J30XXBA012LX4 DILABS | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 2
Technical content
Miniature RF Blocking Network For RF Noise Suppression in high speed mixed signal semiconductor devices J 30 XX BA01 2 L X 4 Part Number Identification Product J=Blocking Network Width (Mils) Material BLorBJ Internal Drawing Reference Voltage 2=25Vdc Metallization 100µ”Gold Finish Test Level Commercial Number of RC Segments Material and Electrical Characteristics Material Capacitance Resistance Rated Code (typical) (pad to pad) DF TCC Voltage BL 30pF 10ΩNom. 3.0%Max. X7R 25Vdc BJ 45pF 10ΩNom. 3.0%Max. X7R 25Vdc Functional Applications:
- HighSpeedDigital
- MixedSignalIC’s
- SuppressionofNoiseon
- DCSupplyLines
- MCMandHybridModules Bene/f_its:
- EliminatesNoiseatI/OPins
- ReplacesLargeDecouplingCapacitor
- withSuperiorPerformance
- CleanDCLinesBeyond18GHz Layout and Dimensions Segment Equivalent Schematic Representation
Miniature RF Blocking Network Metallization: Top: 50•/SquareTaN,300ÅTiW,100•InchminimumAu. Bottom: 300ÅTiW,100•InchminimumAu. Screening Options Test Code Test/Inspection Sample Size Description BondStrength 2Pcs/Plate 2bondingpadsoneachsample X IR 1%AQL 2 1/2 timesratedvoltageof25volts VisualInspection 100% 4 Side visual screening Padtopadresistancecheck 1%AQL Ensureisolationbetweensegmentsandboarder Performance Segment Bonding for Measurement For additional data of multi-segment devices please contact an inside sales representative. Typical Application