IPD088N06N3G ISC | Alldatasheet

Document overview

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Technical content

iscwebsite:www.iscsemi.cn isc & iscsemi isregisteredtrademark1 iscN-ChannelMOSFETTransistor IPD088N06N3G

  • FEATURES
  • WithTO-252(DPAK)packaging
  • Withlowgatedrive requirements
  • Veryhigh commutation ruggedness
  • 100% avalanchetested
  • MinimumLot-to-Lotvariations forrobustdevice performanceandreliable operation
  • APPLICATIONS
  • Switching applications
  • LCD&PDPTV
  • PCsilverbox
  • UPSandsolar
  • ABSOLUTE MAXIMUM RATINGS(Ta=25℃) SYMBOL PARAMETER VALUE UNIT VDSS Drain-SourceVoltage 60 V VGSS Gate-SourceVoltage ±20 V ID DrainCurrent-Continuous@TC=25℃ TC=100℃ 47 A IDM DrainCurrent-SinglePulsed 200 A PD TotalDissipation 71 W Tj OperatingJunctionTemperature -55~175 ℃ Tstg StorageTemperature -55~175 ℃
  • THERMALCHARACTERISTICS SYMBOL PARAMETER MAX UNIT Rth(ch-c) Channel-to-casethermalresistance 2.1 ℃/W Rth(ch-a) Channel-to-ambientthermalresistance 62 ℃/W

iscwebsite:www.iscsemi.cn isc & iscsemi isregisteredtrademark2 iscN-ChannelMOSFETTransistor IPD088N06N3G ELECTRICALCHARACTERISTICS TC=25℃ unlessotherwisespecified SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT BVDSS Drain-SourceBreakdownVoltage VGS=0V;ID=1mA 60 V VGS(th) GateThresholdVoltage VDS=±20V;ID=0.034mA 2 4 V RDS(on) Drain-SourceOn-Resistance VGS=10V;ID=50A 7.1 8.8 mΩ IGSS Gate-SourceLeakageCurrent VGS= ±20V;VDS=0V ±0.1 μA IDSS Drain-SourceLeakageCurrent VDS=60V;VGS=0V@Tj=25℃ Tj=125℃ 100 μA VSDF Diodeforwardvoltage ISD=50A,VGS =0V 1.2 V