K177 ETC | Alldatasheet
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Technical content
ZEMREX KOOL-PADS | K177 & [St-o8S KOOL-PADS K177 and K228 offer a low cost alternative to all other types of thermally conductive insulators Constructed from a thermally conductive silicone rubber compound coated onto a 2 layer of woven glassfibre, they provide a : ZB Y strong flexible and clean insulator, which :. <a qf will not crack, age or permit contamination xe GD Used mainly between heatsinks and _— &F semiconductors, KOOL-PADS soft pliable e surfaces allow consistent and efficient heat transfer while maintaming good e@ electrical insulation When replacing mica and grease, KOOL-PADS will allow reduced assembly through ease of application They contain no organic \\ \\\\ materials, will not support fungus growth \\ —~ and resist most cleaning fluids \\ ES KOOL-PADS meet the UL flame retardant \\ ‘i rating of 94V-0 = f ADHESIVE COATING a KOOL-PAD insulators are available with e a\\ — pressure sensitive adhesive which is an Cc) es assembly aid and does not affect the Sai wide operating temperature range TS By CUSTOM AND STANDARD @ SHAPES Materials K177 and K228 are available from stock in most standard outlines shown on the following pages All materials are available for custom cutting with moderate tool charges and quick delivery Sheets are available from stock MOUNTING PRESSURES TYPICAL PROPERTIES OF KOOL-PADS Typical mounting pressures are 21-42 Kg/CM? This 1s achieved by using a PART PREFIX CODE K228- torque of 0 4-07 Nm on the transistor package size Most clip mounting “002 799 methods provide a lower pressure which wll result in @ higher thermal resistance Ecorse Toe | Normal 4000 5000 BREAKDOWN VOLTAGE Moist 2000 2500 All our insulating materials are tested determining lect srengin and net Ee determining dielectric strength and do not . istor)® involve punched holes in the test sample (FO-S transistor)” CWatt 0-50 Thermal Conductivity When screw mounting a semiconductor Wek m 0710 0.710 with nut, bolt and insulating bush there 1s 2 danger of llashthrough trom the e524 heatsink on the outside of the insulating bush Depending on the insulator | Eiongaton percent TT thickness and other mechanical factors (see insulating bush page) this Continuous Use ~60 to ~60 to flash-through could be as low as 700 Temp °C +180 +180 be higher then we suggest the use of mounting clips or Thermaflex Contact our technical department for advice ORDERING PROCEDURE. PLASTIC ENCAPSULATED SEMICONDUCTORS K177—NA—XXX If electrical insulation 1s not required K177—AC—XXX particularly when using plastic K228—NA—XXX encapsulated devices then a very much K228—AC—XXX higher thermal conductance can be achieved by using ZEMREX CM20 pads, NA = Non adhesive shown on the following pages AC = Adhesive coat XXX = Part No suffix