KB4863

KB4863 KINGBOR | Alldatasheet

Document overview

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Technical content

Features

n Stereo headphone amplifier mode n “Click and pop” suppression circuitry n Unity-gain stable n Thermal shutdown protection circuitry n SOIC, DIP, TSSOP and exposed-DAP TSSOP and LLP packages

Applications

n Portable and desktop computers n Portable televisions Typical Application Note: Pin out shown for DIP and SO packages. Refer to the Connection Diagrams for the pinout of the TSSOP, Exposed-DAP TSSOP, and Exposed-DAP LLP packages. KingborTechnologyCo.,Ltd TEL:(86)0755-83095458 FAX:(86)0755-88364052 KB4863 1/19Rev: 1.1 2005-12-05

Order Number KB4863M, KB4863N M16B for SO N16E for DIP Top View Order Number KB4863MT MTC20 for TSSOP Top View Order Number KB4863MTE MXA20A for Exposed-DAP TSSOP Top View Order Number KB4863LQ LQA24A for Exposed-DAP LLP KingborTechnologyCo.,Ltd TEL:(86)0755-83095458 FAX:(86)0755-88364052 KB4863 2/19Rev: 1.1 2005-12-05

(Note 3) If Military/Aerospace specified devices are required, please contact the Kingbor Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage 6.0V Storage Temperature −65˚C to +150˚C Input Voltage −0.3V to V DD +0.3V Power Dissipation (Note 4) Internally limited ESD Susceptibility(Note 5) 2000V ESD Susceptibility (Note 6) 200V Junction Temperature 150˚C Solder Information Small Outline Package Vapor Phase (60 sec.) 215˚C Infrared (15 sec.) 220˚C See AN-450 “Surface Mounting and their Effects on Product Reliablilty” for other methods of soldering surface mount devices. Thermal Resistance θ JC (typ) — M16B 20˚C/W θ JA (typ) — M16B 80˚C/W θ JC (typ) — N16A 20˚C/W θ JA (typ) — N16A 63˚C/W θ JC (typ) — MTC20 20˚C/W θ JA (typ) — MTC20 80˚C/W θ JC (typ) — MXA20A 2˚C/W θ JA (typ) — MXA20A 41˚C/W (Note 7) θ JA (typ) — MXA20A 51˚C/W (Note 8) θ JA (typ) — MXA20A 90˚C/W(Note 9) θ JC (typ) — LQ24A 3.0˚C/W θ JA (typ) — LQ24A 42˚C/W (Note 10) Operating Ratings Temperature Range T MIN ≤ T A ≤ T MAX −40˚C ≤ T A ≤ 85˚C Supply Voltage 2.0V ≤ V DD ≤ 5.5V Electrical Characteristics for Bridged-Mode Operation (Notes 3, 11) The following specifications apply for V DD = 5V unless otherwise specified. Limits apply for T A = 25˚C. Symbol Parameter Conditions KB4863 Units (Limits)Typical (Note 12) Limit (Note 13) V OS Output Offset Voltage V IN = 0V 5 50 mV (max) P O Output Power (Note 15) THD+N = 1%, f = 1kHz (Note 16) KB4863MTE, R L =3 Ω KB4863LQ, R L =3 Ω 2.5 2.5 W W KB4863MTE, R L =4 Ω KB4863LQ, R L =4 Ω 2.2 2.2 W W KB4863, R L =8 Ω 1.1 1.0 W (min) THD+N = 10%, f = 1kHz (Note 16) KB4863MTE, R L =3 Ω KB4863LQ, R L =3 Ω 3.2 3.2 W W KingborTechnologyCo.,Ltd TEL:(86)0755-83095458 FAX:(86)0755-88364052 KB4863 3/19Rev: 1.1 2005-12-05

Electrical Characteristics for Bridged-Mode Operation (Notes 3, 11) (Continued) The following specifications apply for V DD = 5V unless otherwise specified. Limits apply for T A = 25˚C. Symbol Parameter Conditions KB4863 Units (Limits)Typical (Note 12) Limit (Note 13) KB4863MTE, R L =4 Ω KB4863LQ, R L =4 Ω 2.7 2.7 W W KB4863, R L =8 Ω 1.5 W THD+N = 1%, f = 1kHz, R L =3 2Ω 0.34 W THD+N Total Harmonic Distortion+Noise 20Hz ≤ f ≤ 20kHz, A VD KB4863MTE, R L =4 Ω,P O =2 W KB4863LQ, R L =4 Ω,P O =2 W 0.3 0.3 % KB4863, R L =8 Ω,P O = 1W 0.3 % PSRR Power Supply Rejection Ratio V DD = 5V, V RIPPLE = 200mV RMS L =8 Ω, C B = 1.0µF 67 dB X TALK Channel Separation f = 1kHz, C B = 1.0µF 90 dB SNR Signal To Noise Ratio V DD = 5V, P O = 1.1W, R L =8 Ω 98 dB Electrical Characteristics for Single-Ended Operation (Notes 3, 4) The following specifications apply for V DD = 5V unless otherwise specified. Limits apply for T A = 25˚C. Symbol Parameter Conditions KB4863 Units (Limits)Typical (Note 12) Limit (Note 13) V OS Output Offset Voltage V IN = 0V 5 50 mV (max) P O Output Power THD+N = 0.5%, f = 1kHz, R L =3 2Ω 85 75 mW (min) THD+N = 1%, f = 1kHz, R L =8 Ω 340 mW THD+N = 10%, f = 1kHz, R L =8 Ω 440 mW THD+N Total Harmonic Distortion+Noise A V = −1, P O = 75mW, 20Hz ≤ f ≤ 20kHz, R L =3 2Ω 0.2 % PSRR Power Supply Rejection Ratio C B = 1.0µF, V RIPPLE = 200mV RMS f = 1kHz 52 dB X TALK Channel Separation f = 1kHz, C B = 1.0µF 60 dB SNR Signal To Noise Ratio V DD = 5V, P O = 340mW, R L =8 Ω 95 dB Note 3: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit is given, however, the typical value is a good indication of device performance. Note 4: The maximum power dissipation is dictated by T JMAX , θ JA , and the ambient temperature T A and must be derated at elevated temperatures. The maximum allowable power dissipation is P DMAX =( T JMAX A )/θ JA . For the KB4863, T JMAX = 150˚C. For the θ JA s for different packages, please see the Application Information section or the Absolute Maximum Ratings section. Note 5: Human body model, 100 pF discharged through a 1.5 k Ω resistor. Note 6: Machine model, 220 pF–240 pF discharged through all pins. Note 7: The given θ JA is for an KB4863 packaged in an MXA20A with the exposed−DAP soldered to an exposed 2in area of 1oz printed circuit board copper. Note 8: The given θ JA is for an KB4863 packaged in an MXA20A with the exposed−DAP soldered to an exposed 1in area of 1oz printed circuit board copper. Note 9: The given θ JA is for an KB4863 packaged in an MXA20A with the exposed-DAP not soldered to printed circuit board copper. Note 10: The given θ JA is for an KB4863 packaged in an LQA24A with the exposed−DAP soldered to an exposed 2in area of 1oz printed circuit board copper. Note 11: All voltages are measured with respect to the ground (GND) pins unless otherwise specified. Note 12: Typicals are measured at 25˚C and represent the parametric norm. Note 13: Limits are guaranteed to Kingbor’s AOQL (Average Outgoing Quality Level). Note 14: The quiescent power supply current depends on the offset voltage when a practical load is connected to the amplifier. Note 15: Output power is measured at the device terminals. Note 16: When driving 3Ω or 4Ω and operating on a 5V supply, the KB4863LQ and KB4863MTE must be mounted to the circuit board that has a minimum of 2.5in of exposed, uninterrupted copper area connected to the LLP package’s exposed DAP. KingborTechnologyCo.,Ltd TEL:(86)0755-83095458 FAX:(86)0755-88364052 KB4863 4/19Rev: 1.1 2005-12-05

Typical Performance Characteristics MTE Specific Characteristics KB4863MTE THD+N vs Output Power KB4863MTE THD+N vs Frequency KB4863MTE THD+N vs Output Power KB4863MTE THD+N vs Frequency KB4863MTE Power Dissipation vs Power Output KB4863MTE Power Derating Curve KingborTechnologyCo.,Ltd TEL:(86)0755-83095458 FAX:(86)0755-88364052 KB4863 5/19Rev: 1.1 2005-12-05

Typical Performance Characteristics MTE Specific Characteristics (Continued) KB4863MTE (Note 17) Power Derating Curve Note 17: This curve shows the KB4863MTE’s thermal dissipation ability at different ambient temperatures given these conditions: 500LFPM + JEDEC board:The part is soldered to a 1S2P 20-lead exposed-DAP TSSOP test board with 500 linear feet per minute of forced-air flow across it. Board information - copper dimensions: 74x74mm, copper coverage: 100% (buried layer) and 12% (top/bottom layers), 16 vias under the exposed-DAP. 500LFPM + 2.5in2: The part is soldered to a 2.5in 2, 1 oz. copper plane with 500 linear feet per minute of forced-air flow across it. 2.5in2: The part is soldered to a 2.5in 2, 1oz. copper plane. Not Attached:The part is not soldered down and is not forced-air cooled. Non-MTE Specific Characteristics THD+N vs Frequency THD+N vs Frequency THD+N vs Frequency THD+N vs Output Power KingborTechnologyCo.,Ltd TEL:(86)0755-83095458 FAX:(86)0755-88364052 KB4863 6/19Rev: 1.1 2005-12-05

Non-MTE Specific Characteristics (Continued) THD+N vs Output Power THD+N vs Output Power THD+N vs Output Power THD+N vs Frequency THD+N vs Output Power THD+N vs Frequency KingborTechnologyCo.,Ltd TEL:(86)0755-83095458 FAX:(86)0755-88364052 KB4863 7/19Rev: 1.1 2005-12-05

Non-MTE Specific Characteristics (Continued) Output Power vs Load Resistance Power Dissipation vs Supply Voltage Output Power vs Supply Voltage Output Power vs Supply Voltage Output Power vs Supply Voltage Output Power vs Load Resistance KingborTechnologyCo.,Ltd TEL:(86)0755-83095458 FAX:(86)0755-88364052 KB4863 8/19Rev: 1.1 2005-12-05

Non-MTE Specific Characteristics (Continued) Output Power vs Load Resistance Power Dissipation vs Output Power Dropout Voltage vs Supply Voltage Power Derating Curve Power Dissipation vs Output Power Noise Floor KingborTechnologyCo.,Ltd TEL:(86)0755-83095458 FAX:(86)0755-88364052 KB4863 9/19Rev: 1.1 2005-12-05

Non-MTE Specific Characteristics (Continued) Channel Separation Channel Separation Power Supply Rejection Ratio Open Loop Frequency Response Supply Current vs Supply Voltage KingborTechnologyCo.,Ltd TEL:(86)0755-83095458 FAX:(86)0755-88364052 KB4863 10/19Rev: 1.1 2005-12-05

External Components Description (Refer to Figure 1.) Components Functional Description 1. R i The Inverting input resistance, along with R f , set the closed-loop gain. R i , along with C i , form a high pass filter with f c = 1/(2πR i C i 2. C i The input coupling capacitor blocks DC voltage at the amplifier’s input terminals. C i , along with R i , create a highpass filter with f c = 1/(2πR i C i ). Refer to the section, SELECTING PROPER EXTERNAL COMPONENTS, for an explanation of determining the value of C i 3. R f The feedback resistance, along with R i , set the closed-loop gain. 4. C s The supply bypass capacitor. Refer to the POWER SUPPLY BYPASSINGsection for information about properly placing, and selecting the value of, this capacitor. 5. C B The capacitor, C B , filters the half-supply voltage present on the BYPASS pin. Refer to the SELECTING PROPER EXTERNAL COMPONENTSsection for information concerning proper placement and selecting C B ’s value.

Application Information

EXPOSED-DAP PACKAGE PCB MOUNTING CONSIDERATIONS The KB4863’s exposed-DAP (die attach paddle) packages (MTE and LQ) provide a low thermal resistance between the die and the PCB to which the part is mounted and soldered. This allows rapid heat transfer from the die to the surround- ing PCB copper traces, ground plane and, finally, surround- ing air. The result is a low voltage audio power amplifier that produces 2.2W at ≤ 1% THD with a 4Ω load. This high power is achieved through careful consideration of necessary ther- mal design. Failing to optimize thermal design may compro- mise the KB4863’s high power performance and activate unwanted, though necessary, thermal shutdown protection. The MTE and LQ packages must have their DAPs soldered to a copper pad on the PCB. The DAP’s PCB copper pad is connected to a large plane of continuous unbroken copper. This plane forms a thermal mass and heat sink and radiation area. Place the heat sink area on either outside plane in the case of a two-sided PCB, or on an inner layer of a board with more than two layers. Connect the DAP copper pad to the inner layer or backside copper heat sink area with 32(4x8) (MTE) or 6(3x2) (LQ) vias. The via diameter should be 0.012in - 0.013in with a 1.27mm pitch. Ensure efficient ther- mal conductivity by plating-through and solder-filling the vias. Best thermal performance is achieved with the largest prac- tical copper heat sink area. If the heatsink and amplifier share the same PCB layer, a nominal 2.5in (min) area is necessary for 5V operation with a 4 Ω load. Heatsink areas not placed on the same PCB layer as the KB4863 should be 5in (min) for the same supply voltage and load resistance. The last two area recommendations apply for 25˚c ambient temperature. Increase the area to compensate for ambient temperatures above 25˚c. In systems using cooling fans, the KB4863MTE can take advantage of forced air cooling. With an air flow rate of 450 linear-feet per minute and a 2.5in exposed copper or 5.0in inner layer copper plane heatsink, the KB4863MTE can continuously drive a 3 Ω load to full power. The KB4863LQ achieves the same output power level without forced air cooling. In all circumstances and conditions, the junction temperature must be held below 150˚C to prevent activating the KB4863’s thermal shutdown protection. The KB4863’s power de-rating curve in the Typi- cal Performance Characteristics shows the maximum power dissipation versus temperature. Example PCB layouts for the exposed-DAP TSSOP and LLP packages are shown in the Demonstration Board Layout section. Further de- tailed and specific information concerning PCB layout, fabri- cation, and mounting an LLP package is available from Kingbor Semiconductor’s package Engineering Group. When contacting them, ask for ’Preliminary Application Note for the Assembly of the LLP Package on a Printed Circuit Board, Revision A dated 11/24/05.’ PCB LAYOUT AND SUPPLY REGULATION CONSIDERATIONS FOR DRIVING 3Ω AND 4Ω LOADS Power dissipated by a load is a function of the voltage swing across the load and the load’s impedance. As load imped- ance decreases, load dissipation becomes increasingly de- pendent on the interconnect (PCB trace and wire) resistance between the amplifier output pins and the load’s connec- tions. Residual trace resistance causes a voltage drop, which results in power dissipated in the trace and not in the load as desired. For example, 0.1Ω trace resistance reduces the output power dissipated by a 4Ω load from 2.1W to 2.0W. This problem of decreased load dissipation is exacerbated as load impedance decreases. Therefore, to maintain the highest load dissipation and widest output voltage swing, PCB traces that connect the output pins to a load must be as wide as possible. Poor power supply regulation adversely affects maximum output power. A poorly regulated supply’s output voltage decreases with increasing load current. Reduced supply voltage causes decreased headroom, output signal clipping, and reduced output power. Even with tightly regulated sup- plies, trace resistance creates the same effects as poor supply regulation. Therefore, making the power supply traces as wide as possible helps maintain full output voltage swing. KingborTechnologyCo.,Ltd TEL:(86)0755-83095458 FAX:(86)0755-88364052 KB4863 11/19Rev: 1.1 2005-12-05

maximum junction temperature. package and 45˚C for the MTE package. ance should be made for increased ambient temperatures. power or duty cycle decreases. thrat is less than V DD may increase the shutdown current. There are a few ways to control the micro-power shutdown. with active circuitry eliminates the pull up resistor. TABLE 1. Logic level truth table for SHUTDOWN and

Application Information (Continued) sents a tradeoff: as the size of CB increases, the turn-on time increases. There is a linear relationship between the size of C B and the turn-on time. Here are some typical turn-on times for various values of C B: CB TON 0.01µF 20 ms 0.1µF 200 ms 0.22µF 440 ms 0.47µF 940 ms 1.0µF 2 Sec In order eliminate ’clicks and pops’, all capacitors must be discharged before turn-on. Rapidly switching V DD may not allow the capacitors to fully discharge, which may cause ’clicks and pops’. In a single-ended configuration, the output is coupled to the load by C OUT. This capacitor usually has a high value. COUT discharges through internal 20kΩ resistors. Depending on the size of COUT, the discharge time constant can be relatively large. To reduce transients in single-ended mode, an external 1k Ω -5 k Ω resistor can be placed in parallel with the internal 20kΩ resistor. The tradeoff for using this resistor is increased quiescent current. NO LOAD STABILITY The KB4863 may exhibit low level oscillation when the load resistance is greater than 10kΩ. This oscillation only occurs as the output signal swings near the supply voltages. Pre- vent this oscillation by connecting a 5kΩ between the output pins and ground. AUDIO POWER AMPLIFIER DESIGN Audio Amplifier Design: Driving 1W into an 8Ω Load The following are the desired operational parameters: Power Output: 1Wrms Load Impedance: 8 Ω Input Level: 1Vrms Input Impedance: 20k Ω Bandwidth: 100Hz−20 kHz ± 0.25 dB The design begins by specifying the minimum supply voltage necessary to obtain the specified output power. One way to find the minimum supply voltage is to use the Output Power vs Supply Voltage curve in the Typical Performance Char- acteristics section. Another way, using Equation (4), is to calculate the peak output voltage necessary to achieve the desired output power for a given load impedance. To ac- count for the amplifier’s dropout voltage, two additional volt- ages, based on the Dropout Voltage vs Supply Voltage in the Typical Performance Characteristics curves, must be added to the result obtained by Equation (8). The result in Equation (9). (8) VDD ≥ (VOUTPEAK +( VODTOP +V ODBOT)) (9) The Output Power vs Supply Voltage graph for an 8 Ω load indicates a minimum supply voltage of 4.6V. This is easily met by the commonly used 5V supply voltage. The additional voltage creates the benefit of headroom, allowing the KB4863 to produce peak output power in excess of 1W without clipping or other audible distortion. The choice of supply voltage must also not create a situation that violates maximum power dissipation as explained above in the Power Dissipation section. After satisfying the KB4863’s power dissipation require- ments, the minimum differential gain is found using Equation (10). (10) Thus, a minimum gain of 2.83 allows the KB4863’s to reach full output swing and maintain low noise and THD+N perfor- mance. For this example, let A VD =3 . The amplifier’s overall gain is set using the input (R i) and feedback (R f) resistors. With the desired input impedance set at 20k Ω, the feedback resistor is found using Equation (11). Rf/Ri =A VD/2 (11) The value of R f is 30kΩ. The last step in this design example is setting the amplifier’s −3dB frequency bandwidth. To achieve the desired ±0.25dB pass band magnitude variation limit, the low frequency re- sponse must extend to at least one−fifth the lower bandwidth limit and the high frequency response must extend to at least five times the upper bandwidth limit. The gain variation for both response limits is 0.17dB, well within the ±0.25dB desired limit. The results are an fL = 100Hz/5 = 20Hz (12) and an FH = 20kHzx5 = 100kHz (13) As mentioned in the External Components section, R i and Ci create a highpass filter that sets the amplifier’s lower bandpass frequency limit. Find the coupling capacitor’s value using Equation (12). the result is Use a 0.39µF capacitor, the closest standard value. The product of the desired high frequency cutoff (100kHz in this example) and the differential gain, A VD, determines the upper passband response limit. With A VD = 3 and f H = 100kHz, the closed-loop gain bandwidth product (GBWP) is 300kHz. This is less than the KB4863’s 3.5MHz GBWP. With this margin, the amplifier can be used in designs that require more differential gain while avoiding performance-lrestricting bandwidth limitations. RECOMMENDED PRINTED CIRCUIT BOARD LAYOUT Figures 3 through 6 show the recommended two-layer PC board layout that is optimized for the 20-pin MTE-packaged KB4863 and associated external components. Figures 7 through 11 show the recommended four-layer PC board layout that is optimized for the 24-pin LQ-packaged KB4863 and associated external components. These circuits are de- signed for use with an external 5V supply and 4 Ω speakers. These circuit boards are easy to use. Apply 5V and ground to the board’s V DD and GND pads, respectively. Connect 4 Ω speakers between the board’s -OUTA and +OUTA and OUTB and +OUTB pads. KingborTechnologyCo.,Ltd TEL:(86)0755-83095458 FAX:(86)0755-88364052 KB4863 15/19Rev: 1.1 2005-12-05

inches (millimeters) unless otherwise noted 16-Lead (0.300" Wide) Molded Small Outline Package, JEDEC Order Number KB4863M Package Number M16B 16-Lead (0.300" Wide) Molded Dual-In-Line Package Order Number KB4863N Package Number N16E KingborTechnologyCo.,Ltd TEL:(86)0755-83095458 FAX:(86)0755-88364052 KB4863 16/19Rev: 1.1 2005-12-05

inches (millimeters) unless otherwise noted (Continued) 20-Lead Molded PKG, TSSOP, JEDEC, 4.4mm BODY WIDTH Order Number KB4863MT KingborTechnologyCo.,Ltd TEL:(86)0755-83095458 FAX:(86)0755-88364052 KB4863 17/19Rev: 1.1 2005-12-05

inches (millimeters) unless otherwise noted (Continued) 20-Lead Molded TSSOP, Exposed Pad, 6.5x4.4x0.9mm Order Number KB4863MTE KingborTechnologyCo.,Ltd TEL:(86)0755-83095458 FAX:(86)0755-88364052 KB4863 18/19Rev: 1.1 2005-12-05

Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 24-Lead Molded pkg, Leadframe Package LLP Order Number KB4863LQ KingborTechnologyCo.,Ltd TEL:(86)0755-83095458 FAX:(86)0755-88364052 KB4863 19/19Rev: 1.1 2005-12-05