IPA65R110CFD ISC | Alldatasheet

Document overview

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Technical content

iscwebsite:www.iscsemi.cn isc & iscsemi isregisteredtrademark1 IscN-ChannelMOSFETTransistor IPA65R110CFD

  • FEATURES
  • WithTO-220Fpackage
  • Lowinputcapacitanceandgate charge
  • Lowgateinputresistance
  • 100% avalanchetested
  • MinimumLot-to-Lotvariations forrobustdevice performanceandreliable operation
  • APPLICATIONS
  • Switching applications
  • ABSOLUTE MAXIMUM RATINGS(Ta=25℃) SYMBOL PARAMETER VALUE UNIT VDSS Drain-SourceVoltage 650 V VGSS Gate-SourceVoltage ±20 V ID DrainCurrent-Continuous@Tc=25℃ Tc=100℃ 31.2 19.7 A IDM DrainCurrent-SinglePulsed 99.6 A PD TotalDissipation@TC=25℃ 277.8 W Tch Max.OperatingJunctionTemperature 150 ℃ Tstg StorageTemperature -55~150 ℃
  • THERMALCHARACTERISTICS SYMBOL PARAMETER MAX UNIT Rth(ch-c) Channel-to-casethermalresistance 3.6 ℃/W Rth(ch-a) Channel-to-ambientthermalresistance 80 ℃/W

iscwebsite:www.iscsemi.cn isc & iscsemi isregisteredtrademark2 IscN-ChannelMOSFETTransistor IPA65R110CFD ELECTRICALCHARACTERISTICS TC=25℃ unlessotherwisespecified SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT BVDSS Drain-SourceBreakdownVoltage VGS=0V;ID=1mA 650 V VGS(th) GateThresholdVoltage VDS= ±20V;ID=1.3mA 3.5 4.5 V RDS(on) Drain-SourceOn-Resistance VGS=10V;ID=12.7A 99 110 mΩ IGSS Gate-SourceLeakageCurrent VGS= ±20V;VDS=0V ±0.1 μA IDSS Drain-SourceLeakage Current VDS=600V;VGS=0V;Tj=25℃ VDS=600V;VGS=0V;Tj=150℃ 1.5 400 μA VSDF Diodeforwardvoltage ISD=19.1A,VGS =0V 0.9 V