IMP34DT05 STMICROELECTRONICS | Alldatasheet
Document overview
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- PDF pages: 20
Technical content
Datasheet sections
- 1 Pin description
- 2 Acoustic and electrical specifications
- 2.1 Acoustic and electrical characteristics
- 2.2 Timing characteristics
- 2.3 Frequency response
- 3 Application recommendations
- 4 Carrier tape mechanical specifications
- 5 Process recommendations
- 6 Sensing element
- 7 Absolute maximum ratings
- 8 Functionality
- 8.1 L/R channel selection
- 9 Package information
- 9.1 Soldering information
- 9.2 HCLGA package information
Features
- Single supply voltage
- Low power consumption
- AOP = 122.5 dBSPL
- 64 dB signal-to-noise ratio
- Omnidirectional sensitivity
- –26 dBFS ±3 dB sensitivity
- PDM output
- HCLGA package – Top-port design – SMD-compliant – EMI-shielded – ECOPACK, RoHS, and “Green” compliant
Applications
- Anti-tampering devices
- Vibration monitoring
- Audio-activated functions
- Predictive maintenance
- Noise cancelling
- Sound detection for alarm systems
- Human / machine voice interface
- Anti-theft systems
Description
The IMP34DT05 is an ultra-compact, low-power, omnidirectional, digital MEMS microphone built with a capacitive sensing element and an IC interface. The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process dedicated to producing audio sensors. The IC interface is manufactured using a CMOS process that allows designing a dedicated circuit able to provide a digital signal externally in PDM format. The IMP34DT05 is a low-distortion digital microphone with a 64 dB signal-to-noise ratio and –26 dBFS ±3 dB sensitivity. The IMP34DT05 is available in a top-port, SMD-compliant, EMI-shielded package and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C. Product status link IMP34DT05 Product summary Order code IMP34DT05TR Temperature range [°C] -40 to +85 Package HCLGA 4LD (3 x 4 x 1 mm) Packing Tape and reel Product label MEMS audio sensor omnidirectional digital microphone for industrial applications IMP34DT05 Datasheet DS12725 - Rev 3 - April 2019 For further information contact your local STMicroelectronics sales office.
1 Pin description
Figure 1. Pin connections Table 1. Pin description
1 Vdd Power supply
2 LR Left/Right channel selection
3 CLK Synchronization input clock
4 DOUT Left/Right PDM data output
2 Acoustic and electrical specifications
2.1 Acoustic and electrical characteristics
Table 2. Acoustic and electrical characteristics
- Typical specifications are not guaranteed.
- Input clock in static mode.
- Time from the first clock edge to valid output data.
Table 3. Distortion specifications @ 1 kHz
- Typical specifications are not guaranteed.
2.2 Timing characteristics
Table 4. Timing characteristics Figure 2. Timing waveforms
2.3 Frequency response
Figure 3. Typical frequency response normalized to 1 kHz
3 Application recommendations
Figure 4. IMP34DT05 electrical connections (top view) Figure 5. IMP34DT05 electrical connections for stereo configuration (top view) 1 of the device (common design practice). The L/R pin must be connected to Vdd or GND (refer to Table 6. L/R channel selection).
4 Carrier tape mechanical specifications
Figure 6. Carrier tape without microphone (top view) Figure 7. Carrier tape with microphone (top view)
5 Process recommendations
- The recommended pick-up area for the IMP34DT05 package must be defined using the worst case (ie. no device alignment during picking process). This area has been defined considering all the tolerances of the components involved (reel, package, sound inlet). Picker tolerance shall be considered as well.
- To prevent damage to the MEMS membrane or incorrect pick-up and placement, do not pick up the component on the inlet area
- For the package outline please refer to Figure 7. Carrier tape with microphone (top view). Nozzle shape, size, and placement accuracy are the other key factors to consider when deciding on the coordinates for the picking.
- Device alignment before picking is highly recommended.
- A vacuum force greater than 7 psi must be avoided
- 1 kPa = 0.145 psi (lb/in²) = 0.0102 kgf/cm² = 0.0098 atm
- MSL (moisture sensitivity level) Class 3
- Maximum of 3 reflow cycles is recommended
- All recommended dimensions (device safe-picking area) do not include the pick-and-place equipment tolerances
Figure 8. Recommended picking area To have a safe pick-up "by design", ST strongly advises an ad hoc nozzle. porthole of the device (4 vacuum ports located at each corner of the device). disturbances during the picking or placing of the devices in the tape and reel.
Figure 9. Recommended picker design
6 Sensing element
The sensing element shall mean the acoustic sensor consisting of a conductive movable plate and a fixed plate placed in a tiny silicon chip. This sensor transduces the sound pressure into the changes of coupled capacity between those two plates. IMP34DT05 Sensing element DS12725 - Rev 3 page 10/20
7 Absolute maximum ratings
maximum rating conditions for extended periods may affect device reliability. Table 5. Absolute maximum ratings This device is sensitive to mechanical shock, improper handling can cause permanent damage to the part. This device is sensitive to electrostatic discharge (ESD), improper handling can cause permanent damage to the part.
8 Functionality
8.1 L/R channel selection
L/R pin must be connected to Vdd or GND. Table 6. L/R channel selection connect the pin itself to GND for the respective channel selection.
9 Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.
9.1 Soldering information
The HCLGA (3 x 4) 4LD package is also compliant with the RoHS and “Green” standards and is qualified for soldering heat resistance according to JEDEC J-STD-020. Land pattern and soldering recommendations are available at www.st.com. Figure 10. Recommended soldering profile limits Table 7. Recommended soldering profile limits
Package information
DS12725 - Rev 3 page 13/20
9.2 HCLGA package information
Figure 11. HCLGA (3 x 4 x 1 mm) 4-lead package outline and mechanical data
- The MEMS microphone plastic cap can exhibit some level of variation in color when the device is subjected
to thermal processes. This variation does does not affect acoustic or electrical performance.
- Ring plating can be subject to change not affecting acoustic and electrical performance.
Figure 12. Land pattern
Revision history
Table 8. Document revision history