IS-705RH INTERSIL | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 2
Technical content
Features
- Electrically Screened to SMD #5962-00538
- QML Qualified per MIL-PRF-38535 Requirements
- R a d i a t i o n H a r d n e s s
- Precision 4.65V Voltage Monitor
- RESET Valid at VCC = 1.2V
- 200ms (Typ) RESET Pulse Width
Applications
- Flight Computers
- Controllers
- Critical Microprocessor Power Monitoring
- Reliable Replacement of Discrete Solutions Pin Configuration IS-705RH (8 LD FLATPACK) TOP VIEW TM MR VCC GND PFI WDO RESET WDI PFO
Ordering Information
MKT. NUMBER PART MARKING TEMP. RANGE (°C) PACKAGE (Pb-Free) 5962R0053801V9A IS0-705RH-Q -55 to +125 DIE IS0-705RH/SAMPLE IS0-705RH/SAMPLE -55 to +125 DIE SAMPLE 5962R0053801QXC (Note) IS9-705RH-8 Q 5962R00 53801QXC -55 to +125 8 Ld Flatpack, Solder SL 5962R0053801VXC (Note) IS9-705RH-Q Q 5962R00 53801VXC -55 to +125 8 Ld Flatpack, Solder SL IS9-705RH/PROTO (Note) IS9-705RH/PROTO IS9- 705RH /PROTO -55 to +125 8 Ld Flatpack, Solder SL NOTE: These Intersil Pb-free Hermetic packaged products employ 100% Au plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2007, 2010. All Rights Reserved Star*Power™ is a trademark of Intersil Americas Inc. March 23, 2010 FN4703.6
Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted in the quality certifications found at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accura te and reliable. However, no re sponsibility is assumed by Inte rsil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com FN4703.6 March 23, 2010 For additional products, see www.intersil.com/product_tree Die Characteristics DIE DIMENSIONS: 1500μmx1830µm (59milsx72mils) Thickness: 483µm ±25.4μm (19mils ±1mil) INTERFACE MATERIALS Glassivation Type: Nitride (Si3N4) over Silox (SiO2) Nitride Thickness: 4.0kÅ ±1.0kÅ Silox Thickness: 12.0kÅ ±4.0kÅ Top Metallization Top Metal 3: TiAlCu Thickness: 0.8µm ±0.02µm Metal 1 and 2: TiAlCu Thickness: 0.4µm ±0.01µm Process: UHF2X-CMOS, Junction Isolation Backside Finish: Silicon ASSEMBLY RELATED INFORMATION Substrate Potential: Unbiased (May be left floating or connected to GND.) ADDITIONAL INFORMATION Worst Case Current Density: <2.0 x 10
5 A/cm2
NOTE: Octagonal trim pads should be left unconnected. VCC (2) GND (3) PFI (4) PFO (5) WDI (6) RESET (7) WDO (8) MR (1) IS-705RH