DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 18

Technical content

Features

  • Component level IP57 water and dust resistant
  • Signal to noise ratio of 73dB(A) SNR
  • Acoustic overload point at 135dBSPL
  • Flat frequency response with low frequency roll off at 20Hz
  • Power optimized modes determined by V DD level
  • Package dimensions: 4mm x 3mm x 1.2mm
  • Differential output
  • Omnidirectional pickup pattern Typical applications
  • Active Noise Cancellation (ANC) headphones and wireless earbuds
  • Devices with Voice User Interface (VUI) - Smart speakers - Home automation - IoT devices
  • High quality audio capturing - Conference systems - Cameras and camcorders
  • Industrial or home monitoring with audio pattern detection

Ordering information

Table 1 Ordering information Product name Package Marking Ordering code IM73A135V01 PG-LLGA-5-2 I73A03 SP003803274 Datasheet Please read the Important Notice and Warnings at the end of this document V 1.20 www.infineon.com 2021-07-07

Figure 1 IM73A135V01 block diagram Product validation Technology qualified for industrial applications. Ready for validation in industrial applications according to the relevant tests of IEC 60747 and 60749 or alternatively JEDEC47/20/22. Environmental robustness Infineon’s latest Sealed Dual Membrane MEMS technology delivers high ingress protection (IP57) at a microphone level. The sealed MEMS design prevents water or dust from entering between membrane and backplate, preventing mechanical blockage or electric leakage issues commonly observed in MEMS microphones. Microphones built with the sealed dual membrane technology can be used to create IP68 devices, requiring only minimal mesh protection. Table 2 Environmental robustness Test Standard Test Condition IP5x dust resistance1) Arizona dust A4 coarse, vertical orientation , sound hole upwards, 10 cycles (15 minutes sedimentation, 6 sec blowing) IPx7 water immersion2) Temporary immersion in 1 meter of water for 30 minutes. Microphone tested 2 hours after removal 1 The number "5" stands for the dust ingress rating or the capacity to withstand the effects of fine, abrasive dust particles. 2 The number "7" identifies the level of liquid protection. IM73A135V01 IP57 dust and water resistant analog XENSIVTM MEMS microphone Block diagram Datasheet 2 V 1.20 2021-07-07

IP57 dust and water resistant analog XENSIVTM MEMS microphone Table of contents Datasheet 3 V 1.20 2021-07-07

1 Typical performance characteristics

Test conditions(unless otherwise specified): VDD = 2.75V, TA= 25°C, output unloaded Figure 2 Typical amplitude response Figure 3 Typical free field ultrasonic response Figure 4 Typical group delay and phase response Figure 5 Typical noise floor (unweighted) Figure 6 Typical THD vs SPL Figure 7 Typical THD vs frequency IM73A135V01 IP57 dust and water resistant analog XENSIVTM MEMS microphone Typical performance characteristics Datasheet 4 V 1.20 2021-07-07

2 Acoustic characteristics

Test conditions (unless otherwise specified in the table): VDD = 2.75V, TA = 25°C, 55% R.H., audio bandwidth 20Hz to 20kHz, output unloaded Table 3 IM73A135V01 acoustic specifications Parameter Symbol Values Unit Note or Test Condition Min. Typ. Max. Sensitivity -39 -38 -37 dBV 1kHz, 94 dB SPL, all operating modes Low Frequency Cutoff Point fC LP 20 Hz -3dB point relative to 1kHz Acoustic overload point Normal mode AOPNP 135 dBSPL THD = 10%. Low power mode AOPLP 130 Signal to Noise ratio Normal mode SNRNP 73 dB(A) A-Weighted Low power mode SNRLP 71 Noise floor Normal mode -111 dBV(A) A-Weighted Low power mode -109 Total harmonic distortion Normal mode 94dBSPL THDNP 0.5 % Measuring 2nd to 5th harmonics, 1kHz132dBSPL 1.0 135dBSPL 10.0 Low power mode 94dBSPL THDLP 0.5 124dBSPL 1.0 130dBSPL 10.0 Phase Response 75Hz 12 ° 1kHz 2 3kHz -2 Group Delay 250Hz 52 µs 600Hz 7 1kHz 2 4kHz 0.5 Directivity Omnidirectional Pickup pattern Polarity Increasing Vout Increasing SPL IM73A135V01 IP57 dust and water resistant analog XENSIVTM MEMS microphone Acoustic characteristics Datasheet 6 V 1.20 2021-07-07

2.1 Free field frequency response

Figure 10 IM73A135V01 free field frequency response Table 4 IM73A135V01 free field frequency response, normalised to 1kHz sensitivity value. Frequency (Hz) Upper Limit (dB) Lower Limit (dB) 20 -1.5 -4.5 50 +0.5 -1.5 800 +1 -1 1000 0 0 1200 +1 -1 6000 +2 -1 8000 +4 -1 15000 +9 0 IM73A135V01 IP57 dust and water resistant analog XENSIVTM MEMS microphone Acoustic characteristics Datasheet 7 V 1.20 2021-07-07

3 Electrical characteristics and parameters

3.1 Absolute maximum ratings

Stresses at or above the listed maximum ratings may affect device reliability or cause permanent device damage. Functional device operation at these conditions is not guaranteed. Table 5 Absolute maximum ratings Parameter Symbol Values Unit Note / Test ConditionMin. Max. Supply voltage VDDmax 3.0 V Storage temperature TS -40 100 °C Operating temperature TA -40 85 °C

3.2 Electrical parameters

Table 6 IM73A135V01 electrical parameters Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Supply voltage Normal mode VDD 2.3 2.75 3.0 V A 100nF bypass capacitor(CVDD) should be placed close to the microphone VDD pin to ensure best SNR performance Low power mode 1.52 1.6 1.8 VDD ramp-up time 5 ms VDD reaches its final value within ± 10 % tolerance Output load Cload Ca, Cb 100 pF Cd 100 Rload Rp, Rn 25 kΩ Input VCM Normal mode Vcm 1.17 1.3 1.43 V Input VCM is the voltage at the input pins of the audio front end if not drivenLow power mode 0.765 0.85 0.935 IM73A135V01 IP57 dust and water resistant analog XENSIVTM MEMS microphone Electrical characteristics and parameters Datasheet 8 V 1.20 2021-07-07

Figure 11 Output load configuration IM73A135V01 IP57 dust and water resistant analog XENSIVTM MEMS microphone Electrical characteristics and parameters Datasheet 9 V 1.20 2021-07-07

3.3 Electrical characteristics

Test conditions (unless otherwise specified in the table): VDD = 2.75V, TA = 25°C, 55% R.H. Table 7 IM73A135V01 electrical characteristics Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Current consumption Normal mode IDDNP 170 230 µA Input ≤ 94 dBSPL Low power mode IDDLP 70 80 Start-up time tstartup 10 30 ms Start-up time in all operating modes after VDDmin is applied Mode switching time tModeChange 10 ms Time of undefined output after mode change detected Brown out voltage VBrownOut 1.2 V Brown out is triggered for voltage below VBrownOut Vout DC-voltage Normal mode VOUT_DC_NP 1.35 V Low power mode VOUT_DC_LP 0.9 Power supply rejection ratio in band (differential) Normal mode PSRRInBand_ NP dB VDD=2.75V + 100mVpp sinewave (PSR=1/Apower; Apower = Transfer function VDD → Differential Output of ASIC) Low power mode PSRRInBand_ LP VDD=1.6V + 100mVpp sinewave (PSR=1/Apower; Apower = Transfer function VDD → Differential Output of ASIC) Power supply rejection ratio common mode Normal mode PSRRCM_NP 65 dB VDD= 2.75 V + 100mVpp sinewave Low power mode PSRRCM_LP 60 VDD= 1.6 V + 100mVpp sinewave Output impedance Normal mode Zout_NP 250 Ω Low power mode Zout_LP 500 Ω IM73A135V01 IP57 dust and water resistant analog XENSIVTM MEMS microphone Electrical characteristics and parameters Datasheet 10 V 1.20 2021-07-07

4 Package information

Figure 12 IM73A135V01 package drawing Table 8 IM73A135V01 pin configuration Pin Number Name Description

1 Output + Differential Output +

2 VDD Power supply

3 Output - Differential Output -

4 GND Ground

5 GND Ground

IP57 dust and water resistant analog XENSIVTM MEMS microphone

Package information

Datasheet 11 V 1.20 2021-07-07

5 Footprint and stencil recommendation

The acoustic port hole diameter in the PCB should be larger than the acoustic port hole diameter of the MEMS Microphone to ensure optimal performance. A PCB sound port size of radius 0.4 mm (diameter 0.8mm) is recommended. The board pad and stencil aperture recommendations shown in Figure 13 are based on Solder Mask Defined (SMD) pads. The specific design rules of the board manufacturer should be considered for individual design optimizations or adaptations. Figure 13 IM73A135V01 footprint and stencil recommendation IM73A135V01 IP57 dust and water resistant analog XENSIVTM MEMS microphone Footprint and stencil recommendation Datasheet 12 V 1.20 2021-07-07

6 Packing information

For shipping and assembly the Infineon microphones are packed in product specific tape-and-reel carriers. A detailed drawing of the carrier can be seen in Figure 14. Figure 14 IM73A135V01 tape and reel packing information IM73A135V01 IP57 dust and water resistant analog XENSIVTM MEMS microphone Packing information Datasheet 13 V 1.20 2021-07-07

7 Reflow soldering and board assembly

Infineon MEMS microphones are qualified in accordance with the IPC/JEDEC J-STD-020D-01. The moisture sensitivity level of MEMS microphones is rated as MSL1. For PCB assembly of the MEMS microphone the widely used reflow soldering using a forced convection oven is recommended. The soldering profile should be in accordance with the recommendations of the solder paste manufacturer to reach an optimal solder joint quality. The reflow profile shown in Figure 15 is recommended for board manufacturing with Infineon MEMS microphones. Figure 15 Recommended reflow profile Table 9 Reflow profile limits Profile feature Pb-Free assembly Sn-Pb Eutectic assembly Temperature Min (Tsmin) 150 °C 100 °C Temperature Max (Tsmax) 200 °C 150 °C Time (Tsmin to Tsmax) (ts) 60-120 seconds 60-120 seconds Ramp-up rate (TL to TP) 3 °C/second max. 3 °C/second max. Liquidous temperature (TL) 217 °C 183 °C Time (tL) maintained above TL 60-150 seconds 60-150 seconds Peak Temperature (Tp) 260°C +0°C/-5°C 235°C +0°C/-5°C Time within 5°C of actual peak temperature (tp) 3) 20-40 seconds 10-30 seconds Ramp-down rate 6 °C/second max. 6 °C/second max. Time 25°C to peak temperature 8 minutes max. 6 minutes max. Note: For further information please consult the 'General recommendation for assembly of Infineon packages' document which is available on the Infineon Technologies web page

3 Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum

IP57 dust and water resistant analog XENSIVTM MEMS microphone Reflow soldering and board assembly Datasheet 14 V 1.20 2021-07-07

The MEMS microphones can be handled using industry standard pick and place equipment. Care should be taken to avoid damage to the microphone structure as follows:

  • Do not pick the microphone with vacuum tools which make contact with the microphone acoustic port hole.
  • The microphone acoustic port hole should not be exposed to vacuum, this can destroy or damage the MEMS.
  • Do not blow air into the microphone acoustic port hole. If an air blow cleaning process is used, the port hole must be sealed to prevent particle contamination.
  • It is recommended to perform the PCB assembly in a clean room environment in order to avoid microphone contamination.
  • Air blow and ultrasonic cleaning procedures shall not be applied to MEMS Microphones. A no-clean paste is recommended for the assembly to avoid subsequent cleaning steps. The microphone MEMS can be severely damaged by cleaning substances.
  • To prevent the blocking or partial blocking of the sound port during PCB assembly, it is recommended to cover the sound port with protective tape during PCB sawing or system assembly.
  • Do not use excessive force to place the microphone on the PCB. The use of industry standard pick and place tools is recommended in order to limit the mechanical force exerted on the package. IM73A135V01 IP57 dust and water resistant analog XENSIVTM MEMS microphone Reflow soldering and board assembly Datasheet 15 V 1.20 2021-07-07

8 Reliability specifications

The microphone sensitivity after stress must deviate by no more than 3dB from the initial value. Table 10 Reliability specification Test Abbreviation Test Condition Standard Low Temperature Operating Life L TOL Ta=-40°C, VDD=3.6V, 1000 hours JESD22-A108 Low Temperature Storage Life L TSL Ta=-40°C, 1000 hours JESD22-A119 High Temperature Operation Life HTOL Ta=+125°C, VDD=3.6V, 1000 hours JESD22-A108 High Temperature Storage Life HTSL Ta=+125°C, 1000 hours JESD22-A103 Temperature Cycling PC + TC Pre conditioning MSL-1 JESD22-A113 1000 cycles, -40°C to +125°C, 30 minutes per cycle JESD22-A104 Temperature Humidity Bias PC + THB Pre conditioning MSL-1 JESD22-A113 Ta=+85°C, R.H = 85%, VDD=3.6V, 1000 hours JESD22-A101 Vibration Test VVF 20Hz to 2000Hz with a peak acceleration of 20g in X, Y, and Z for 4 minutes each, total 4 -cycles IEC 60068-2-6 Mechanical Shock MS 10000g/0.1msec direction ±x,y,z, 5 shocks in each direction, 5 shocks in total IEC 60068-2-27 Reflow Solder4) RS 3 reflow cycles, peak temperature = +260°C IPC-JEDEC J- STD-020D-01 Electrostatic Discharge -System Level Test ESD - SL T 3 discharges of ±8kV direct contact to lid while Vdd is supplied according to the operational modes; (Vdd ground is separated from earth ground) IEC-61000-4-2 Electrostatic Discharge - Human Body Model ESD - HBM 1 pulse of ±2kV between all I/O pin combinations JEDEC-JS001 Electrostatic Discharge - Charged Device Model ESD - CDM 3 discharges of ±500V direct contact to I/O pins. JEDEC JS-002 Latch up LU Trigger current from ±200mA JESD78 4 The microphone sensitivity must deviate by no more than 1dB from the initial value after 3 reflow cycles. IM73A135V01 IP57 dust and water resistant analog XENSIVTM MEMS microphone Reliability specifications Datasheet 16 V 1.20 2021-07-07

Revision history

V 1.00 2021-01-07 Initial release V 1.10 2021-04-19 Updated Typical performance characteristics V 1.20 2021-07-07 Updated Figure 11 title IM73A135V01 IP57 dust and water resistant analog XENSIVTM MEMS microphone Datasheet 17 V 1.20 2021-07-07

All referenced product or service names and trademarks are the property of their respective owners. Edition 2021-07-07 Published by Infineon Technologies AG

81726 Munich, Germany

© 2021 Infineon Technologies AG All Rights Reserved. Do you have a question about any aspect of this document? Email: erratum@infineon.com Document reference IFX-mcx1539678668960 IMPORTANT NOTICE The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications. The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. WARNINGS Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury.