2SK3742 TOSHIBA | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 6

Technical content

TOSHIBA Field Effect Transistor Silicon N-Channel MOS Type (π-MOSIV) 2SK3742 Switching Regulator Applications

  • Low drain-source ON resistance: RDS (ON) = 2.2 Ω (typ.)
  • High forward transfer admittance: |Yfs| = 3.5 S (typ.)
  • Low leakage current: IDSS = 100 μA (VDS = 720 V)
  • Enhancement model: Vth = 4.0~5.0 V (VDS = 10 V, ID = 1 mA) Absolute Maximum Ratings (Ta = 25°C) Characteristic Symbol Rating Unit Drain-source voltage VDSS 900 V Drain-gate voltage (RGS = 20 kΩ) V DGR 900 V Gate-source voltage VGSS ±30 V DC (Note 1) I D 5 Drain current Pulse (t = 1 ms) (Note 1) IDP 15 A Drain power dissipation (Tc = 25°C) PD 45 W Single pulse avalanche energy (Note 2) EAS 595 mJ Avalanche current IAR 5 A Repetitive avalanche energy (Note 3) E AR 4.5 mJ Channel temperature Tch 150 °C Storage temperature range Tstg -55~150 °C Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Thermal Characteristics Characteristic Symbol Max Unit Thermal resistance, channel to case R th (ch-c) 2.78 °C/W Thermal resistance, channel to ambient R th (ch-a) 62.5 °C/W Note 1: Ensure that the channel temperature does not exceed 150°C during use of the device. Note 2: V DD = 90 V, Tch = 25°C (initial), L = 43.6 mH, IAR = 5.0 A, RG = 25 Ω Note 3: Repetitive rating: pulse width limited by maximum channel temperature This transistor is an electrostatic-sensitive device. Handle with care. Unit: mm 1: Gate 2: Drain 3: Source JEDEC ― JEITA SC-67 TOSHIBA 2-10U1B Weight: 1.7 g (typ.)

Electrical Characteristics (Ta = 25°C) Characteristic Symbol Test Condition Min Typ. Max Unit Gate leakage current IGSS V GS = ±30 V, VDS = 0 V ⎯ ⎯ ±10 μA Gate-source breakdown voltage V (BR) GSS IG =±10 μA, VDS = 0 V ±30 ⎯ ⎯ V Drain cutoff current IDSS V DS = 720 V, VGS = 0 V ⎯ ⎯ 100 μA Drain-source breakdown voltage V (BR) DSS ID = 10 mA, VGS = 0 V 900 ⎯ ⎯ V Gate threshold voltage Vth V DS = 10 V, ID = 1 mA 4.0 ⎯ 5.0 V Drain-source ON resistance RDS (ON) V GS = 10 V, ID = 3 A ⎯ 2.2 2.5 Ω Forward transfer admittance ⎪Yfs⎪ V DS = 20 V, ID = 3 A 1.5 3.5 ⎯ S Input capacitance Ciss ⎯ 1150 ⎯ Reverse transfer capacitance Crss ⎯ 20 ⎯ Output capacitance Coss VDS = 25 V, VGS = 0 V, f = 1 MHz ⎯ 110 ⎯ pF Rise time tr ⎯ 100 ⎯ Turn-on time ton ⎯ 140 ⎯ Fall time tf ⎯ 40 ⎯ Switching time Turn-off time t off ⎯ 130 ns Total gate charge Qg ⎯ 25 ⎯ Gate-source charge Qgs ⎯ 11 ⎯ Gate-drain charge Qgd VDD ∼ − 400 V, VGS = 10 V, ID = 5 A ⎯ 14 ⎯ nC Source-Drain Ratings and Characteristics (Ta = 25°C) Characteristic Symbol Test Condition Min Typ. Max Unit Continuous drain reverse current (Note 1) IDR ⎯ ⎯ ⎯ 5 A Pulse drain reverse current (Note 1) I DRP ⎯ ⎯ ⎯ 15 A Forward voltage (diode) VDSF I DR = 5 A, VGS = 0 V ⎯ ⎯ −1.7 V Reverse recovery time trr ⎯ 900 ⎯ ns Reverse recovery charge Qrr IDR = 5 A, VGS = 0 V, dIDR/dt = 100 A/μs ⎯ 5.4 ⎯ μC Marking RL = 66.7 Ω 0 V 10 V VGS VDD ∼ − 200 V ID = 3 A VOUT 50 Ω Duty < = 1%, tw = 10 μs Lot No. A line indicates lead (Pb)-free package or lead (Pb)-free finish. K3742 Part No. (or abbreviation code)

Ta = −55°C 100 DRAIN-SOURCE VOLTAGE V DS (V) DRAIN-SOURCE VOLTAGE V DS ( V ) ID – VDS DRAIN-SOURCE VOLTAGE V DS (V) ID – VDS DRAIN CURRENT I D (A) GATE-SOURCE VOLTAGE V GS ( V ) ID – VGS GATE-SOURCE VOLTAGE V GS (V) VDS – VGS DRAIN CURRENT I D (A) ⎪Yfs⎪ – ID DRAIN CURRENT I D (A) RDS (ON) – ID DRAIN-SOURCE ON RESISTANCE RDS (ON) ( Ω) 0 4 20 24 VGS = 6 V 8 10 6.5 COMMON SOURCE Tc = 25°C PULSE TEST FORWARD TRANSFER ADMITTANCE ⎪Yfs⎪ (S) DRAIN CURRENT I D (A) DRAIN CURRENT I D (A) 0 4 8 12 16 20 VGS = 6 V 7.25 6.5 810 COMMON SOURCE Tc = 25°C PULSE TEST COMMON SOURCE VDS = 20 V PULSE TEST COMMON SOURCE Tc = 25℃ PULSE TEST ID = 5 A 4 8 12 16 20 1.5 COMMON SOURCE VDS = 20 V PULSE TEST 0.01 0.01 0.1 10 100 Ta = −55°C COMMON SOURCE Tc = 25°C PULSE TEST 0.01 0.1 1 10 VGS = 10 V、15V 7.5 6.75 0.1 7.5 7.25 6.75 12 8 16

PD (W) GATE THRESHOLD VOLTAGE Vth (V) CASE TEMPERATURE Tc (°C) RDS (ON) – Tc DRAIN-SOURCE ON RESISTANCE RDS (ON) ( Ω) DRAIN-SOURCE VOLTAGE V DS (V) IDR – VDS DRAIN REVERSE CURRENT I DR (A) DRAIN-SOURCE VOLTAGE V DS (V) CAPACITANCE – VDS CAPACITANCE C (pF) CASE TEMPERATURE Tc (°C) Vth – Tc CASE TEMPERATURE Tc (°C) PD – Tc GATE-SOURCE VOLTAGE V GS (V) TOTAL GATE CHARGE Q g ( n C ) DYNAMIC INPUT / OUTPUT CHARACTERISTICS DRAIN-SOURCE VOLTAGE V DS (V) 0 10 20 VDD = 100 V VDS VGS 400 200 30 40 COMMON SOURCE ID = 5 A Tc = 25°C PULSE TEST COMMON SOURCE VGS = 0 V f = 1 MHz Tc = 25°C 0.1 1000 10000 1 10 100 Ciss Coss Crss COMMON SOURCE PULSE TEST 160 −40 0 40 80 120 −80 ID = 5A 1.5 VGS = 10 V COMMON SOURCE Tc = 25°C PULSE TEST 0.1 −0.4 −0.8 −1.2 −1.6 VGS = 0, −1,1 V COMMON SOURCE VDS = 10 V ID = 1 mA PULSE TEST −80 −40 0 40 80 120 160 100 100 200 500 400 300

DRAIN-SOURCE VOLTAGE VDS (V) SAFE OPERATING AREA CHANNEL TEMPERATURE (INITIAL) Tch ( ° C ) EAS – Tch AVALANCHE ENERGY EAS ( m J ) rth – tw PULSE WIDTH t w (s) NORMALIZED TRANSIENT THERMAL IMPEDANCE r th (t)/Rth (ch-c) 0.01 0.1 100 10 1000 100 10000 * SINGLE NONREPETITIVE PULSE Tc=25℃ CURVES MUST BE DERA TED LINEARLY WITH INCREASE IN TEMPERA TURE. ID max (PULSED) * ID max (CONTINUOUS) * DC OPERATION Tc = 25°C 100 μs * 1 ms * VDSS max −15 V 15 V TEST CIRCUIT WAVEFORM IAR BVDSS VDD V DS RG = 25 Ω VDD = 90 V, L = 43.6mH ⎟⎟ −⋅ ⋅ ⋅ = VDDBVDSS BVDSS2I L2 1ΕAS DRAIN CURRENT I D (A) T PDM t Duty = t/T Rth (ch-c) = 1.25°C/W Duty = 0.5 0.2 0.1 SINGLE PULSE 0.05 0.02 0.01 0.01 10μ 0.1 100μ 1 m 10m 100m 1 10 T PDM t Duty = t/T Rth (ch-c) = 2.78°C/W 0.001

RESTRICTIONS ON PRODUCT USE 20070701-EN

  • The information contained herein is subject to change without notice.
  • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity a nd vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA produc ts, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIB A products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconduct or Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.
  • The TOSHIBA products listed in this document are in tended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfuncti on or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage incl ude atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, et c.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk.
  • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations.
  • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringement s of patents or other rights of the third parties which may result from its use. No license is granted by implic ation or otherwise under any patents or other rights of TOSHIBA or the third parties.
  • Please contact your sales representative for product- by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations.