KBJ10D ETC2 | Alldatasheet
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Technical content
Features
y Glass passivated die construction y Ideal for printed circuit boards y Plastic material used carries UL flammability recognition 94V-0 y High surge current capability y High temperature soldering guaranteed: 265℃ /10 seconds, 0.375” (9.5mm) lead length, 5lbs. (2.3kg) tension Circuit Mechanical Data Case: Molded plastic case Terminals: Plated leads solderable per MIL-STD-750, Method 2026 Polarity: Marked on Body Mounting Position: Any Module Type TYPE VRRM VRSM KBJ10D KBJ10G KBJ10J KBJ10K KBJ10M 200V 400V 600V 800V 1000V 300V 500V 700V 900V 1100V Maximum Ratings and Thermal Characteristics (TA = 25℃ unless otherwise noted) Symbol Conditions Values Units IF(AV) Maximum average forward output rectified current Tc =50 ℃ 10 A IFSM Peak forward surge current single half sine-wave superimposed on rated load (JEDEC Method) 150 A i2t Rating for fusing (t<8.3ms) 94 A2s RθJA RθJC Maximum thermal resistance per leg 26(1) 5.0 (2) ℃/W Tj, TSTG Operating Junction and storage temperature range -55 to +150 ℃ Weight Approximate Weight 4.0 g Electrical Characteristics (TA = 25℃ unless otherwise noted) Symbol Conditions Values Units VF Maximum Instantaneous Forward Voltage per leg I FM =5.0A 1.1 V IR Maximum DC reverse current at rated T A = 25℃ DC blocking voltage per leg T A = 125℃ 5.0 500 µA Notes: (1) Junction to ambient without heatsink (2) Junction to case with heatsink (3) Recommended mounting position is to bolt down on heatsink with silicone thermal compound for maximum heat transfer with M3 screw
D o c u m e n t N u m b e r : K B J 1 0 D t h r u K B J 1 0 M www. J a n . 1 2 , 2 0 1 1 2 smsemi.com Performance Curves Tj=25ºC f =1MHZ 0.1 1.0 10 100 VR, REVERSE VOLTAGE (V) Fig.4 Typical Junction Capacitance per element Tj=25ºC Pulse Width=300μs VF, INSTANTANEOUS FORWARD VOLTAGE (V) Fig.2 Typical Forward Characteristics, per element 100 1.0 0.1 IF, INSTANTANEOUS FWD CURRENT (A) 1 10 100 NUMBER OF CYCLES AT 60Hz Fig.3 Max Non-Repetitive Peak Fwd Surge Current Cj, CAPACITANCE (pF) 400 100 Tj=150ºC 8.3ms Single Half Sine-Wave 150 100 Mounted on 4x4 inch Copper PC Board 12.7mm lend length 0 50 100 150 TA, AMBIENT TEMPERATURE (ºC) Fig.1 Forward Current Derating Curve Tj=125ºC Tj=25ºC 0 20 40 60 80 100 120 140 RATED PERCENT OF PEAK REVERSE VOLTAGE (%) Fig.5 Typical Reverse Characteristics 1.0 0.1 0.01 IR, INSTANTANEOUS REVERSE CURRENT (μA) I (AV), AVERAGE FWD CURRENT (A) IFSM, PEAK FORWARD SURGE CURRENT (A)
D o c u m e n t N u m b e r : K B J 1 0 D t h r u K B J 1 0 M www. J a n . 1 2 , 2 0 1 1 3 smsemi.com Package Outline Information + ~ ~ - 0.996(25.3) 0.972(24.7) 0.492 (12.5) 0.602(15.3) 0.669(17.0) 0.157(4.0) 0.059 (1.50) 0.146(3.7) 0.130(3.3) 0.078(1.98) 0.062(1.58) 0.042(1.07) 0.038(0.96) 0.057(1.45) 0.041(1.05) 0.150(3.8) 0.134(3.4) 0.382(9.7) 0.366(9.3) 0.709(18.0) 0.669(17.0) 0.126(3.2) 0.110(2.8) 0.189(4.8) 0.173(4.4) 0.118(3.0)×45° Chamfer 0.303(7.7) 0.287(7.3) (3×) 0.134(3.4) 0.122(3.1) Dia. 0.030(0.77) 0.024(0.62) CASE: KBJ Dimensions in inches (mm)