IS-2100ARH RENESAS | Alldatasheet
Document overview
- Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
- PDF pages: 7
Technical content
Features
▪ Electrically screened to DLA SMD # 5962-99536 ▪ QML qualified per MIL-PRF-38535 requirements ▪ Radiation environment
- TID Rad Hard Assurance (RHA) testing ◦ HDR (50-300rad(Si)/s): 300krad(Si) ◦ LDR (≤ 10mrad(Si)/s): 50krad(Si) (AEH Only)
- DI RSG process provides latch-up immunity
- SEU rating: <90MeV/mg/cm
- Vertical device architectu re reduces sensitivity to low dose rates ▪ Bootstrap supply maximum voltage to 150V ▪ Drives 1000pF load at 1MHz with rise and fall times of 30ns (typical) ▪ 1.5A (typical) peak output current ▪ Independent inputs for non-half bridge topologies ▪ Low DC power consumption: 60mW (typical) ▪ Operates with VDD = VCC over 12V to 20V range ▪ Low-side supply undervoltage protection
Applications
▪ High frequency switch-mode power supplies ▪ Drivers for inductive loads ▪ DC motor drivers Inputs Outputs SD LIN HIN LO HO 1XX00 00000 00101 01010 01111 IS-2100ARH, IS-2100AEH Radiation Hardened High Frequency Half Bridge Drivers
1.1 Block Diagram
2.1 Pin Assignments
Figure 1. Block Diagram Figure 2. Pin Assignments - Top View
- Die and Assembly Characteristics
3.1 Metallization Mask Layout
Table 1. Die and Assembly Related Information
5 A/cm2
Table 2. IS-2100ARH, ISL-2100AEH Die Layout X-Y Coordinates
- Origin of coordinates is the lower left corner of the die.
7 VB 4561 711 109 280
8 HO 4561 1079 109 280
15 VSS 239 1719 109 109
Figure 3. XY Pad Center
FN9037 Rev.3.01 Page 5 Aug 21, 2024 IS-2100ARH, IS-2100AEH Datasheet 4. Package Outline Drawing For the most recent package outline drawing, see K16.A. K16.A
16 Lead Ceramic Metal Seal Flatpack Package
Rev 2, 1/10 SIDE VIEW TOP VIEW SECTION A-A -D- -C- SEATING AND BASE PLANE -H- BASE LEAD FINISH METAL PIN NO. 1 ID AREA 0.022 (0.56) 0.015 (0.38) 0.050 (1.27 BSC) 0.440 (11.18) 0.005 (0.13) MIN MAX 0.115 (2.92) 0.026 (0.66) 0.285 (7.24) 0.245 (6.22) 0.009 (0.23) 0.004 (0.10) 0.370 (9.40) 0.250 (6.35) 0.03 (0.76) MIN 0.13 (3.30) MIN 0.006 (0.15) 0.004 (0.10) 0.009 (0.23) 0.004 (0.10) 0.019 (0.48) 0.015 (0.38) 0.0015 (0.04) MAX 0.022 (0.56) 0.015 (0.38) 0.015 (0.38) 0.008 (0.20) PIN NO. 1 ID OPTIONAL 1 2 LEAD FINISH adjacent to pin one and shall be located within the shaded area shown. The manufacturer’s identification shall not be used as a pin one identification mark. Alternately, a tab may be used to identify pin one. of the tab dimension do not apply. 3. The maximum limits of lead dimensions (section A-A) shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. shall be molded to the bottom of the package to cover the leads. meniscus) of the lead from the body. Dimension minimum shall be reduced by 0.0015 inch (0.038mm) maximum when solder dip lead finish is applied. NOTES: Dimensioning and tolerancing per ANSI Y14.5M - 1982. Controlling dimension: INCH. Index area: A notch or a pin one identification mark shall be located If a pin one identification mark is used in addition to a tab, the limits Measure dimension at all four corners. For bottom-brazed lead packages, no organic or polymeric materials Dimension shall be measured at the point of exit (beyond the
FN9037 Rev.3.01 Page 6 Aug 21, 2024 IS-2100ARH, IS-2100AEH Datasheet 5. Ordering Information 6. Revision History Ordering SMD Number[1] 1. Specifications for Rad Hard QML devices are controlled by the Defense Logistics Agency Land and Maritime (DLA). The SMD numbers listed must be used when ordering. Part Number[2] 2. These Pb-free Hermetic packaged products employ 100% Au plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Radiation Hardness (Total Ionizing Dose) Package
Description
(RoHS Compliant) PKG. DWG. # Carrier Type Temp Range 5962F9953602V9A IS0-2100ARH-Q [3] 3. Die product tested at TA = + 25°C. The wafer probe test includes functional and parametric testing sufficient to make the die capable of meeting the electrical performance outlined in SMD. HDR to 300krad(Si) Die - - -55 to +125°C 5962F9953602VXC IS9-2100ARH-Q 16 Ld Flatpack K16.A Tray5962F9953602QXC IS9-2100ARH-8 N/A IS9- 2100ARH/PROTO[4] 4. The /PROTO and /SAMPLE are not rated or certified for Total I onizing Dose (TID) or Single Event Effect (SEE) immunity. These parts are intended for engineering evaluation purposes only. The /PROTO parts meet the electrical limits and conditions across temperature specified in the DLA SMD and are in the same form and fit as the qualified device. The /SAMPLE parts are capable of meeting the electrical limits and conditions specified in the DLA SMD. The /SAMPLE parts do not receive 100% screening across temperature to the DLA SMD electrical limits. These part types do not come with a Certificate of Conformance because they are not DLA qualified devices. N/A N/A IS0- 2100ARH/SAMPLE[3][4] N/A Die - - 5962F9953603VXC IS9-2100AEH-Q HDR to 300krad(Si) LDR to 50krad(Si) 16 Ld Flatpack K16.A Tray 5962F9953603V9A IS0-2100AEH-Q [3] Die - - Revision Date Description
3.01 Aug 21, 2024
Applied the latest template. Updated page 1 description. Updated radiation features bullets. Added block diagram. Updated ordering information table.
3.00 May 10, 2016
Updated Ordering information table by applying new standards and adding Notes 1 and 2. Added Table 2 on page 3. Added Package Outline Drawing K16.A.
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