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Technical content

Features

  • Component level IP57 water and dust resistant
  • Dynamic range of 106dB
  • Acoustic overload point at 128dBSPL
  • Signal to noise ratio of 72dB(A) SNR
  • Digital PDM output
  • Flat frequency response with a low frequency roll- off at 20Hz
  • Package dimensions: 4mm x 3mm x 1.2mm
  • Omnidirectional pickup pattern
  • Power optimized modes determined by PDM clock frequency Typical applications
  • Active Noise Cancellation (ANC) headphones and earphones
  • Devices with Voice User Interface (VUI) - Smart speakers - Home automation - IOT devices
  • High quality audio capturing - Laptops and tablets - Conference systems - Cameras and camcorders
  • Industrial or home monitoring with audio pattern detection

Ordering information

Table 1 Ordering information Product name Package Marking Ordering code IM72D128V01 PG-LLGA-5-3 I72D07 SP005567257 Datasheet Please read the sections "Important notice" and "Warnings" at the end of this document 1.00 www.infineon.com 2022-02-22

Technology qualified for industrial applications. Ready for validation in industrial applications according to the relevant tests of IEC 60747 and 60749 or alternatively JEDEC47/20/22. Block diagram Figure 1 IM72D128V01 block diagram Environmental robustness Infineon’s latest Sealed Dual Membrane MEMS technology delivers high ingress protection (IP57) at a microphone level. The sealed MEMS design prevents water or dust from entering between membrane and backplate, preventing mechanical blockage or electric leakage issues commonly observed in MEMS microphones. Microphones built with the Sealed Dual Membrane technology can be used to create IP68 devices, requiring only minimal mesh protection. Table 2 Environmental robustness Test Standard Test Condition IP5x dust resistance1) Arizona dust A4 coarse, vertical orientation , sound hole upwards, 10 cycles (15 minutes sedimentation, 6 sec blowing) IPx7 water immersion2) Temporary immersion of 1 meters for 30 minutes. Microphone tested 2 hours after removal 1 The number "5" stands for the dust ingress rating or the capacity to withstand the effects of fine, abrasive dust particles. 2 The "7" specifies the higher water immersion rating. IM72D128V01 IP57 dust and water resistant digital PDM XENSIVTM MEMS microphone Product validation Datasheet 2 1.00 2022-02-22

IP57 dust and water resistant digital PDM XENSIVTM MEMS microphone Table of contents Datasheet 3 1.00 2022-02-22

1 Typical performance characteristics

Test conditions: VDD = 1.8V, fCLK = 3.072MHz, unless otherwise specified. - 1 2 - 9 - 6 - 3 0 3 6 9 1 2 1 0 1 0 0 1 0 0 0 1 0 0 0 0 Normalized Output Level [dB]Frequency [Hz] Figure 2 Typical amplitude response - 1 0 - 5 0 5 1 0 1 5 2 0 2 5 3 0 0 2 0 4 0 6 0 8 0 Sensitivity relative to 1kHz [dB]Frequency [kHz] Figure 3 Typical free field ultrasonic response - 3 0 - 1 5 0 1 5 3 0 4 5 6 0 7 5 9 0 1 0 1 0 0 1 0 0 0 1 0 0 0 0 Phase Response [° ] Frequency [Hz] Figure 4 Typical phase response 1 1 0 1 0 0 1 0 0 0 1 0 0 0 0 1 0 1 0 0 1 0 0 0 1 0 0 0 0 Group Delay [µs]Frequency [Hz] Figure 5 Typical group delay 0 . 0 1 0 . 1 1 1 0 9 0 9 5 1 0 0 1 0 5 1 1 0 1 1 5 1 2 0 1 2 5 1 3 0 THD [%]Input Sound Pressure Level [dB] Figure 6 Typical THD vs SPL 0 . 1 1 1 0 1 0 0 1 0 0 0 1 0 0 0 0 THD [%]Frequency [Hz]110dB SPL126dB SPL128dB SPL Figure 7 Typical THD vs frequency IM72D128V01 IP57 dust and water resistant digital PDM XENSIVTM MEMS microphone Typical performance characteristics Datasheet 4 1.00 2022-02-22

2 Acoustic characteristics

Test conditions (unless otherwise specified in the table): VDD = 1.8V, fCLK = 3.072MHz, TA = 25°C, 55% R.H., audio bandwidth 20Hz to 20kHz, select pin grounded, no load on DATA, Tedge = 9ns Table 3 acoustic specifications Parameter Symbol Values Unit Note or Test Condition Min. Typ. Max. Sensitivity S -37 -36 -35 dBFS 1kHz, 94dBSPL, all operating modes Low Frequency Roll-off LFRO 20 Hz -3dB relative to 1kHz High Frequency Flatness3) 19 kHz +3dB relative to 1kHz Resonance Frequency Peak3) 37 kHz Signal to Noise Ratio fclock = 768kHz SNR 67 dB(A) 20Hz to 8kHz bandwidth, A-Weighted fclock = 1.536MHz 68 20Hz to 20kHz bandwidth, A-Weightedfclock = 2.4MHz 71.5 fclock = 3.072MHz 72 fclock = 4.8MHz3) 71.5 Total Harmonic Distortion 94dBSPL THD 0.5 Measuring 2nd to 5th harmonics; 1kHz. all operating modes126dBSPL 1.0 Acoustic Overload Point 10% THD AOP 128 dBSPL Measuring 2nd to 5th harmonics; 1kHz. all operating modes Group Delay 250Hz 60 µs 600Hz 12 1kHz 7 4kHz 3.5 Phase Response 75Hz 20 1kHz 0.5 4kHz -2 Directivity Omnidirectional Polarity Positive pressure increases density of 1's, negative pressure decreases density of 1's in data output 3 Parameter not subject to productive test. Verified by laboratory characterization / design. IM72D128V01 IP57 dust and water resistant digital PDM XENSIVTM MEMS microphone Acoustic characteristics Datasheet 6 1.00 2022-02-22

3 Electrical characteristics and parameters

3.1 Absolute maximum ratings

Stresses at or above the listed maximum ratings may affect device reliability or cause permanent device damage. Functional device operation at these conditions is not guaranteed. Table 4 Absolute maximum ratings Parameter Symbol Values Unit Note / Test Condition Min. Max. Voltage on any Pin Vmax 3.6 V Storage Temperature TS -40 125 °C Ambient Temperature TA -40 85 °C

3.2 Electrical parameters

Table 5 Electrical parameters and digital interface input Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Supply Voltage VDD 1.62 1.8 3.6 V 4) Clock Frequency Range Standby Mode fclock 350 kHz 5) Low Power Mode 450 768 850 kHz Normal Mode 1.2 1.536 1.65 MHz High Performance Mode 2.0 2.4 2.6 MHz 2.9 3.072 3.3 MHz Ultrasonic Mode 4.56 4.8 5.04 MHz VDD Ramp-up Time 50 ms Time until VDD ≥ VDD_min Input Logic Low Level VIL -0.3 0.35xVDD V Input Logic High Level VIH 0.65xVDD VDD+0.3 V Clock Rise/Fall Time 13 ns 10% to 90% Clock Duty Cycle 40 60 % fclock≤ 3MHz 48 52 % fclock> 3MHz Output Load Capacitance on DATA Cload 200 pF 4 A 1μF bypass capacitor shall be placed close to the microphone VDD pad to ensure best SNR performance. 5 Data pad is high impedance in standby mode. IM72D128V01 IP57 dust and water resistant digital PDM XENSIVTM MEMS microphone Electrical characteristics and parameters Datasheet 7 1.00 2022-02-22

3.3 Electrical characteristics

Test conditions (unless otherwise specified in the table): VDD = 1.8V, TA = 25°C, 55% R.H. Table 6 General electrical characteristics Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Current Consumption Clock Off Mode Iclock_off 1 μA CLOCK pulled low Standby Mode Istandby 25 50 No load on DATA fclock = 768kHz IDD 280 310 <5pF load on DATA fclock = 1.536MHz 690 770 fclock = 2.4MHz 820 945 fclock = 3.072MHz 980 1120 fclock = 4.8MHz 900 1000 Short Circuit Current 1 20 mA Grounded DATA pin Power Supply Rejection PSR1k_NM -80 dBFS 100mVpp sine wave on VDD swept from 200Hz to 20kHz. PSR217_NM -86 dBFS(A) 100mVrms, 217Hz square wave on VDD. A-weighted. Startup Time ±0.5dB sensitivity accuracy 20 ms Time to start up in any operating modes after VDD_min and CLOCK have been applied.6) ±0.2dB sensitivity accuracy Mode Switch Time ±0.5dB sensitivity accuracy 20 ms Time to switch between operating modes. VDD remains on during the mode switch.6) ±0.2dB sensitivity accuracy Output Logic Low Level VOL 0.3xVDD V Output Logic High Level VOH 0.7xVDD Delay Time for DATA Driven tDD 40 80 ns Delay time from CLOCK edge (0.5xVDD) to DATA driven. Delay Time for DATA High-Z7) tHZ 5 30 ns Delay time from CLOCK edge (0.5xVDD) to DATA high impedance state (table continues...) 6 Verified at typical PDM clock frequencies for each power mode. 7 thold is dependent on Cload IM72D128V01 IP57 dust and water resistant digital PDM XENSIVTM MEMS microphone Electrical characteristics and parameters Datasheet 8 1.00 2022-02-22

Table 6 (continued) General electrical characteristics Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Delay Time for DATA Valid8) tDV 100 ns Delay time from CLOCK edge (0.5xVDD) to DATA valid (<0.3xVDD or >0.7xVDD) Power-on behaviour Idle tone is output over PDM within 3ms of applying VDD and fclock, remains until a valid microphone signal is available. Idle tone consists of alternating 1s and 0s, representing a zero input signal. Figure 10 Timing diagram

3.4 Audio DC offset

The DC output level encoded in the DC bit stream is determined by the L/R state on startup. In each case the DC output level is stable over time and does not vary with input signal level. Table 7 DC output level using L/R pin LR state DC output level (typical) Unit LR = GND -80 dBFS LR = VDD -40 dBFS

8 Load on data: Cload=100pF, Rload=100kΩ

IP57 dust and water resistant digital PDM XENSIVTM MEMS microphone Electrical characteristics and parameters Datasheet 9 1.00 2022-02-22

3.5 Stereo PDM configuration

The IM72D128V01 is designed to function in circuits with one or two microphones on the PDM bus. When two microphones are connected, data is transmitted alternately according to the L/R pin status of each microphone. When two microphones are connected to a shared PDM bus, the power modes of both microphones will be the same as both are controlled by the same PDM clock. The performance is unchanged relative to a single microphone per bus configuration. Table 8 PDM channel configuration using L/R pin. Channel Data driven Data high-Z L/R connection DATA1 Falling clock edge Rising clock edge GND DATA2 Rising clock edge Falling clock edge VDD Figure 11 IM72D128V01 stereo mode configuration Note: For best performance it is strongly recommended to place a 100nF (C VDD_typical) capacitor between VDD and ground. The capacitor should be placed as close to VDD as possible. A termination resistor (RTERM) of about 100Ω may be added to reduce the ringing and overshoot on the output signal. IM72D128V01 IP57 dust and water resistant digital PDM XENSIVTM MEMS microphone Electrical characteristics and parameters Datasheet 10 1.00 2022-02-22

4 Package information

Figure 12 IM72D128V01 package drawing Table 9 IM72D128V01 pin configuration Pin Number Name Description

1 DATA PDM data output

2 VDD Power supply

3 CLOCK PDM clock input

4 SELECT PDM left/right select

5 GND Ground

IP57 dust and water resistant digital PDM XENSIVTM MEMS microphone

Package information

Datasheet 11 1.00 2022-02-22

5 Footprint and stencil recommendation

The acoustic port hole diameter in the PCB should be larger than the acoustic port hole diameter of the MEMS Microphone to ensure optimal performance. A PCB sound port size of radius 0.4 mm (diameter 0.8mm) is recommended. The board pad and stencil aperture recommendations shown in Figure 13 are based on Solder Mask Defined (SMD) pads. The specific design rules of the board manufacturer should be considered for individual design optimizations or adaptations. Figure 13 IM72D128V01 footprint and stencil recommendation Note: Dimensions are in millimeters unless otherwise specified IM72D128V01 IP57 dust and water resistant digital PDM XENSIVTM MEMS microphone Footprint and stencil recommendation Datasheet 12 1.00 2022-02-22

6 Packing information

For shipping and assembly the Infineon microphones are packed in product specific tape-and-reel carriers. A detailed drawing of the carrier can be seen in Figure 14. Figure 14 IM72D128V01 tape and reel packing information IM72D128V01 IP57 dust and water resistant digital PDM XENSIVTM MEMS microphone Packing information Datasheet 13 1.00 2022-02-22

7 Reflow soldering and board assembly

Infineon MEMS microphones are qualified in accordance with the IPC/JEDEC J-STD-020D-01. The moisture sensitivity level of MEMS microphones is rated as MSL1. For PCB assembly of the MEMS microphone the widely used reflow soldering using a forced convection oven is recommended. The soldering profile should be in accordance with the recommendations of the solder paste manufacturer to reach an optimal solder joint quality. The reflow profile shown in Figure 15 is recommended for board manufacturing with Infineon MEMS microphones. Figure 15 Recommended reflow profile Table 10 Reflow profile limits Profile feature Pb-Free assembly Sn-Pb Eutectic assembly Temperature Min (Tsmin) 150 °C 100 °C Temperature Max (Tsmax) 200 °C 150 °C Time (Tsmin to Tsmax) (ts) 60-120 seconds 60-120 seconds Ramp-up rate (TL to TP) 3 °C/second max. 3 °C/second max. Liquidous temperature (TL) 217 °C 183 °C Time (tL) maintained above TL 60-150 seconds 60-150 seconds Peak Temperature (Tp) 260°C +0°C/-5°C 235°C +0°C/-5°C Time within 5°C of actual peak temperature (tp) 9) 20-40 seconds 10-30 seconds Ramp-down rate 6 °C/second max. 6 °C/second max. Time 25°C to peak temperature 8 minutes max. 6 minutes max. Note: For further information please consult the 'General recommendation for assembly of Infineon packages' document which is available on the Infineon Technologies web page

9 Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum

IP57 dust and water resistant digital PDM XENSIVTM MEMS microphone Reflow soldering and board assembly Datasheet 14 1.00 2022-02-22

The MEMS microphones can be handled using industry standard pick and place equipment. Care should be taken to avoid damage to the microphone structure as follows:

  • Do not pick the microphone with vacuum tools which make contact with the microphone acoustic port hole.
  • The microphone acoustic port hole should not be exposed to vacuum, this can destroy or damage the MEMS.
  • Do not blow air into the microphone acoustic port hole. If an air blow cleaning process is used, the port hole must be sealed to prevent particle contamination.
  • It is recommended to perform the PCB assembly in a clean room environment in order to avoid microphone contamination.
  • Air blow and ultrasonic cleaning procedures shall not be applied to MEMS Microphones. A no-clean paste is recommended for the assembly to avoid subsequent cleaning steps. The microphone MEMS can be severely damaged by cleaning substances.
  • To prevent the blocking or partial blocking of the sound port during PCB assembly, it is recommended to cover the sound port with protective tape during PCB sawing or system assembly.
  • Do not use excessive force to place the microphone on the PCB. The use of industry standard pick and place tools is recommended in order to limit the mechanical force exerted on the package. IM72D128V01 IP57 dust and water resistant digital PDM XENSIVTM MEMS microphone Reflow soldering and board assembly Datasheet 15 1.00 2022-02-22

8 Reliability specifications

The microphone sensitivity after stress must deviate by no more than 3dB from the initial value. Table 11 Reliability specification Test Abbreviation Test Condition Standard Low Temperature Operating Life L TOL Ta=-40°C, VDD=3.6V, 1000 hours JESD22-A108 Low Temperature Storage Life L TSL Ta=-40°C, 1000 hours JESD22-A119 High Temperature Operation Life HTOL Ta=+125°C, VDD=3.6V, 1000 hours JESD22-A108 High Temperature Storage Life HTSL Ta=+125°C, 1000 hours JESD22-A103 Temperature Cycling PC + TC Pre conditioning MSL-1 JESD22-A113 1000 cycles, -40°C to +125°C, 30 minutes per cycle JESD22-A104 Temperature Humidity Bias PC + THB Pre conditioning MSL-1 JESD22-A113 Ta=+85°C, R.H = 85%, VDD=3.6V, 1000 hours JESD22-A101 Vibration Test VVF 20Hz to 2000Hz with a peak acceleration of 20g in X, Y, and Z for 4 minutes each, total 4 -cycles IEC 60068-2-6 Mechanical Shock MS 10000g/0.1msec direction ±x,y,z, 5 shocks in each direction, 5 shocks in total IEC 60068-2-27 Reflow Solder10) RS 3 reflow cycles, peak temperature = +260°C IPC-JEDEC J- STD-020D-01 Electrostatic Discharge -System Level Test ESD - SL T 3 discharges of ±8kV direct contact to lid while Vdd is supplied according to the operational modes; (Vdd ground is separated from earth ground) IEC-61000-4-2 Electrostatic Discharge - Human Body Model ESD - HBM 1 pulse of ±2kV between all I/O pin combinations JEDEC-JS001 Electrostatic Discharge - Charged Device Model ESD - CDM 3 discharges of ±500V direct contact to I/O pins. JEDEC JS-002 Latch up LU Trigger current from ±200mA JESD78 10 The microphone sensitivity must deviate by no more than 1dB from the initial value after 3 reflow cycles. IM72D128V01 IP57 dust and water resistant digital PDM XENSIVTM MEMS microphone Reliability specifications Datasheet 16 1.00 2022-02-22

Revision history

1.00 2022-02-22 Initial release IM72D128V01 IP57 dust and water resistant digital PDM XENSIVTM MEMS microphone Datasheet 17 1.00 2022-02-22

All referenced product or service names and trademarks are the property of their respective owners. Edition 2022-02-22 Published by Infineon Technologies AG

81726 Munich, Germany

© 2022 Infineon Technologies AG All Rights Reserved. Do you have a question about any aspect of this document? Email: erratum@infineon.com Document reference IFX-yqp1546971186820 IMPORTANT NOTICE The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications. The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. WARNINGS Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury.