KBG30ZMS128G

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Copyright © 2018 Toshiba Memory Corporation. All rights reserved. Client SSD BG3 Series Brochure Rev.1.10 Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using, customers must refer to and comply with the latest versions of the product specifications. SSD Standard Models M.2 1620-S2 Single Package M.2 1620-S3 Single Package M.2 2230-S2 Single-sided M.2 2230-S3 Single-sided Model Number (Non-SED) KBG30ZPZ128G KBG30ZPZ256G KBG30ZPZ512G KBG30ZMS128G KBG30ZMS256G KBG30ZMS512G (SED) KBG3AZPZ128G KBG3AZPZ256G KBG3AZPZ512G KBG3AZMS128G KBG3AZMS256G KBG3AZMS512G Memory TLC (BiCS FLASHTM) Interface PCI ExpressⓇ Base Specification Revision 3.1a (PCIeⓇ) Maximum Speed 16 GT/s (PCIeⓇ Gen3x2 Lane) Command NVM ExpressTM Revision 1.2.1 (NVMeTM) Connector Type - M.2 B-M Formatted Capacity1) 128 GB 256 GB 512 GB 128 GB 256 GB 512 GB Perfor- mance2) (Up to) Sequential Read (Non-SED) 1,300 MB/s {1,240 MiB/s} 1,400 MB/s {1,330 MiB/s} 1,500 MB/s {1,430 MiB/s} 1,300 MB/s {1,240 MiB/s} 1,400 MB/s {1,330 MiB/s} 1,500 MB/s {1,430 MiB/s} (SED) 1,200 MB/s {1,140 MiB/s} 1,250 MB/s {1,190 MiB/s} 1,300 MB/s {1,240 MiB/s} 1,200 MB/s {1,140 MiB/s} 1,250 MB/s {1,190 MiB/s} 1,300 MB/s {1,240 MiB/s} Sequential Write (Non-SED)

600 MB/s

{570 MiB/s}

800 MB/s

{760 MiB/s} 1,000 MB/s {950 MiB/s} {570 MiB/s} {760 MiB/s} 1,000 MB/s {950 MiB/s} (SED)

550 MB/s

{520 MiB/s}

750 MB/s

{710 MiB/s}

950 MB/s

{900 MiB/s} {520 MiB/s} {710 MiB/s} {900 MiB/s} Supply Voltage

3.3 V ±5 %

1.8 V ±5 %

1.2 V ±5 %

L1.2 mode 5 mW typ. 5 mW typ. KEY FEATURES  Toshiba 64-Layer BiCS FLASH™  PCIe® Gen3*2L NVMe™  Capacities up to 512GB  M.2 1620 single package and M.2 2230 single-sided form factor  TCG OPAL 2.01 Optional for SED

APPLICATIONS

 Ultra-mobile PCs  2-in-1 notebook PCs  IoT/embedded devices  Server and storage array boot drives BG3 SERIES CLIENT SSD The BG3 series leverages 64-layer, 3-bit-per-cell (TLC) BiCS FLASH™ and features NVMeTM Revision 1.2.1. With Host Memory Buffer (HMB) technology, this SSD series retains high performance in a DRAM-less architecture, while enabling reduced power and a smaller footprint. BG3 SSDs, as an innov ative, next generation single-package ball grid array (BGA) SSD product line, harness the flexibility in system design that enables mobile computing and IoT embedded devices to be smaller, lighter, faster, and more power efficient. Also, these power -saving BG 3 SSDs offer data center applications an alternative solution for server boot storage. The BG3 series is available in 128GB, 256GB, and 512GB capacities. All three models are available in a surface -mount single package M. 2 1620 or a removable module M.2 2230 form factor. BG3 SED models are also available. Product image may represent a design model SPECIFICATIONS

Copyright © 2018 Toshiba Memory Corporation. All rights reserved. Client SSD BG3 Series Brochure Rev.1.10 Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using, customers must refer to and comply with the latest versions of the product specifications. Note: 1) Definition of capacity: Toshiba Memory Corporation defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1GB = 230 = 1,073,741,824 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, such as Microsoft Operating System and/or pre- installed software applications, or media content. Actual formatted capacity may vary. 2) Read and write speed, tested on the state of "Host Memory Buffer (HMB) = On", may vary depending on the host device, read and write conditions, and file size. 1 MiB (mebibyte) = 220 bytes = 1,048,576 bytes, and 1 MB (megabyte) = 1,000,000 bytes. 3) MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean failure rates for a large number of products which may not accurately reflect actual operation. Actual operating life of the product may be different from the MTTF. 4) The Safety/EMI Standard is supported for KBG3xZMSxxxx only. * PCIe and PCI Express are registered trademarks of PCI-SIG * NVMeTM and NVM ExpressTM are trademarks of NVM Express, Inc. * All other company names, product names, and service names mentioned herein may be trademarks of their respective companies. * Availability of the SED model line-up may vary by region. Standard Models M.2 1620-S2 Single Package M.2 1620-S3 Single Package M.2 2230-S2 Single-sided M.2 2230-S3 Single-sided Size 20.0 mm x 16.0 mm x 1.3 mm 20.0 mm x 16.0 mm x 1.5 mm 30.0 mm x 22.0 mm x 2.18 mm 30.0 mm x 22.0 mm x 2.38 mm Tempera- ture Operating 0 to 80 °C (Package Surface Temperature) 0 to 80 °C (Components Temperature) Non- operating -40 to 85 °C Reliability3) Mean Time to Failure (MTTF): 1,500,000 hours Product Life: Approximately 5 years More Features ・Device Self-test is supported. ・Host Controlled Thermal Management (HCTM) is supported. ・The feature of Host Memory Buffer (HMB) is supported. ・Firmware security feature (only digitally signed firmware can be installed) is supported. Compliance4) UL, cUL, TÜV, KC, FCC, BSMI, CE, RCM, ISED, VCCI, Moroccan conformity mark

Copyright © 2018 Toshiba Memory Corporation. All rights reserved. Client SSD BG3 Series Brochure Rev.1.10 Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using, customers must refer to and comply with the latest versions of the product specifications.

ORDERING INFORMATION

1. Product Name K: SSD product 2. Prodct Category BG: BG Series 3. Development Generation 3: Generation 3 4. Option Code 1 0: Non-SED A: SED 5. Option Code 2 Z: No-option 6. Connector Type M: M.2 (B-M Key) P: M.2 BGA 7. Form Factor S: M.2 2230 Single Sided Z: M.2 1620 Single Package 8. Capacity 128G / 256G /512G 128G is 128 GB, 256G is 256 GB and 512G is 512 GB (1 GB = 1,000,000,000 bytes)

Copyright © 2018 Toshiba Memory Corporation. All rights reserved. Client SSD BG3 Series Brochure Rev.1.10 Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using, customers must refer to and comply with the latest versions of the product specifications. Note: 1) Single Sided/Top side 1.35mm Maximum Thickness 2) Single Sided/Top side 1.5 mm Maximum Thickness 3) Availability of the SED model line-up may vary by region. Note: 1) 1 GB (Gigabyte) = 1,000,000,000 bytes Note: 1) Under the condition of measurement with 128 KiB unit sequential access and 4KiB align. Queue depth is 32, and access range is 16GiB. 1KiB (Kibibyte) = 210 bytes = 1024 bytes Model Number Formatted Capacity Form Factor/Connect Type Function Note KBG30ZPZ128G 128 GB M.2 1620-S21) Non-SED KBG30ZPZ256G 256 GB KBG30ZPZ512G 512 GB M.2 1620-S32) KBG3AZPZ128G 128 GB M.2 1620-S21) SED3) KBG3AZPZ256G 256 GB KBG3AZPZ512G 512 GB M.2 1620-S32) KBG30ZMS128G 128 GB M.2 2230-S21) -B-M Non-SED KBG30ZMS256G 256 GB KBG30ZMS512G 512 GB M.2 2230-S32) -B-M KBG3AZMS128G 128 GB M.2 2230-S21) -B-M SED3) KBG3AZMS256G 256 GB KBG3AZMS512G 512 GB M.2 2230-S32) -B-M Capacity Total Number of User Addressable Sectors in LBA Mode 512 bytes sector 4,096 bytes sector

128 GB1) 250,069,680 31,258,710

256 GB1) 500,118,192 62,514,774

512 GB1) 1,000,215,216 125,026,902

(Non-SED) KBG30ZPZ128G KBG30ZMS128G KBG30ZPZ256G KBG30ZMS256G KBG30ZPZ512G KBG30ZMS512G (SED) KBG3AZPZ128G KBG3AZMS128G KBG3AZPZ256G KBG3AZMS256G KBG3AZPZ512G KBG3AZMS512G Interface Speed

16 GT/s (Gen3x2 Lane), 8 GT/s (Gen3x1 Lane)

10 GT/s (Gen2x2 Lane), 5 GT/s (Gen2x1 Lane)

5 GT/s (Gen1x2 Lane), 2.5 GT/s (Gen1x1 Lane) Sequential Read1) (Up to) (Non-SED) 1,300 MB/s {1,240 MiB/s} 1,400 MB/s {1,330 MiB/s} 1,500 MB/s {1,430 MiB/s} (SED) 1,200 MB/s {1,140 MiB/s} 1,250 MB/s {1,190 MiB/s} 1,300 MB/s {1,240 MiB/s} Sequential Write1) (Up to) (Non-SED) 600 MB/s {570 MiB/s} {760 MiB/s} 1,000 MB/s {950 MiB/s} (SED) 550 MB/s {520 MiB/s} {710 MiB/s} {900 MiB/s} PERFORMANCE PRODUCT LINE UP CAPACITY

Copyright © 2018 Toshiba Memory Corporation. All rights reserved. Client SSD BG3 Series Brochure Rev.1.10 Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using, customers must refer to and comply with the latest versions of the product specifications. Standard Models M.2 1620 Single Package M.2 2280 Module Allowable voltage Allowable noise/ripple 100 mV p-p, 0-10MHz Allowable supply rise time Comply to the PCI-SIG specification of Power Up/Down Sequence 2 –100 ms Note: 1) Ambient Temperature 2) The values are specified at the condition causing maximum power consumption and Power State 0. 3) PCIe Link state L1.2 Power consumption during the Admin command processing is excluded. Operation (Ta1)=25°C) M.2 1620 Single Package KBG30ZPZ128G KBG3AZPZ128G KBG30ZPZ256G KBG3AZPZ256G KBG30ZPZ512G KBG3AZPZ512G Power State33) 50 mW typ. Power State43) 5 mW typ. Operation (Ta1)=25°C) M.2 2230 Module KBG30ZMS128G KBG3AZMS128G KBG30ZMS256G KBG3AZMS256G KBG30ZMS512G KBG3AZMS512G Power State 33) 50 mW typ. Power State 43) 5 mW typ. SUPPLY VOLTAGE POWER CONSUMPTION

Copyright © 2018 Toshiba Memory Corporation. All rights reserved. Client SSD BG3 Series Brochure Rev.1.10 Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using, customers must refer to and comply with the latest versions of the product specifications. ENVIRONMENTAL CONDITIONS Note: 1) Ta: Ambient Temperature, Tc: Package Surface or Components Temperature 2) Packaged in Toshiba Memory Corporation’s original shipping package. Note: 1) Packaged in Toshiba Memory Corporation’s original shipping package. Note: 1) Apply shocks in each direction of the drive’s three mutually perpendicular axes, one axis at a time. 2) Packaged in Toshiba Memory Corporation’s original shipping package. Condition Range Gradient M.2 1620 Single Package M.2 2280 Module Operating1) 0 °C (Tc) – 80 °C (Tc) (Package Temperature) 0 °C (Tc) – 80 °C (Tc) (Components Temperature) 30 °C (Ta) / h maximum Non-operating -40 °C – 85 °C 30 °C / h maximum Under Shipment 2) -40 °C – 85 °C 30 °C / h maximum Condition Range Operating 8 % – 90 % R.H. (No condensation) Non-operating 8 % – 95 % R.H. (No condensation) Under Shipment1) 5 % – 95 % R.H. Max. wet bulb 32.5 °C (Operating) 40.0 °C (Non-operating / Shipping) Condition Range Operating1) 14.709 km/s2 {1,500 G}, 0.5 ms half sine wave Non-operating1) Under Shipment2) 100 cm free drop Condition Range Operating 196 m/s2 {20 G} Peak, 10 - 2,000 Hz (20 minutes per axis) x 3 axis Non-operating TEMPERATURE HUMIDITY SHOCK STANDARDS VIBRATION STANDARDS

Copyright © 2018 Toshiba Memory Corporation. All rights reserved. Client SSD BG3 Series Brochure Rev.1.10 Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using, customers must refer to and comply with the latest versions of the product specifications. COMPLIANCE Note: 1) The Safety/EMI Standard is supported for KBG3xZMSxxxx only. 2) UL certification is basically on a voluntary basis. Title Description Region UL1) (Underwriters Laboratories) UL 60950-1 USA2) cUL1) (Underwriters Laboratories of Canada) CSA-C22.2 No.60950-1-07 Canada TÜV1) (Technischer Überwachungs Verein) EN 60950-1 EURO KC1) KN32, KN35 Korea FCC1) FCC part 15 Subpart B USA BSMI1) (Bureau of Standards, Metrology and Inspection) CNS13438 (CISPR Pub. 22) Taiwan CE1) EN 55032, EN 55024 EURO RCM1) AS/NZS CISPR 32 Australia, New Zealand ISED1) ICES-003 Canada Moroccan conformity mark1) NM EN 55032, NM EN 22024 Morocco VCCI1) VCCI-CISPR32 Japan Parameter Value Mean Time to Failure 1,500,000 hours Product Life Approximately 5 years SAFETY / EMI STANDARDS RELIABILITY

Copyright © 2018 Toshiba Memory Corporation. All rights reserved. Client SSD BG3 Series Brochure Rev.1.10 Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using, customers must refer to and comply with the latest versions of the product specifications. MECHANICAL SPECIFICATIONS Unit:mm Dimension Description KBG30ZPZ128G KBG3AZPZ128G KBG30ZPZ256G KBG3AZPZ256G KBG30ZPZ512G KBG3AZPZ512G c Thickness of BGA Package 1.30 mm Max. 1.50 mm Max. Figure 1: Dimensions of KBG3xZPZxxxx (Single Package) Model Number Weight Width Height Length KBG30ZPZ128G KBG3AZPZ128G 0.85 g typ. 16.00 mm 1.30 mm 20.00 mm KBG30ZPZ256G KBG3AZPZ256G KBG30ZPZ512G KBG3AZPZ512G 1.00 g typ. 1.50 mm M.2 1620 SINGLE PACKAGE

Copyright © 2018 Toshiba Memory Corporation. All rights reserved. Client SSD BG3 Series Brochure Rev.1.10 Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using, customers must refer to and comply with the latest versions of the product specifications. Unit:mm Dimension Description KBG30ZMS128G KBG3AZMS128G KBG30ZMS256G KBG3AZMS256G KBG30ZMS512G KBG3AZMS512G A Thickness of BGA Package (without label) 1.30 mm Max. 1.50 mm Max. Figure 2: Dimensions of KBG3xZMSxxxx (M.2 2230 Module) Model Number Weight Width Height Length KBG30ZMS128G KBG3AZMS128G 2.42 g typ. 22.00 mm 2.18 mm 30.00 mm KBG30ZMS256G KBG3AZMS256G KBG30ZMS512G KBG3AZMS512G 2.60 g typ. 2.38 mm M.2 2230 MODULE

Copyright © 2018 Toshiba Memory Corporation. All rights reserved. Client SSD BG3 Series Brochure Rev.1.10 Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using, customers must refer to and comply with the latest versions of the product specifications. M.2 1620 SINGLE PACKAGE INTERFACE CONNECTOR Note: 1) The total ball number is 291. 2) The voltage powers must be supplied to each ball on all power rails. 3) NC is not used in KBG3xZPZxxxx. But NC ball function is assigned in PCI-SiG specification. 4) NC, DNU and RFU must be connected to independent OPEN land, and can't be connected between each other on host board. 5) DIAG0 and DIAG1 are engineering diagnosis balls. Toshiba Memory Corporation requests to enable access to DIAG0 and DIAG1 on host board. Figure 3: Ball Map of KBG3xZPZxxxx (Single Package) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 A DNU DNU DNU DNU DNU DNU DNU DNU DNU DNU B DNU DNU DNU NC DNU DNU DNU DNU DNU DNU C GND GND GND GND GND DNU NC NC DNU NC DNU DNU RFU RFU GND DNU DNU DNU D REF CLKP REF CLKN GND PER ST# CLK REQ# PWR PWR _1 GND DNU DIAG1 NC RFU E GND GND GND GND GND GND GND NC PWR PWR _1 GND NC DIAG0 GND GND DNU DNU DNU F PERp0 PERn0 GND PE DET RFU G GND GND GND GND GND PWR PWR _3 GND GND PWR PWR _3 GND GND DNU DNU DNU H PETp0 PETn0 PWR PWR _3 GND GND PWR PWR _3 RFU RFU J GND GND GND GND GND PWR PWR _3 GND GND PWR PWR _3 GND GND DNU DNU DNU K PERp1 PERn1 GND GND GND GND GND GND RFU RFU L GND GND GND GND GND RFU RFU RFU RFU RFU RFU GND GND DNU DNU NC M PETp1 PETn1 RFU RFU GND GND RFU RFU RFU RFU N GND GND GND GND GND RFU RFU RFU RFU RFU RFU GND GND DNU NC NC P NC NC GND GND GND GND GND GND RFU RFU R GND GND GND GND GND PWR PWR _2 GND GND PWR PWR _2 GND GND DNU NC NC T NC NC PWR PWR _2 GND GND PWR PWR _2 RFU RFU U GND GND GND GND GND PWR PWR _2 GND GND PWR PWR _2 GND GND DNU NC NC V NC NC RFU RFU W GND GND GND GND GND GND LED 1# RFU PWR PWR _1 GND RFU RFU GND GND DNU DNU NC Y NC NC GND DNU DNU PWR PWR _1 GND DNU GND DNU DNU AA GND GND GND GND GND DNU DNU DNU DNU NC DNU DNU DNU GND GND DNU DNU DNU AB DNU DNU DNU DNU DNU DNU DNU DNU DNU DNU AC DNU DNU DNU DNU DNU DNU DNU DNU DNU DNU

Copyright © 2018 Toshiba Memory Corporation. All rights reserved. Client SSD BG3 Series Brochure Rev.1.10 Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using, customers must refer to and comply with the latest versions of the product specifications. SINGLE PACKAGE INTERFACE SIGNALS Interface Signal Name Description Location Power and Grounds PWR_1 3.3 V Source D9, D10, E9, E10, W9, W10, Y9, Y10 PWR_2 1.8 V Source R7, R8, R11, R12, T7, T8, T11, T12, U7, U8, U11, U12 PWR_3 1.2 V Source G7, G8, G11, G12, H7, H8, H11, H12, J7, J8, J11, J12 Power and Grounds GND GND C1-C5, C15, D6, D11, E1-E7, E11, E14, E15, F6, G1- G5, G9, G10, G14, G15, H9, H10, J1-J5, J9, J10, J14, J15, K7-K12, L1-L5, L14, L15, M9, M10, N1- N5, N14, N15, P7-P12, R1-R5, R9, R10, R14, R15, T9, T10, U1-U5, U9, U10, U14, U15, W1- W6, W11, W14, W15, Y6, Y11, Y13, AA1-AA5, AA14, AA15 PCIe PERp0, PERn0 PCIe 0 Device Receiver F4, F5 PETp0, PETn0 PCIe 0 Device Transfer H4, H5 PERp1, PERn1 PCIe 1 Device Receiver K4, K5 PETp1, PETn1 PCIe 1 Device Transfer M4, M5 REFCLKp, REFCLKn PCIe Reference Clock D4, D5 PERST# PE-Reset D7 CLKREQ# Clock Request D8 SSD Specific Signals LED1# Device Activity W7 PEDET Host I/F Indication (PCIe:OPEN / SATA:GND) F14 Optional Signals DIAG0, DIAG1 Diagnosis, option for engineering D13, E13

Copyright © 2018 Toshiba Memory Corporation. All rights reserved. Client SSD BG3 Series Brochure Rev.1.10 Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using, customers must refer to and comply with the latest versions of the product specifications. Interface Signal Name Description Location Other Signals RFU Reserved; OPEN C13, C14, D15, F15, H14, H15, K14, K15, L7, L8, L9, L10, L11, L12, M7, M8, M11, M12, M14, M15, N7, N8, N9, N10, N11, N12, P14, P15, T14, T15, V14, V15, W8, W12, W13 DNU Manufacturing purpose only;OPEN A1, A2, A4, A6, A8, A11, A13, A15, A17, A18, B1, B2, B4, B8, B11, B13, B15, B17, B18, C6, C9, C11, C12, C16-C18, D12, E16- E18, G16-G18, J16-J18, L16, L17, N16, R16, U16, W16, W17, Y7, Y8, Y12, Y14, Y15, AA6-AA9, AA11-AA13, AA16-AA18, AB1, AB2, AB4, AB6, AB8, AB11, AB13, AB15, AB17, AB18, AC1, AC2, AC4, AC6, AC8, AC11, AC13, AC15, AC17, AC18 NC Not used; OPEN B6, C7, C8, C10, D14, E8, E12, L18, N17, N18, P4, P5, R17, R18, T4, T5, U17, U18, V4, V5, W18, Y4, Y5, AA10

Copyright © 2018 Toshiba Memory Corporation. All rights reserved. Client SSD BG3 Series Brochure Rev.1.10 Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using, customers must refer to and comply with the latest versions of the product specifications. M.2 2230 MODULE Unit:mm Figure 4: Interface Dimensions of KBG3xZMSxxxx (M.2 2230 Module)

Copyright © 2018 Toshiba Memory Corporation. All rights reserved. Client SSD BG3 Series Brochure Rev.1.10 Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using, customers must refer to and comply with the latest versions of the product specifications. M.2 2230 MODULE CONNECTOR PIN ASSIGNMENT Pin Signal Name Description Pin # Name Description 1 CONFIG_3 GND 2 +3.3V 3.3 V Source 3 GND GND 4 +3.3V 3.3 V Source

5 Reserved NC 6 Reserved NC

7 Reserved NC 8 Reserved NC

9 Reserved NC 10 LED1# Device Activity

11 Reserved NC Notch

21 CONFIG_0 GND 22 Reserved NC

23 Reserved NC

24 Reserved NC

25 Reserved NC 26 Reserved NC

27 GND GND 28 Reserved NC

29 PETn1 PCIe 1

30 Reserved NC

31 PETp1 32 Reserved NC

33 GND GND 34 Reserved NC

35 PERn1 PCIe 1

36 Reserved NC

37 PERp1 38 Reserved NC

39 GND GND 40 Reserved NC

41 PETn0 PCIe 0

42 Reserved NC

43 PETp0 44 Reserved NC

45 GND GND 46 Reserved NC

47 PERn0 PCIe 0

48 Reserved NC

49 PERp0 50 PERST# PE-Reset

51 GND GND 52 CLKREQ# Clock Request

53 REFCLKn PCIe Reference Clock 54 PEWAKE# NC

55 REFCLKp PCIe Reference Clock 56 MFG DATA Manufacturing pin. Must NOT be connected on host board. 57 GND GND 58 MFG CLOCK Notch Notch

67 Reserved NC 68 SUSCLK NC

69 PEDET Host I/F Indication

(PCIe:OPEN / SATA:GND) 70 +3.3V 3.3 V Source 71 GND GND 72 +3.3V 3.3 V Source 73 GND GND 74 +3.3V 3.3 V Source

75 GND GND

Copyright © 2018 Toshiba Memory Corporation. All rights reserved. Client SSD BG3 Series Brochure Rev.1.10 Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using, customers must refer to and comply with the latest versions of the product specifications. COMMAND TABLE ADMIN Command set Op-Code Command Name 00h Delete I/O Submission Queue 01h Create I/O Submission Queue 02h Get Log Page 04h Delete I/O Completion Queue 05h Create I/O Completion Queue 06h Identify 08h Abort 09h Set Features 0Ah Get Features 0Ch Asynchronous Event Request 10h Firmware Commit 11h Firmware Image Download 14h Device Self-Test (DST) 80h Format NVM 81h Security Send 82h Security Receive Set Features / Get Features Set Op-Code Feature Name 01h Arbitration 02h Power Management 04h Temperature Threshold 05h Error Recovery 06h Volatile Write Cache 07h Number of Queues 08h Interrupt Coalescing 09h Interrupt Vector Configuration 0Ah Write Atomicity 0Bh Asynchronous Event Configuration 0Ch Autonomous Power State Transition 0Dh Host Memory Buffer (HMB) 10h Host Controlled Thermal Management (HCTM)

Copyright © 2018 Toshiba Memory Corporation. All rights reserved. Client SSD BG3 Series Brochure Rev.1.10 Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using, customers must refer to and comply with the latest versions of the product specifications. NVMe Command Set Op-Code Command Name 00h Flush 01h Write 02h Read 04h Write Uncorrectable 05h Compare 09h Dataset Management

Copyright © 2018 Toshiba Memory Corporation. All rights reserved. Client SSD BG3 Series Brochure Rev.1.10 Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using, customers must refer to and comply with the latest versions of the product specifications. RESTRICTIONS ON PRODUCT USE Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as “TOSHIBA”. Hardware, software and systems described in this document are collectively referred to as “Product”.  TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.  This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.  Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.  PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MA Y CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales representative.  Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.  Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations.  The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.  ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.  Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.  Product may include products subject to foreign exchange and foreign trade control laws.  Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.