KB3541NT KINGBRIGHT | Alldatasheet

Document overview

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  • PDF pages: 7

Technical content

Features

1.AC inputs 2.High current transfer ratio 3.Opaque type, mini -flat package 4.Subminiature type (The volume is smaller than that of our conventional DIP type by as far as 30%) 5.Isolation voltage between input and output Viso:3750Vrms 6.Employs double transfer mold technology 7.Recognized by UL and CUL, file NO.E225308. 8.Package:1000Pcs/Reel. 9.RoHS Compliant.

Applications

1.Hybrid substrates that require high density mounting 2.Programmable controllers UNIT : MM[INCH] TOLERANCE : ±0.5[ ±0 .02] UNLESS OTHERWISE NOTED. ****PACKAGE DIMENSIONS (UNIT:mm) SMD Type

SPEC NO: DSAD2838 REV NO: V.6 DATE: APR/06/2005 PAGE: 2 OF 7 APPROVED: J. Lu CHECKED: Tracy Deng DRAWN: Y.W.WANG ERP:120500 0036 **Absolute Maximum Ratings (Ta=25 °°°°CCCC)))) **Electro -optical Characteristics *1 40 to 60 ％RH, AC for1 minute. *2 For 10 seconds. Parameter Symbol Rating Unit Input Forward current IF ±50 mA Power dissipation P 70 mW Output Collector -emitter voltage VCEO 35 V Emitter -collector voltage VECO 6 V Collector current IC 80 mA Collector power dissipation PC 150 mW Total power dissipation Ptot 170 mW *1 Isolation voltage Viso 3750 Vrms Operating temperature Topr -30 to +100 °C Storage temperature Tstg -40 to +125 °C *2 Soldering temperature Tsol 260 °C Parameter Symbol Conditions Min. Typ. Max. Unit Input Forward voltage VF IF=± 20mA - 1.2 1.4 V Peak forward voltage VFM IFM =0.5A - - 3.0 V Collector dark current ICEO Vce=20V I F=0 - - 10 -6 A Collector -emitter breakdown voltage BV CEO IC =0.1mA I F=0 35 - - V Emitter -collector breakdown voltage BV ECO IE=10uA I F=0 6 - V Transfer charact - eristics Current transfer ration CTR IF=± 1mA Vce=5V 450 1600 7400 ％ Collector -emitter saturation voltage VCE (sat) IF=± 20mA I C =1mA - 0.8 1.0 V Response time Rise time tr Vce=2V I C =2mA R L=100 Ω - 60 300 uS Fall time tr 53 250 uS Output

SPEC NO: DSAD2838 REV NO: V.6 DATE: APR/06/2005 PAGE: 3 OF 7 APPROVED: J. Lu CHECKED: Tracy Deng DRAWN: Y.W.WANG ERP:120500 0036 Fig. 5 Collector -emitter Saturation Voltage vs. Ambient Temperature Fig. 6 Response Time vs. Load Resistance Fig. 3 Collector Current vs. Collector -emitter Voltage Fig. 4 Relative Current Transfer Ratio vs. Ambient Temperature Fig. 1 Current Transfer Ratio vs. Forward Current Fig. 2 Forward Current vs. Forward voltage

SPEC NO: DSAD2838 REV NO: V.6 DATE: APR/06/2005 PAGE: 4 OF 7 APPROVED: J. Lu CHECKED: Tracy Deng DRAWN: Y.W.WANG ERP:120500 0036 Fig. 7 Collector -emitter Saturation Voltage vs. Forward Current Fig. 8 Collector Dark Current vs. Ambient Temperature

SPEC NO: DSAD2838 REV NO: V.6 DATE: APR/06/2005 PAGE: 5 OF 7 APPROVED: J. Lu CHECKED: Tracy Deng DRAWN: Y.W.WANG ERP:120500 0036 Cycle One cycle allowed to be dipped in solder including plastic nold portion. Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt % is recommended.) even if the voltage is within the absolute maximum ratings. Be aware that power is suddenly into the component any surge current may cause damage happen, 2.Cautions regarding noise Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. (2) Cautions Fluxes Flux 260 or below (molten solder temperature) 1.Recommended soldering conditions (Dip soldering) Less than 10 seconds. Temperature (1) Dip soldering Time * NOTES ON HANDLING

SPEC NO: DSAD2838 REV NO: V.6 DATE: APR/06/2005 PAGE: 6 OF 7 APPROVED: J. Lu CHECKED: Tracy Deng DRAWN: Y.W.WANG ERP:120500 0036 Within this device there exists GaAs (Gallium Arsenide) material which is a harmful substance if ingested. malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical specified operating ranges as set forth in the most recent products specifications. In developing your designs, please ensure that KINGBRIGHT products are used within KINGBRIGHT product could cause loss of human life, bodily injury or damage to property. stress. It is the responsibility of the buyer, when utilizing KINGBRIGHT products, to observe standards of safety, and to a avoid situations in which a malfunction or failure of a document, please confirm that this is the latest version. Not all devices / types available The information in this document is subject to change without notice. Before using this RESTRICTIONS ON PRODUCT USE GaAs dust and fumes are toxic. Do not break, cut or pulverize the product, or use chemicals to dissolve them. We are mention about our product quality stablity, semiconductor devices in general can in every country. Peak reflow temperature 235 ° C or below(package surface temperature) Package surface Tem perature T( 60 to 120s (preheating) 100 to 160 °C CAUTION to 30 s 210 °C Recommended Temperature Profile of infrared Reflow Flux Rosin flux containing small amount of chlorine(The flux with a maximum chlorine content of 0.2Wt % is recommended.) Number or reflows Three Time of temperature higher than 210 ° C 30 seconds or less 235 ° C (peak temperature) (heating) to 10 s NOTES ON HANDLING (1).Infrared reflow soldering 1.Recommended soldering conditions

SPEC NO: DSAD2838 REV NO: V.6 DATE: APR/06/2005 PAGE: 7 OF 7 APPROVED: J. Lu CHECKED: Tracy Deng DRAWN: Y.W.WANG ERP:120500 0036 Outline and Dimension ((((Tape )))) (Units : mm ) Tape Direction Outline and Dimension ((((Reel )))) Packing:1000pcs/reel