IP4853CX24 NXP | Alldatasheet

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Technical content

  1. Product profile

1.1 General description

The IP4853CX24 is a device that fully integrates a bidirectional level shifter or voltage translator, EMI filter and ESD protection diodes. It is specifically designed to be used for memory card interfaces such as SD, microSD and MultiMediaCard (MMC) memory cards. The integrated power supply unit supplies memory cards with 2.9 V directly from the battery. This enables a 1.8 V operating host-side device (e.g. a processor interface) to communicate with a 2.9 V compliant memory card using its integrated level shifter. Radiation from digital signals in the higher harmonics, close to typical mobile phone frequencies, is suppressed by the EMI filter. The IP4853CX24 is fabricated using monolithic silicon technology in a Wafer Level Chip-Scale Package (WLCSP) with 0.4 mm pitch.

1.2 Features

n Dark Green compliant. n Pb-free, RoHS compliant n Integrated EMI filters n Feedback channel for clock synchronization n Integrated ESD protection according to IEC 61000-4-2, level 4 n WLCSP with 0.4 mm pitch

1.3 Applications

n SD memory card, microSD memory card and MMC interfaces in latest electronic appliances such as: u Mobile phone or smart phone u Digital camera u Card reader in (laptop) computer n Appliances requiring one or several of the following features: u Level shifting and voltage translation from 1.8 V to 2.9 V and from 2.9 V to 1.8 V u ESD protection according to IEC 61000-4-2, level 4 u Power supply regulation from battery to 2.9 V card memory voltage u EMI filtering u Integration of interface-specific biasing resistor network IP4853CX24 SD, MMC and microSD memory card integrated level shifter with PSU, EMI filter and ESD protection Rev. 02 — 15 June 2009 Product data sheet

IP4853CX24_2 © NXP B.V. 2009. All rights reserved.

2.1 Pinning

2.2 Pin description

Table 1. Pin allocation table Table 2. Pin description

IP4853CX24_2 © NXP B.V. 2009. All rights reserved. [1] The pin names relate particularly to SD memory cards, but also apply to microSD and MMC memory cards. [2] I = input, O = output, I/O = input and output, S = power supply. Table 3. Ordering information

IP4853CX24_2 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 02 — 15 June 2009 4 of 19 NXP Semiconductors IP4853CX24 SD, MMC and microSD memory card integrated level shifter 4. Block diagram Fig 2. Block diagram 001aah980 CD VOLTAGE REGULATORVBAT CLK_IN VSD CLK_SD CLK_FB DIR_CMD CMD_H R13 R14 R12 R11 R10 DIR_0 DATA0_H CMD_SD DATA0_SD DIR_1_3 DATA1_H DATA2_H DATA3_H VCC ENABLE B4A4 C3, C4 DATA1_SD DATA2_SD host side SD card side DATA3_SD WP R15 GND IP4853CX24

IP4853CX24_2 © NXP B.V. 2009. All rights reserved.

5.1 Logic control signals

[1] H = HIGH; L = LOW and X = don’t care. Table 4. Control signal truth table

IP4853CX24_2 © NXP B.V. 2009. All rights reserved.

  1. Recommended operating conditions

[1] The device is still fully functional, but the voltage on pin VSD might drop below the recommended memory card supply voltage. Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Table 6. Operating conditions

IP4853CX24_2 © NXP B.V. 2009. All rights reserved. [1] Typical values are measured at Tamb =2 5°C. [2] EMI filter line capacitance per data channel from I/O pin to driver; Cch is guaranteed by design. Table 7. Static characteristics

IP4853CX24_2 © NXP B.V. 2009. All rights reserved. Table 8. Voltage regulator Tamb = 25°C; unless otherwise specified. Measuring points: ENABLE signal at 0.5VCC and regulator output signal at 0.97VO(reg). Table 9. Frequency response of integrated EMI filters Tamb = 25°C; unless otherwise specified.

IP4853CX24_2 © NXP B.V. 2009. All rights reserved. Table 10. Output rise and fall times see Figure4 for timing diagram andFigure5 for test circuit.

IP4853CX24_2 © NXP B.V. 2009. All rights reserved. [1] tPD is the same as HIGH-to-LOW propagation delay (tPHL ) and LOW-to-HIGH propagation delay (tPLH ). Table 11. Propagation delay of time domain response driver part see Figure4 for timing diagram andFigure5 for test circuit.

IP4853CX24_2 © NXP B.V. 2009. All rights reserved. P=V CC × ICC +V BAT × IBAT . Measuring points: host-side at 0.5VCC and memory card-side at 0.5VO(reg). VOL and VOH are typical output voltage levels that occur with the output load. Table 12. Power dissipation per channel

IP4853CX24_2 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 02 — 15 June 2009 12 of 19 NXP Semiconductors IP4853CX24 SD, MMC and microSD memory card integrated level shifter 10. Test information 11. Marking Definitions test circuit: R source = source resistance of pulse generator. R term = termination resistance should be equal to output impedance Z0 of the pulse generator. C L = load capacitance including jig and probe capacitance. R L = load resistance. Fig 5. Load circuitry for measuring switching time 50 % 50 % tW tW 20 % 70 % 0 V VI VI negative input positive input 0 V 50 % 50 % 70 % 20 % tf tr tr tf 001aah982 DUT VCCVBAT VI VO R term R source R LC L PULSE GENERATOR tr = tf = 1.8 ns DUT 50 Ω Fig 6. Marking of IP4853CX24 001aah952 top view bump A1 indicator LASER MARKING AREA

IP4853CX24_2 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 02 — 15 June 2009 13 of 19 NXP Semiconductors IP4853CX24 SD, MMC and microSD memory card integrated level shifter 12. Package outline Fig 7. Package outline IP4853CX24 (WLCSP24) REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA IP4853CX24 IP4853CX24 08-04-14 09-06-11 UNIT mm max nom min 0.66 0.61 0.56 0.22 0.20 0.18 0.29 0.26 0.23 2.06 2.01 1.96 2.06 2.01 1.96 0.4 1.6 A DIMENSIONS (mm are the original dimensions) WLCSP24: wafer level chip-size package; 24 bumps; 2.01 x 2.01 x 0.61 mm 0 1 2 mm scale A 1 A 2 0.44 0.41 0.38 b D E e e1 1.6 bump A1 index area D E X detail X A b A B C D E 24135 e e

IP4853CX24_2 © NXP B.V. 2009. All rights reserved. Table 13. Tape dimensions Cover tape[3] width W 1 5.75 max. Bending radius in winding direction R 30 min.

IP4853CX24_2 © NXP B.V. 2009. All rights reserved. [1] Cumulated pitch error:±0.2 mm per 10 pitches. [2] Carbon loaded polystyrene 100 % recyclable. [3] The cover tape shall not overlap the sprocket holes.

  1. Design and assembly recommendations

14.1 PCB design guidelines

Table14 for the recommended PCB design parameters.

14.2 PCB assembly guidelines for Pb-free soldering

Table 14. Recommended PCB design parameters Table 15. Assemble recommendations

IP4853CX24_2 © NXP B.V. 2009. All rights reserved. The device is capable of withstanding at least three reflows of this profile. Table 16. Characteristics Table 17. Abbreviations

IP4853CX24_2 © NXP B.V. 2009. All rights reserved. Table 18. Revision history

  • Table11: Added minimum values and values for ‘host-side pins CLK_IN to CLK_FB’.
  • Table7: Changed maximum value for regulator quiescent current (not active mode).
  • Table8: Moved values from maximum to minimum for power supply rejection ratio.
  • Removed /LF from all instances of type number IP4853CX24. IP4853CX24_1 20080722 Product data sheet - -

IP4853CX24_2 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 02 — 15 June 2009 18 of 19 NXP Semiconductors IP4853CX24 SD, MMC and microSD memory card integrated level shifter 17. Legal information

17.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

17.2 Definitions

Draft —The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet —A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

17.3 Disclaimers

General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes —NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use —NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications —Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values —Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale —NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license —Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control —This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data —The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.

17.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 18. Contact information For more information, please visit:http://www.nxp.com For sales office addresses, please send an email to:salesaddresses@nxp.com Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.

NXP Semiconductors IP4853CX24 SD, MMC and microSD memory card integrated level shifter © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 15 June 2009 Document identifier: IP4853CX24_2 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 19. Contents 14 Design and assembly recommendations . . . 15

14.2 PCB assembly guidelines for Pb-free