J11EG1113DP01 VITALCONN | Alldatasheet
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C enter line RECOMMENDED PCB LAYOUT VIEWED FROM COMPONENT SIDE TOP VIEW LEFT SIDE VIEWRIGHT SIDE VIEW FRONT VIEWBACK VIEW BOTTOM VIEW A 1 3 5 7 9 2 4 6 8 10 11 13 1412 O PERATING TEMPERATURE: -40°C~+85°C. MATING FORCE : 23N MAX. HOUSING : PBT,UL94V-0,BLACK. TERMINALS BRACKET: PBT,UL94V-0,BLACK. SHIELD: C2680,T=0.20MM,NICKEL PLATING ON ALL AREA. TERMINAL: PHOSPHOR BRONZE C5210,T=0.35MM, 6U" GOLD PLATING ON CONTACT AREA. D URABILITY : 750 CYCLES MIN. MATERIAL: STORAGE TEMPERATURE: -40°C~+85°C. MECHANICAL: ALL CRITICAL DIMENSIONS WITH "*" TAB-UP 1X1 1000BASE J11EG1113DP01 YELLOWGREEN A ll data sheet.com
E lectrical: 1.Turn ratio:1~2:J1~J2=1CT:1CT(±2%). 3~4:J3~J6=1CT:1CT(±2%). 7~8:J4~J5=1CT:1CT(±2%). 9~10:J7~J8=1CT:1CT(±2%). 2.OCL:350uH Min.at 100KHz 100mV 8mA DC. 3.Insertion Loss: -1.0 dB Max 1~100MHz. 4.Return loss: -18dB Min 1~30MHz; -12dB Min 60~80MHz. -10dB Min 80~100MHz. 5.Cross talk: -40dB Min 1~30MHz; -35dB Min 30~60MHz; -30dB Min 60~100MHz; 6.CMR: -30dB Min 1~100MHz; 7.Hi-Pot: 2250V DC 6S 1mA PRI TO SEC -14dB Min 30~60MHz. TD1+ TD1-2 SHIELD J1 TX1+ TX1- CT:1 1CT:1 1000pF/2KV4*75Ω CT:1 1CT:1 TD2+ TD2- TD3+ TD3- TD4+ TD4- TX2+ TX2- TX3+ TX3- TX4+ TX4- PCB SIDE TO PHY CABLE SIDE TAB-UP 1X1 1000BASE J11EG1113DP01 R IGHT L EFT YELLOWGREEN S tandard LED Color LED Specification LED WavelengthFoward(A) Foward(V) G reen568nm 20mA1.85-2.45V Y ellow585nm 20mA1.7-2.2V A ll data sheet.com
80℃ 120℃ 20℃ TIME(Sec.) ABC 60~12060120 A.Preheating B.Soldering C.Gradual Cooling Tip temperature:260±5°C. Tip temperature time:5Sec Max. Tip melting point of Sn96.5/Ag3/Cu0.5:217°C. Remarks: after wave soldering, the plastic positioning columns of the product which under the PCB will be slightly melted, but it won't affect its function. PROFILE OF WAVE SOLDER TAB-UP 1X1 1000BASE J11EG1113DP01 A ll data sheet.com