IP4350CX24 NXP | Alldatasheet

Document overview

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Technical content

  1. Product profile

1.1 General description

The IP4350CX24 is a diode array designed to provide protection to downstream components against ElectroStatic Discharge (ESD) voltages as high as 15 kV. The IP4350CX24 integrates 9 pairs of rail-to-rail diodes, 12 Zener diodes and 15 resistors in a single wafer-level chip-scale package. It is fabricated using monolithic silicon semiconductor technology and measures only 1.95 mm× 2.11 mm. These features make the IP4350CX24 ideal for use in applications requiring a high degree of miniaturization, such as mobile phone handsets, cordless telephones and personal digital devices.

1.2 Features

n Pb-free, RoHS compliant and free of halogen and antimony (Dark Green compliant) n All SD memory card channels with integrated ESD protection, EMI and RF filters n ESD protection up to 15 kV on 9 channels at output terminals n Integrated EMI and RF filters with pull-up resistors on 5 channels n Integrated EMI and RF filters on 4 channels n Additional SD card power supply protection n Wafer level chip-scale package with 0.4 mm pitch n Write protection, card detect biasing resistor integrated n Supports electrical card detection n Also available as IP4352CX24 with different filter behavior, same footprint

1.3 Applications

n SD memory card interfaces in cellular and PCS mobile handsets n Cordless telephones n Digital still and video cameras n Media players n Card readers IP4350CX24 9-channel SD memory card interface ESD protection filter to IEC 61000-4-2 level 4 Rev. 01 — 5 February 2010 Product data sheet

IP4350CX24_1 © NXP B.V. 2010. All rights reserved.

2.1 Pinning

2.2 Pin description

Table 1. Pin description

IP4350CX24_1 © NXP B.V. 2010. All rights reserved. [1] I = input, O = output, I/O = input and output, S = power supply. Table 2. Ordering information

IP4350CX24_1 © NXP B.V. 2010. All rights reserved. specified level 4 (8 kV contact discharge). Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Table 4. Characteristics Tamb = 25°C unless otherwise specified.

IP4350CX24_1 © NXP B.V. 2010. All rights reserved. [1] All rise or fall times measured using source with 0 V to 3 V steps, 10 % to 90 %. [2] Performed on all high speed lines (channels including R1 to R9, seeFigure2).

8.1 Insertion loss

Table 5. Frequency response Table 6. Time domain response[1]

IP4350CX24_1 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 5 February 2010 6 of 16 NXP Semiconductors IP4350CX24 9-channel SD memory card interface ESD protection filter (1) pin A1 to pin A4 (2) pin A2 to pin A5 Fig 4. Measured insertion loss magnitudes (1) pin B1 to pin B4 (2) pin B2 to pin B5 (3) pin C2 to pin C5 Fig 5. Measured insertion loss magnitudes 001aaj751 f (MHz) 10−1 103 10410211 0 −20 −30 −10 s21 (dB) −40 (2) (1) 001aaj752 f (MHz) 10−1 103 10410211 0 −20 −30 −10 s21 (dB) −40 (1) (2) (3)

IP4350CX24_1 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 5 February 2010 7 of 16 NXP Semiconductors IP4350CX24 9-channel SD memory card interface ESD protection filter

8.2 Crosstalk

The set-up for crosstalk measurements in a 50Ω NWA system from one channel to another is shown inFigure8. Typical examples of crosstalk measurement results are depicted inFigure9,Figure10 and Figure11. Unused channels are terminated with 50Ω to ground. (1) pin D1 to pin D4 (2) pin D2 to pin D5 Fig 6. Measured insertion loss magnitudes (1) pin E1 to pin E4 (2) pin E2 to pin E5 Fig 7. Measured insertion loss magnitudes 001aak050 f (MHz) 10−1 103 10410211 0 −20 −30 −10 s21 (dB) −40 (2) (1) 001aak051 f (MHz) 10−1 103 10410211 0 −20 −30 −10 s21 (dB) −40 (2) (1)

IP4350CX24_1 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 5 February 2010 8 of 16 NXP Semiconductors IP4350CX24 9-channel SD memory card interface ESD protection filter Fig 8. Crosstalk measurement configuration (1) pin A1 to pin B4 (2) pin A1 to pin E4 Fig 9. Crosstalk behavior between adjacent channels OUT_2 001aag220

50 W 50 W

IN_1 OUT_1IN_2 TEST BOARD 50 W50 W 001aaj797 f (MHz) 10−1 103 10410211 0 −80 −60 −40 −20 α ct (dB) −100 (1) (2)

IP4350CX24_1 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 5 February 2010 9 of 16 NXP Semiconductors IP4350CX24 9-channel SD memory card interface ESD protection filter (1) pin A2 to pin E5 (2) pin A2 to pin B5 Fig 10. Crosstalk behavior between adjacent channels (1) pin C2 to pin E5 (2) pin C2 to pin D5 Fig 11. Crosstalk behavior between adjacent channels 001aaj795 f (MHz) 10−1 103 10410211 0 −80 −60 −40 −20 α ct (dB) −100 (1) (2) 001aaj796 f (MHz) 10−1 103 10410211 0 −80 −60 −40 −20 α ct (dB) −100 (1) (2)

IP4350CX24_1 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 5 February 2010 10 of 16 NXP Semiconductors IP4350CX24 9-channel SD memory card interface ESD protection filter 9. Package outline Fig 12. Package outline IP4350CX24/LF (WLCSP24) ReferencesOutline version European projection Issue date IEC JEDEC JEITA IP4350CX24 ip4350cx24_lf_po Unit mm max nom min 0.66 0.61 0.56 0.22 0.20 0.18 0.31 0.26 0.21 2.16 2.11 2.06 2.00 1.95 1.90 0.4 1.6 A Dimensions WLCSP24: wafer level chip-size package; 24 bumps; 1.95 x 2.11 x 0.61 mm IP4350CX24 A1 A2 0.41 bDEe e 1 1.6 0 1 2 mm scale bump A1 index area B AD E X detail X A e e b E D C B A 12345 09-04-06 09-07-15

IP4350CX24_1 © NXP B.V. 2010. All rights reserved.

  1. Soldering of WLCSP packages

10.1 Introduction to soldering WLCSP packages

mount reflow soldering description”. Wave soldering is not suitable for this package. All NXP WLCSP packages are lead-free.

10.2 Board mounting

  1. Solder paste printing on the PCB
  2. Component placement with a pick and place machine
  3. The reflow soldering itself

10.3 Reflow soldering

  • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (seeFigure13) than a PbSn process, thus reducing the process window
  • Solder paste printing issues, such as smearing, release, and adjusting the process window for a mix of large and small components on one board
  • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature), and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic) while being low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table7. Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, seeFigure13.

Table 7. Lead-free process (from J-STD-020C)

IP4350CX24_1 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 5 February 2010 12 of 16 NXP Semiconductors IP4350CX24 9-channel SD memory card interface ESD protection filter For further information on temperature profiles, refer to application noteAN10365 “Surface mount reflow soldering description”.

10.3.1 Stand off

The stand off between the substrate and the chip is determined by:

  • The amount of printed solder on the substrate
  • The size of the solder land on the substrate
  • The bump height on the chip The higher the stand off, the better the stresses are released due to TEC (Thermal Expansion Coefficient) differences between substrate and chip.

10.3.2 Quality of solder joint

A flip-chip joint is considered to be a good joint when the entire solder land has been wetted by the solder from the bump. The surface of the joint should be smooth and the shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps after reflow can occur during the reflow process in bumps with high ratio of bump diameter to bump height, i.e. low bumps with large diameter. No failures have been found to be related to these voids. Solder joint inspection after reflow can be done with X-ray to monitor defects such as bridging, open circuits and voids.

10.3.3 Rework

In general, rework is not recommended. By rework we mean the process of removing the chip from the substrate and replacing it with a new chip. If a chip is removed from the substrate, most solder balls of the chip will be damaged. In that case it is recommended not to re-use the chip again. MSL: Moisture Sensitivity Level Fig 13. Temperature profiles for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = MSL limit, damage level peak temperature

IP4350CX24_1 © NXP B.V. 2010. All rights reserved. AN10365 “Surface mount reflow soldering description”.

10.3.4 Cleaning

Cleaning can be done after reflow soldering. Table 8. Abbreviations Table 9. Revision history

IP4350CX24_1 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 5 February 2010 14 of 16 NXP Semiconductors IP4350CX24 9-channel SD memory card interface ESD protection filter 13. Legal information

13.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

13.2 Definitions

Draft —The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet —A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification —The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.

13.3 Disclaimers

Limited warranty and liability —Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes —NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use —NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications —Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on a weakness or default in the customer application/use or the application/use of customer’s third party customer(s) (hereinafter both referred to as “Application”). It is customer’s sole responsibility to check whether the NXP Semiconductors product is suitable and fit for the Application planned. Customer has to do all necessary testing for the Application in order to avoid a default of the Application and the product. NXP Semiconductors does not accept any liability in this respect. Limiting values —Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale —NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license —Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control —This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Non-automotive qualified products —Unless the data sheet of an NXP Semiconductors product expressly states that the product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.

IP4350CX24_1 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 5 February 2010 15 of 16 NXP Semiconductors IP4350CX24 9-channel SD memory card interface ESD protection filter product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications.

13.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.14. Contact information For more information, please visit:http://www.nxp.com For sales office addresses, please send an email to:salesaddresses@nxp.com

NXP Semiconductors IP4350CX24 9-channel SD memory card interface ESD protection filter © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 5 February 2010 Document identifier: IP4350CX24_1 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 15. Contents 10.1 Introduction to soldering WLCSP packages . . 11