IP3338CX24_09 NXP | Alldatasheet

Document overview

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Technical content

  1. Product profile

1.1 General description

The IP3338CX24 is a 10-channel1 LC low-pass filter network designed to filter undesired RF signals in the 800 MHz to 3000 MHz frequency band. In addition, the IP3338CX24 incorporates diodes which protect downstream components from ElectroStatic Discharge (ESD) voltages as high as 15 kV. The IP3338CX24 is fabricated using monolithic silicon technology and integrates 10 inductors and 20 back-to-back diodes in a single Wafer-Level Chip-Scale Package (WLCSP) measuring 2.11 mm by 2.11 mm (typical). These features make the IP3338CX24 ideal for use in applications requiring the utmost in miniaturization such as mobile phone handsets, cordless telephones and personal digital devices.

1.2 Features

n Pb-free, RoHS compliant and halogen free package; Dark Green compliant n Integrated 10-channelπ-type LC filter network with 60 nH channel inductance n 125 Ω series resistance; 25 pF (typical) capacitance per line n Integrated ESD protection withstanding±15 kV contact discharge, far exceeding IEC 61000-4-2, level 4 n WLCSP with 0.4 mm pitch

1.3 Applications

n Cellular and Personal Communication System (PCS) mobile handsets n Cordless telephones n Wireless data (WAN/LAN) systems n PDAs IP3338CX24 10-channel integrated LC-filter network with ESD input protection to IEC 61000-4-2 level 4 Rev. 02 — 10 March 2009 Product data sheet 1. Also available as a 7-channel device (IP3337CX18).

IP3338CX24_2 © NXP B.V. 2009. All rights reserved.

2.1 Pinning

Table 1. Pinning Table 2. Ordering information

IP3338CX24_2 © NXP B.V. 2009. All rights reserved. far exceedsIEC 61000-4-2, level 4 (8 kV contact discharge). Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).

IP3338CX24_2 © NXP B.V. 2009. All rights reserved.

7.1 Insertion loss

The setup for measuring insertion loss in a 50Ω system is shown inFigure3. The measured frequency response curves for all channels are shown inFigure4. Table 4. Channel characteristics Tamb = 25°C; unless otherwise specified. Table 5. Frequency characteristics Tamb = 25°C; unless otherwise specified.

800 MHz < f < 1 GHz 38 40 - dB

1 GHz < f < 3 GHz 35 40 - dB

IP3338CX24_2 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 02 — 10 March 2009 5 of 12 NXP Semiconductors IP3338CX24 10-channel integrated LC-filter network with ESD input protection

7.2 Crosstalk

The setup for measuring crosstalk in a 50Ω system is shown inFigure5. The crosstalk between adjacent channels within the IP3338CX24 for different channel pairs measured in a 50Ω NetWork Analyzer (NWA) system, is shown inFigure6. In all cases, all unused connections are terminated with 50Ω to ground. (1) Channel 1 (pins A2 and A5). (2) Channel 9 (pins E2 and E5). (3) Channel 4 (pins B1 and B4). Fig 4. Measured frequency response curves 001aai760 f (MHz) 10−1 103 10410211 0 −20 −30 −40 −50 −60 −10 α il (dB) −70 (3) (2) (1) Fig 5. Crosstalk measurement configuration OUT_2 001aai756 50 Ω 50 Ω Vgen DUT IN_1 OUT_1IN_2 TEST BOARD 50 Ω50 Ω

IP3338CX24_2 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 02 — 10 March 2009 6 of 12 NXP Semiconductors IP3338CX24 10-channel integrated LC-filter network with ESD input protection (1) Channels 2 and 6 (pins A1 and C4). (2) Channels 4 and 5 (pins B1 and C5). (3) Channels 4 and 3 (pins B1 and B5). (4) Channels 4 and 7 (pins B1 and D5). (5) Channels 2 and 1 (pins A1 and A5). (6) Channels 2 and 9 (pins A1 and E5). Fig 6. Measured crosstalk between adjacent channels 001aai758 f (MHz) 10−1 103 10410211 0 −50 −60 −70 −20 −30 −40 −80 −10 α ct −90 (1) (2) (3) (4) (5) (6)

IP3338CX24_2 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 02 — 10 March 2009 7 of 12 NXP Semiconductors IP3338CX24 10-channel integrated LC-filter network with ESD input protection 8. Package outline Fig 7. Package outline IP3338CX24/LF (WLCSP24) ReferencesOutline version European projection Issue date IEC JEDEC JEITA IP3338CX24/LF ip3338cx24_lf_po Unit mm max nom min 0.66 0.61 0.56 0.22 0.20 0.18 0.31 0.26 0.21 2.16 2.11 2.06 2.16 2.11 2.06 0.4 1.6 A Dimensions WLCSP24: wafer level chip-size package; 24 bumps; 2.11 x 2.11 x 0.61 mm IP3338CX24/LF A1 A2 0.41 bDEe e 1 1.6 0 1 2 mm scale bump A1 index B AD E X detail X A e e b E D C B A 12345 08-09-09 09-02-23

IP3338CX24_2 © NXP B.V. 2009. All rights reserved.

  1. Soldering of WLCSP packages

9.1 Introduction to soldering WLCSP packages

mount reflow soldering description”. Wave soldering is not suitable for this package. All NXP WLCSP packages are lead-free.

9.2 Board mounting

  1. Solder paste printing on the PCB
  2. Component placement with a pick and place machine
  3. The reflow soldering itself

9.3 Reflow soldering

  • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (seeFigure8) than a PbSn process, thus reducing the process window
  • Solder paste printing issues, such as smearing, release, and adjusting the process window for a mix of large and small components on one board
  • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature), and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic) while being low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table6. Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, seeFigure8.

Table 6. Lead-free process (from J-STD-020C)

IP3338CX24_2 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 02 — 10 March 2009 9 of 12 NXP Semiconductors IP3338CX24 10-channel integrated LC-filter network with ESD input protection For further information on temperature profiles, refer to application noteAN10365 “Surface mount reflow soldering description”.

9.3.1 Stand off

The stand off between the substrate and the chip is determined by:

  • The amount of printed solder on the substrate
  • The size of the solder land on the substrate
  • The bump height on the chip The higher the stand off, the better the stresses are released due to TEC (Thermal Expansion Coefficient) differences between substrate and chip.

9.3.2 Quality of solder joint

A flip-chip joint is considered to be a good joint when the entire solder land has been wetted by the solder from the bump. The surface of the joint should be smooth and the shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps after reflow can occur during the reflow process in bumps with high ratio of bump diameter to bump height, i.e. low bumps with large diameter. No failures have been found to be related to these voids. Solder joint inspection after reflow can be done with X-ray to monitor defects such as bridging, open circuits and voids.

9.3.3 Rework

In general, rework is not recommended. By rework we mean the process of removing the chip from the substrate and replacing it with a new chip. If a chip is removed from the substrate, most solder balls of the chip will be damaged. In that case it is recommended not to re-use the chip again. MSL: Moisture Sensitivity Level Fig 8. Temperature profiles for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = MSL limit, damage level peak temperature

IP3338CX24_2 © NXP B.V. 2009. All rights reserved. AN10365 “Surface mount reflow soldering description”.

9.3.4 Cleaning

Cleaning can be done after reflow soldering. Table 7. Abbreviations Table 8. Revision history

  • Figure1: replaced bump A1 index marker with grey square
  • Removed ‘Marking’ section
  • Figure7: replaced bump A1 index marker with grey square
  • Removed ‘Packing information’ section
  • Replaced ‘Design and assembly recommendations’ with standard text inset IP3338CX24_1 20081113 Product data sheet - -

IP3338CX24_2 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 02 — 10 March 2009 11 of 12 NXP Semiconductors IP3338CX24 10-channel integrated LC-filter network with ESD input protection 12. Legal information

12.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

12.2 Definitions

Draft —The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet —A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

12.3 Disclaimers

General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes —NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use —NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications —Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values —Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale —NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license —Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control —This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.

12.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For more information, please visit:http://www.nxp.com For sales office addresses, please send an email to:salesaddresses@nxp.com Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.

NXP Semiconductors IP3338CX24 10-channel integrated LC-filter network with ESD input protection © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 10 March 2009 Document identifier: IP3338CX24_2 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 14. Contents 9.1 Introduction to soldering WLCSP packages . . . 8