IPS2050H STMICROELECTRONICS | Alldatasheet
Document overview
- Manufacturer or author: STMICROELECTRONICS
- PDF pages: 32
Technical content
Datasheet sections
- 1 Block diagram
- 2 Pin connection
- 3 Absolute maximum ratings
- 4 Thermal data
- 5 Electrical characteristics
- 6 Output Logic
- 7 Protections and diagnostic
- 7.1 Under-voltage lock-out
- 7.2 Over-temperature
- 7.3 Overload
- 7.3.1 Overload protection with dual threshold
- 7.3.2 Overload protection with single (low) threshold
- 7.3.3 Overload protection with single (high) threshold
- 7.4 VCC disconnection protection
- 7.5 GND disconnection protection
- 8 Active clamp
- 9 Package information
- 9.1 Package mechanical data
- 10 Packing information
- 10.1 Packing mechanical data
- 11 Ordering information
Features
- 8 V to 60 V operating supply voltage range
- Operating output current: 2.4 A (IPS2050H/HQ) or 5.6 A (IPS2050H-32/HQ-32) per channel
- Smart driving of capacitive load
- Fast demagnetization of inductive loads
- Under-voltage lock-out
- V CC over-voltage protection
- Per-channel overload and over-temperature protection
- Case over-temperature protection
- Ground disconnection protection
- Per channel overload/over-temperature event diagnostic pins
- Designed to meet IEC 61000-4-2, IEC 61000-4-4, IEC 61000-4-5
- Packages: PowerSSO-24 and QFN48L 8x6x0.9 mm
Applications
- Programmable logic control
- Vending machines
- Industrial PC peripheral input/output
- Numerical control machines
- General high-side switch applications
Description
The IPS2050H/HQ and IPS2050H-32/HQ-32 are dual high-side switch ICs able to drive capacitive, resistive or inductive loads with one side connected to ground. The very low RDS-ON (≤ 50 mΩ up to TJ = 125 °C) makes the IC suitable for applications with up to 2.4 A (IPS2050H/HQ) or 5.6 A (IPS2050H-32/HQ-32) steady state operating current. Each output channel is independently protected against junction over-temperature events by a junction temperature sensor, and a further temperature sensor is included to monitor case temperature, so an overheated output channel can only be turned back ON when the case temperature returns below the reset temperature. The embedded per-channel overload protection circuit monitors the output current and, on triggering of the activation threshold (IPK-X), starts modulating the impedance of the output switch to limit the output current to ILIM-X, for both IC and load protection. The IC offers two different sets of activation threshold and limitation levels (IPKH-X, ILIMH-X and IPKL-X, ILIML-X) for smart driving of capacitive loads (such as bulb lamps) and loads with initial peak current requirements. The IC diagnostics is based on two FAULT pins (current source), one for each channel. Each FAULT pin is activated by an overload or an over-temperature event on the related channel. Product status link IPS2050H IPS2050H-32 IPS2050HQ IPS2050HQ-32 Product label High efficiency, high-side switch with extended diagnostics and smart driving for capacitive loads IPS2050H, IPS2050H-32 IPS2050HQ, IPS2050HQ-32 DS13779 - Rev 3 - August 2022 For further information contact your local STMicroelectronics sales office.
1 Block diagram
Figure 1. IPS2050H/HQ, IPS2050H-32/HQ-32 block diagram
2 Pin connection
Figure 2. Pin connections (top through view) Table 1. Pin descriptions Channel 2 initial current duration / level selector. Section 7.3 and Table 9 / Table 10). channel 2 (the over-current limit for channel 2 is only IPKL-2). over-current threshold for channel 2 is only IPKH-2). Channel 1 initial current duration / level selector. Section 7.3 and Table 9 / Table 10). channel 1 (the over-current limit for channel 1 is only IPKL-1). over-current threshold for channel 1 is only IPKH-1). Note: Leaving IPD X floating is equivalent to a 1 µs duration for IPKH-X.
3 Absolute maximum ratings
under these conditions is not implied. All voltages are referenced to GND. Table 2. Absolute maximum ratings
- intended as worst case when IC is in normal operation (no fault)
4 Thermal data
Table 3. Thermal data
- Rth between the die and the bottom case surface measured by cold plate as per JESD51.
5 Electrical characteristics
(8 V < VCC < 60 V; -40 °C < TJ < 125 °C, unless otherwise specified) Table 4. Supply Table 5. Output stage Table 6. Switching
Electrical characteristics
Figure 3. Timing Table 7. Input pin (IN1 or IN2) Table 8. Diagnostic pins (FLT1, FLT2) IHFLT Diagnostic pins source current in fault condition.
Table 9. IPS2050H/HQ overload protections Overload with Single Level (Highest) Protection: IPD pin connected to GND by 10kΩ resistor; see Section 7.3.3 . Table 10. IPS2050H-32/HQ-32 overload protections Overload with Single Level (Highest) Protection: IPD pin connected to GND by 10kΩ resistor; see Section 7.3.3 .
Figure 4. High (left) and Low (right) ILOAD control activation thresholds (IPK) and limitation levels (ILIM) Table 11. Other protections
6 Output Logic
Table 12. Output stage truth table
- Pin voltage = I OUT * RLOAD
- Channels with T J > TJSD are forced off and the related FLT are activated
Figure 5. Typical application diagram with opto-couplers
Figure 6. Typical application diagram without opto-couplers
7 Protections and diagnostic
The IC integrates several protections to help the design of robust applications.
7.1 Under-voltage lock-out
The IC is turned off if the voltage on VCC pin falls below the turn-off threshold (VUVOFF). Normal operation restarts after VCC exceeds the turn-on threshold (VUVON). Turn-on and turn-off thresholds are defined in Table 4.
7.2 Over-temperature
The device is protected against overheating in case of overload conditions. During the driving period (when the MCU is forcing the INX pin high), if the output is overloaded, the device suffers two different thermal stresses, one related to the junction temperature of each output channel, and the other related to the whole case temperature. The two thermal faults (Thermal Junction and Thermal Case) have different trigger thresholds: TJSD and TCSD, respectively. Usually, in thermal stress conditions due to overload, the junction thermal shutdown is the first protection that is activated: each output channel (OUTX) is turned off when its junction temperature (TJX) is higher than the activation threshold (TJSD) and turned back on when it goes below the reset threshold (TJR). This behavior continues while overload on the output persists. When the thermal protection is active for OUTX, the related FLTX (current source) becomes active accordingly. If the thermal protection is active and the temperature of the case (TC) increases over the case protection threshold (TCSD), then the thermal case protection is activated and the output is switched off until the junction temperature of each channel in fault and case temperature fall below the respective reset thresholds (TCR and TJR). The FLTX pins are active even when thermal case events occur. Figure 7 shows the thermal protection behavior, while Figure 8 and Figure 9 show typical temperature trends and output vs. input state. IPS2050H, IPS2050H-32, IPS2050HQ, IPS2050HQ-32 Protections and diagnostic DS13779 - Rev 3 page 12/32
Figure 9. Thermal protection plot, TC > TCSD
7.3 Overload
output current sensing section and an output current limitation section. current limitation level (ILIM-X) and FLTX pin is activated until the overload condition is removed. sections for details and Table 9 / Table 10 for specific activation thresholds and limitation levels.
7.3.1 Overload protection with dual threshold
activation thresholds IPKH-X and IPKL-X. The above design rule is valid in the range 470 pF ≤ CPD ≤ 470 nF (see Table 9 / Table 10). If the IPKH-X is triggered within the DPKX time frame, then the output current is limited to ILIMH-X. After DPKX has elapsed, the IC operates with IPKL-X activation threshold and ILIML-X limitation level, respectively.
Figure 10. Short-circuit behavior with dual threshold (TCASE < TCSD)
7.3.2 Overload protection with single (low) threshold
the related INX pin with a 220 KΩ resistor. This condition is equivalent to setting DPKX = 0 μs. Note: Leaving I PDX floating is equivalent to having an initial peak duration of 1 μs.
7.3.3 Overload protection with single (high) threshold
7.4 VCC disconnection protection
the output channel can be driven normally until the voltage on VCC pin remains higher than the UVLO threshold. inductance is discharged through the power switch thanks to the integrated demagnetization circuit.
7.5 GND disconnection protection
output channel is turned off regardless of the input status. disconnection event, a current (ILGND) flows through OUT pin. power, which is activated by an active clamp as if the input had been deactivated. Figure 11. Ground disconnection
8 Active clamp
driver turns off an inductance, an under-voltage on output is detected. IC internal switch and load resistance. Figure 12. Active clamp equivalent principle schematic Figure 13. Typical demagnetization energy (single pulse, two channels driven simultaneously) at VCC = 24
9 Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.
9.1 Package mechanical data
Figure 14. PowerSSO-24 package dimensions [mm] Table 13. PowerSSO-24 mechanical data
Package information
DS13779 - Rev 3 page 18/32
Figure 15. PowerSSO-24 suggested footprint [mm] suggestion which may differ from the customer PCB supplier design rules.
Figure 16. QFN48L package dimensions [mm]
Table 14. QFN48L mechanical data Table 15. Tolerance of forms and positions Figure 17. QFN48L suggested footprint [mm]
10 Packing information
10.1 Packing mechanical data
Figure 18. PowerSSO-24 tube shipment (no suffix) Table 16. PowerSSO-24 tube shipment information
Figure 19. PowerSSO-24 reel shipment Table 17. PowerSSO-24 reel information
Figure 20. PowerSSO-24 tape drawings Table 18. PowerSSO-24 tape dimension Note: According to the Electronic Industries Association (EIA) standard 481 rev. A, Feb 1986.
Figure 21. QFN48L reel shipment reference Table 19. Standard SPC parameters
Table 20. Ordering information
Ordering information
DS13779 - Rev 3 page 27/32
Revision history
Table 21. Document revision history 15-Nov-2021 1 Initial release. 02-Dec-2021 2 Changed ISOFF max. value in Table 4.
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