic al J unc tion C apac itanc e Per L eg Average F orward Output C urrent (A) P eak F orward S urge C urrent (A)Instantaneous R everse C urrent (A)Transient T hermal Impedance (C /W) Instantaneous F orward C urrent (A)J unction C apacitance (pF ) Ambient Temperature (¡É) Number of C ycles at 60Hz P ercent of R ated P eak R everse Voltage (V ) t, Heating Time (sec.) Instantaneous F orward Voltage (V ) R everse Voltage (V )

60 Hz R esistive or Inductive Load

P.C .B . Mounting 0.47 x 0.47" (12 x 12mm) C opper pads with 0.375" (9.5mm) lead length T J = 25¡É P ulse width = 300s 1% Duty C ycle T J = T J max. S ingle S ine-Wave (J E DE C Method) T J = 25¡É f = 1.0MHz V sig = 50mV p-p

1.0 C ycle

T A = 125¡É T A = 25¡É Heat-S ink Mounting 3.0 x 3.0 x 0.11" T hick Aluminum P late 50 --- 400V 600 --- 1000V 50 --- 400V 600 --- 1000V