IPU60R600C6_15 INFINEON | Alldatasheet
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Material Content Data Sheet Sales Product Name IPU60R600C6 Issued 29. September 2015 MA# MA001348750 Package PG-TO251-3-341 Weight* 388.54 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] Sum [%] Average Mass [ppm] Sum [ppm] chip inorganic material silicon 7440-21-3 3.063 0.79 0.79 7883 7883 leadframe non noble metal iron 7439-89-6 0.248 0.06 639 inorganic material phosphorus 7723-14-0 0.075 0.02 192 non noble metal copper 7440-50-8 248.124 63.86 63.94 638598 639429 wire non noble metal aluminium 7429-90-5 0.414 0.11 0.11 1065 1065 encapsulation organic material carbon black 1333-86-4 0.389 0.10 1000 plastics epoxy resin 11.788 3.03 30340 inorganic material silicondioxide 60676-86-0 117.366 30.21 33.34 302064 333404 leadfinish non noble metal tin 7440-31-5 3.740 0.96 0.96 9626 9626 plating non noble metal nickel 7440-02-0 0.509 0.13 0.13 1310 1310 solder noble metal silver 7440-22-4 0.071 0.02 182 non noble metal tin 7440-31-5 0.057 0.01 146 non noble metal lead 7439-92-1 2.702 0.70 0.73 6955 7283 *deviation < 10% Sum in total: 100.00 1000000 Important Remarks: Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption 7a, Lead in high melting temperature type solders. Company Infineon Technologies AG Address
81726 München
www.infineon.com