IPS60R400CE ISC | Alldatasheet

Document overview

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Technical content

iscwebsite:www.iscsemi.cn isc & iscsemi isregisteredtrademark1 iscN-ChannelMOSFETTransistor IPS60R400CE

  • FEATURES
  • WithTO-251(IPAK)packaging
  • Highspeed switching
  • Easytouse
  • 100% avalanchetested
  • MinimumLot-to-Lotvariations forrobustdevice performanceandreliable operation
  • APPLICATIONS
  • Powersupply
  • DC-DCconverters
  • Motorcontrol
  • Switching applications
  • ABSOLUTE MAXIMUM RATINGS(Ta=25℃) SYMBOL PARAMETER VALUE UNIT VDSS Drain-SourceVoltage 600 V VGSS Gate-SourceVoltage ±30 V ID DrainCurrent-Continuous 14.7 A IDM DrainCurrent-SinglePulsed 30 A PD TotalDissipation 112 W Tj OperatingJunctionTemperature -40~150 ℃ Tstg StorageTemperature -40~150 ℃
  • THERMALCHARACTERISTICS SYMBOL PARAMETER MAX UNIT Rth(ch-c) Channel-to-casethermalresistance 1.12 ℃/W Rth(ch-a) Channel-to-ambientthermalresistance 62 ℃/W

iscwebsite:www.iscsemi.cn isc & iscsemi isregisteredtrademark2 iscN-ChannelMOSFETTransistor IPS60R400CE ELECTRICALCHARACTERISTICS TC=25℃ unlessotherwisespecified SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT BVDSS Drain-SourceBreakdownVoltage VGS=0V;ID=0.25mA 600 V VGS(th) GateThresholdVoltage VDS=VGS;ID=0.3mA 2.5 3.5 V RDS(on) Drain-SourceOn-Resistance VGS=13V;ID=3.8A 340 400 mΩ IGSS Gate-SourceLeakageCurrent VGS= ±20V;VDS=0V ±0.1 μA IDSS Drain-SourceLeakageCurrent VDS=600V;VGS=0V;Tj=25℃ VDS=600V;VGS=0V;Tj=125℃ 100 μA VSDF Diodeforwardvoltage ISD=4.8A,VGS =0V 0.9 V