2SK2666 SHINDENGEN | Alldatasheet
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Copyright & Copy;2000 Shindengen Electric Mfg.Co.Ltd OUTLINE DIMENSIONS RATINGS ( F3F90HVX2 ) (Unit : mm) 900V 3A N-Channel Enhancement typeHVX-2 Series Power MOSFET Case : FTO-220 Switching power supply of AC 240V input High voltage power supply Inverter APPLICATION Input capacitance (Ciss) is small. Especially, input capacitance at 0 biass is small. The static Rds(on) is small. The switching time is fast. Avalanche resistance guaranteed.
FEATURES
Absolute Maximum Ratings iTc = 25j Item Symbol Conditions RatingsUnit Storage Temperature Tstg -55\`150 Channel Temperature Tch 150 Drain-Source Voltage VDSS 900 V Gate-Source Voltage VGSS }30 Continuous Drain CurrentiDCjID 3 Continuous Drain CurrentiPeak)IDP Pulse width 10Ês, Duty cycle 1/1006 A Continuous Source CurrentiDCjIS 3 Total Power DissipationPT 30 W Repetitive Avalanche CurrentIAR Tch = 150 3 A Single Avalanche EnergyEAS Tch = 25 48 mJ Repetitive Avalanche EnergyEAR Tch = 25 4.8 Dielectric Strength Vdis Terminals to case,@AC 1 minute2 kV Mounting Torque TOR i Recommended torque F0.3 N¥m j0.5 N¥m
Copyright & Copy;2000 Shindengen Electric Mfg.Co.Ltd 2SK2666 ( F3F90HVX2 )HVX-2 Series Power MOSFET
- Electrical Characteristics Tc = 25℃ Item Symbol Conditions Min. Typ. Max. Unit Drain-Source Breakdown Voltage V(BR)DSS ID = 1mA, VGS = 0V 900 V Zero Gate Voltage Drain Current IDSS VDS = 900V, VGS = 0V 250 μA Gate-Source Leakage Current IGSS VGS = ±30V, VDS = 0V ±0.1 Forward Tranｓconductance gfs ID = 1.5A, VDS = 10V 1.5 2.5 S Static Drain-Source On-ｓtate Resistance RDS(ON) ID = 1.5A, VGS = 10V 3.5 4.7 Ω Gate Threshold Voltage VTH ID = 1mA, VDS = 10V 2.5 3.0 3.5 V Source-Drain Diode Forward Voltage VSD IS = 1.5A, VGS = 0V 1.5 Thermal Resistance θjc junction to case 4.16 ℃/Ｗ Total Gate Charge Qg VDD = 400V, VGS = 10V, ID = 3A 30 nC Input Capacitance Ciss 630 Reverse Transfer Capacitance Crss VDS = 25V, VGS = 0V, f = 1MHZ 16p F Output Capacitance Coss 67 Turn-On Time ton ID = 1.5A, RL = 100Ω, VGS = 10V 40 70 ns Turn-Off Time toff 140 230
2SK2666 Transfer Characteristics Tc = −55°C 25°C 100°C 150°C VDS = 25V TYP Gate-Source Voltage V GS [V] Drain Current I D [A]
Static Drain-Source On-state Resistance 0.1 100 -50 0 50 100 150 2SK2666 VGS = 10V pulse test TYP ID = 1.5A Case Temperature Tc [ °C] Static Drain-Source On-state Resistance R DS(ON) [Ω ]
-50 0 50 100 150 2SK2666 VDS = 10V ID = 1mA TYP Case Temperature Tc [ °C] Gate Threshold Voltage V TH [V]
0.01 0.1 1 10 100 1000 2SK2666 100µs Tc = 25°C Single Pulse 200µs 1ms 10ms DC Drain-Source Voltage V DS [V] Drain Current I D [A] RDS(ON) limit
Transient Thermal Impedance 0.01 0.1 2SK2666 10-4 10-3 10-2 10-1 100 101 102 0.05 0.50.2 20 5052 200 500 2000 5000 Time t [s] Transient Thermal Impedance θjc(t) [°C/W]
Single Avalanche Energy Derating [%] Starting Channel Temperature Tch [ °C] Single Avalanche Energy Derating
0.005 f=1MHz Ta=25°C TYP Ciss Coss Crss Drain-Source Voltage V DS [V] Capacitance Ciss Coss Crss [pF]
Single Avalanche Current - Inductive Load 0.1 2SK2666 0.1 1 10 100 0.05 0.50.2 20 5052 200 500 2000 5000 VDD = 100V VGS = 15V → 0V Rg = 70ΩIAS = 3A EAS = 48mJEAR = 4.8mJ Inductance L [mH] Single Avalanche Current IAS [A]
Power Derating [%] Case Temperature Tc [ °C]
Gate Charge Characteristics ID = 3A TYP 100V VDD = 400V VGS VDS Gate Charge Qg [nC] Drain-Source Voltage V DS [V] Gate-Source Voltage V GS [V]