IP4286CZ6-TTD | DigiCamel IC Datasheet

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PDF pages: 12

Technical content

Product proﬁle

1.1 General description

The IP4286CZ6 is designed to protect the capacitive loads of Input/Output (I/O) ports (such as USB 2.0, Ethernet, DVI etc.) from being damaged by ElectroStatic Discharge (ESD). To provide ESD protection to downstream signal and supply components, the IP4286CZ6 incorporates four pairs of ultra-low capacitance rail-to-rail diodes plus two Zener diodes. This provides protection against contact discharge voltages as high as±8 kV in accordance with IEC 61000-4-2, level 4. The ESD protection is independent of the supply voltage due to the rail-to-rail diodes being connected to a Zener diode. The IP4286CZ6 is fabricated using monolithic silicon technology and integrates 4 ultra-low capacitance rail-to-rail ESD protection diodes plus two Zener diodes.

1.2 Features

n Pb-free and RoHS compliant n ESD IEC 61000-4-2 level 4,±8 kV contact discharge compliant protection n Four input ESD rail-to-rail protection diodes with ultra-low input capacitance of 0.6 pF maximum n Low-voltage clamping due to integrated Zener diodes

1.3 Applications

General-purpose downstream ESD protection high frequency analog signals and high-speed serial data transmission for ports inside: n PC/Notebook USB 2.0/IEEE 1394 ports n Cellular and PCS mobile handsets n DVI interfaces n HDMI interfaces n Cordless telephones n Wireless data (WAN/LAN) systems n PDAs IP4286CZ6 Integrated 4-channel ESD protection Rev. 01 — 20 April 2009 Objective data sheet

1 ESD protection for I/O signals

3 ESD protection for I/O signals

4 ESD protection for I/O signals

6 ESD protection for I/O signals

Table 2. Ordering information Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).

6.1 Typical application

Table 4. Characteristics Tamb = 25°C unless otherwise speciﬁed.

IP4286CZ6_1 © NXP B.V. 2009. All rights reserved. Objective data sheet Rev. 01 — 20 April 2009 4 of 12 NXP Semiconductors IP4286CZ6 Integrated 4-channel ESD protection 7. Package outline Fig 2. Package outline SOT457 (TSOP6) REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT457 SC-74 wB Mbp D e pin 1 index A Lp Q detail X H E E v M A AB y scale c X 13 2 456 0 1 2 mm Plastic surface-mounted package (TSOP6); 6 leads SOT457 UNIT A 1 bp cD E H E Lp Qy wv mm 0.1 0.013 0.40 0.25 3.1 2.7 0.26 0.10 1.7 1.3 e 0.95 3.0 2.5 0.2 0.10.2 DIMENSIONS (mm are the original dimensions) 0.6 0.2 0.33 0.23 A 1.1 0.9 05-11-07 06-03-16

IP4286CZ6_1 © NXP B.V. 2009. All rights reserved. Objective data sheet Rev. 01 — 20 April 2009 5 of 12 NXP Semiconductors IP4286CZ6 Integrated 4-channel ESD protection Fig 3. Package outline SOT886 (XSON6) terminal 1 index area REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT886 MO-252 SOT886 04-07-15 04-07-22 DIMENSIONS (mm are the original dimensions) XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm D E e A 1 b LL1 0 1 2 mm scale Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. UNIT mm 0.25 0.17 1.5 1.4 0.35 0.27 A max b E 1.05 0.95 D ee 1 L 0.40 0.32 0.50.6 A (1) max 0.5 0.04 (2) (2) A

IP4286CZ6_1 © NXP B.V. 2009. All rights reserved. Objective data sheet Rev. 01 — 20 April 2009 6 of 12 NXP Semiconductors IP4286CZ6 Integrated 4-channel ESD protection Fig 4. Package outline SOT363 (SC-88) REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT363 SC-88 wB Mbp D e pin 1 index A Lp Q detail X H E E v M A AB y 0 1 2 mm scale c X 13 2 456 Plastic surface-mounted package; 6 leads SOT363 UNIT A 1 max bp cD E e1 H E Lp Qy wv mm 0.1 0.30 0.20 2.2 1.8 0.25 0.10 1.35 1.15 0.65 e 1.3 2.2 2.0 0.2 0.10.2 DIMENSIONS (mm are the original dimensions) 0.45 0.15 0.25 0.15 A 1.1 0.8 04-11-08 06-03-16

IP4286CZ6_1 © NXP B.V. 2009. All rights reserved. Objective data sheet Rev. 01 — 20 April 2009 7 of 12 NXP Semiconductors IP4286CZ6 Integrated 4-channel ESD protection 8. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application NoteAN10365 “Surface mount reﬂow soldering description”.

8.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for ﬁne pitch SMDs. Reﬂow soldering is ideal for the small pitches and high densities that come with increased miniaturization.

8.2 Wave and reﬂow soldering

Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following:

Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reﬂow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature proﬁle. Leaded packages, packages with solder balls, and leadless packages are all reﬂow solderable. Key characteristics in both wave and reﬂow soldering are:
Board speciﬁcations, including the board ﬁnish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering

8.3 Wave soldering

Key characteristics in wave soldering are:

Process issues, such as application of adhesive and ﬂux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave
Solder bath speciﬁcations, including temperature and impurities

8.4 Reﬂow soldering

Lead-free versus SnPb soldering; note that a lead-free reﬂow process usually leads to higher minimum peak temperatures (seeFigure5) than a SnPb process, thus reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board
Reﬂow temperature proﬁle; this proﬁle includes preheat, reﬂow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classiﬁed in accordance with Table5 and6 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reﬂow soldering, seeFigure5.

Table 5. SnPb eutectic process (from J-STD-020C) Table 6. Lead-free process (from J-STD-020C)

11.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Deﬁnitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

11.2 Deﬁnitions

Draft —The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modiﬁcations or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet —A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales ofﬁce. In case of any inconsistency or conﬂict with the short data sheet, the full data sheet shall prevail.

11.3 Disclaimers

General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes —NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation speciﬁcations and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use —NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications —Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the speciﬁed use without further testing or modiﬁcation. Limiting values —Stress above one or more limiting values (as deﬁned in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale —NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/proﬁle/terms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conﬂict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license —Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control —This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.

11.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 12. Contact information For more information, please visit:http://www.nxp.com For sales ofﬁce addresses, please send an email to:salesaddresses@nxp.com Document status[1][2] Product status[3] Deﬁnition Objective [short] data sheet Development This document contains data from the objective speciﬁcation for product development. Preliminary [short] data sheet Qualiﬁcation This document contains data from the preliminary speciﬁcation. Product [short] data sheet Production This document contains the product speciﬁcation.

NXP Semiconductors IP4286CZ6 Integrated 4-channel ESD protection © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 20 April 2009 Document identifier: IP4286CZ6_1 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 13. Contents

Product Information

IP4286CZ6-TTD specifications and overview.

Summary

Integrated 4-channel ESD protection Rev. 01-20 April 2009

Description

Integrated 4-channel ESD protection Rev. 01-20 April 2009

Source title IP4286CZ6-TTD Datasheet(PDF) - NXP Semiconductors

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