IM64A130A INFINEON | Alldatasheet

Document overview

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Technical content

Features

  • Automotive qualification
  • Flat frequency response down to 10Hz for best ANC performance
  • Close sensitivity and phase matching for optimum beam forming
  • Environmental robust up to IP57
  • Extended availability to match automotive design cycles
  • Analog single-ended output Potential applications
  • Active noise cancellation / Road noise cancellation (ANC/RNC)
  • Hands free calling
  • Emergency call
  • Voice control
  • Siren detection
  • Road condition detection Product validation Qualified for automotive applications by product validation according to AEC-Q103-003.

Description

The device is designed for applications where low self-noise (high SNR), wide dynamic range, low distortions and a high acoustic overload point is required. The low cut-off frequency (LFRO) makes it a well suited device for active noise cancelling (ANC) applications. Infineon's MEMS technology is based on a miniaturized microphone design and results in high linearity of the output signal within a high dynamic range. With its low equivalent noise floor the microphone is no longer the limiting factor in the audio signal chain and enables higher performance of voice recognition algorithms. The analog microphone ASIC contains an extremely low-noise preamplifier. The tight manufacturing tolerance, combined with the fact that each device is calibrated with an advanced Infineon calibration algorithm, results in small sensitivity and phase matching tolerances. This makes it well suited for beam forming arrays and multi-microphone applications. Table 1 Product summary Parameter Value Customer benefit SNR 64 dB(A) Clear speech quality THD 1% 116 dBSPL Clear speech up to high SPL levels AOP (THD 10%) 130 dBSPL High dynamic range and high wind-noise robustness LFRO 10 Hz Flat frequency response for best ANC performance TA -40°C ... +105°C Flexible placement inside the car Table 2 Order information Product name Package Marking Ordering code IM64A130A PG-TLGA-4-2 IA64A1 SP006020276 IM64A130A Datasheet Datasheet Please read the sections "Important notice" and "Warnings" at the end of this document Rev. 1.10 www.infineon.com 2024-04-19

Datasheet 2 Rev. 1.10 2024-04-19

1 Block diagram

The device contains two different dies combined inside one package. The MEMS picks up the sound waves and converts them into an electrical signal. The ASIC contains all needed circuitry for biasing the MEMS and amplifying the MEMS signal to a stable and calibrated microphone output voltage. ASICMEMS CALIBRATION BAND GAP VOL TAGE REGULATOR MEMS BIAS CHARGE PUMP MEMBRANE BACKPLATE GND VDD OUT GND AMP Figure 1 Block diagram IM64A130A Datasheet Datasheet 3 Rev. 1.10 2024-04-19

2 Pin configuration

The figure below shows the pin configuration of the device Bottom view 3 12 Figure 2 Table 3 Pin configuration Pin number Name Description

1 OUT Output

2 GND Ground

3 VDD Power supply

4 GND Ground

Datasheet 4 Rev. 1.10 2024-04-19

3 General product characteristics

3.1 Electrical parameters and characteristics

3.1.1 Absolute maximum ratings

Table 4 Absolute maximum ratings Parameter Symbol Values Unit Note or condition Min. Typ. Max. Storage temperature TS -40 – 125 °C Supply voltage VDD – – 4.0 V ESD susceptibility human body model (HBM) VESD-HBM -2 – 2 kV all pins according EIA/JESD22/A114 Attention: Stresses above those listed under “Absolute maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the section "Functional range" of this datasheet is not implied. Furthermore, only single error cases are assumed. More than one stress/error case may also damage the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. During absolute maximum rating overload conditions the voltage on VDD pins with respect to ground (GND) must not exceed the values defined by the absolute maximum ratings. Lifetime statements are an anticipation based on an extrapolation of Infineon’s qualification test results. The actual lifetime of a component depends on its form of application and type of use etc. and may deviate from such statement. Lifetime statements shall in no event extend the agreed warranty period.

3.1.2 Functional range

The following functional range shall not be exceeded in order to ensure correct operation of the device. All parameters specified in the following sections refer to these operating conditions unless otherwise indicated. Table 5 Functional range Parameter Symbol Values Unit Note or condition Min. Typ. Max. Supply voltage VDD 2.4 2.6 3.60 V A 100nF bypass capacitor should be placed close to the microphone's VDD pin to ensure best SNR performance Ambient operating temperature TA -40 – +105 °C VDD ramp-up Time VDD_ru 0.001 – 2 ms Time until VDD ≥ VDD_min Capacitive output load CL – – 150 pF DC-coupled Resistive output load RL 10 – 100 kΩ AC-coupled IM64A130A Datasheet Datasheet 5 Rev. 1.10 2024-04-19

4 Product features

4.1 Electrical characteristics

Test conditions (unless otherwise specified in the table): VDD = 2.6V ± 0.1V, TA = 25°C ± 5°C Table 6 Electrical characteristics Parameter Symbol Values Unit Note or condition Min. Typ. Max. Current consumption IDD – 105 135 μA Input ≤ 94 dBSPL, unloaded Current consumption during startup IDD_Startup – – 1 mA Current peak during startup process Output DC voltage VOUT_DC 1.23 1.30 1.37 V Output impedance Zout – – 400 Ω f = 1kHz Startup time tstartup – 10 ms Time between applying VDD_min till functionallity is given Power supply rejection ratio PSRR – 73.5 – dB 1kHz sine wave of 200mVpp on VDD 1) PSRR is the ratio between a power supply voltage change and the variation of the output signal.

4.2 Acoustic characteristics

The values in the table "Acoustic characteristics" are valid under the following conditions (unless otherwise specified in the table): VDD = 2.6V ± 0.1V, TA = 25°C ± 5°C, audio bandwidth 20Hz to 20kHz, output unloaded Table 7 Acoustic characteristics Parameter Symbol Values Unit Note or condition Min. Typ. Max. Sensitivity Sens -39 -38 -37 dBV 1kHz, 94 dBSPL Signal to noise ratio SNR – 64 – dB(A) A-Weighted Equivalent input noise EIN – 30 – dBSPL A-Weighted Total harmonic distortion, 94dBSPL THD94 – 0.1 – % Measuring 2nd to 5th harmonics; 1kHz Total harmonic distortion, 1% THD1% – 116 – dBSPL Measuring 2nd to 5th harmonics; 1kHz Acoustic overload point (10% THD) AOP – 130 – dBSPL Measuring 2nd to 5th harmonics; 1kHz Low frequency roll-off point LFRO – 10 – Hz -3dB point relative to 1kHz Phase response, 75Hz Φ75 – 7 – ° Phase response, 1kHz Φ1000 – 0 – ° (table continues...) IM64A130A Datasheet Datasheet 6 Rev. 1.10 2024-04-19

Table 7 (continued) Acoustic characteristics Parameter Symbol Values Unit Note or condition Min. Typ. Max. Phase response, 3kHz Φ3000 – -1 – Group delay, 250Hz tgd_250 – 25 – µs Group delay, 600Hz tgd_600 – 4 – µs Group delay, 1kHz tgd_1000 – 2 – µs Group delay, 4kHz tgd_4000 – 0 – µs Polarity: Increasing sound pressure level (SPL) leads to an increasing Vout. Directivity: The device has an omnidirectional pickup pattern. IM64A130A Datasheet Datasheet 7 Rev. 1.10 2024-04-19

4.2.1 Free field frequency response

The figure below shows the typical free field response of the device. 1 10 100 1.000 10.000 Normalized output level [dBV] Frequency [Hz] DUT Target min Target max Figure 3 Free field frequency response Table 8 Free field frequency response, normalized to 1kHz sensitivity value Frequency (Hz) Lower limit (dB) Upper limit (dB) 10 -5 0 30 -2 +1 60 -1 +1 100 -1 +1 1000 0 0 5000 -1 +1 10000 -1 +3 IM64A130A Datasheet Datasheet 8 Rev. 1.10 2024-04-19

4.3 Typical performance characteristics

Test conditions: VDD = 2.6V ± 0.1V, TA = 25°C ± 5°C, output unloaded Plot 1: Typical free field response (ultrasonic) Plot 2: I DD vs. V DD Plot 3: Typical THD vs. SPL @ 1kHz Plot 4: Typical THD vs. frequency Plot 5: Typical phase response vs. frequency Plot 6: Typical group delay vs. frequency -10 10 100 1.000 10.000 Phase response [ ° ] Frequency [Hz] 0,01 0,10 1,00 10,00 90 95 100 105 110 115 120 125 130 THD [%] Input sound pressure level [dB SPL] Normalized output level [dB] Frequency [Hz] 100 105 110 115 120 2,2 2,4 2,6 2,8 3 3,2 3,4 3,6 3,8 I DD [µA] V DD [V] 0,10 1,00 10,00 10 100 1.000 10.000 THD [%] Frequency [Hz] 128 dB SPL 116 dB SPL 102 dB SPL 0,1 1,0 10,0 100,0 1.000,0 10.000,0 10 100 1.000 10.000 Group delay [µs] Frequency [Hz] Figure 4 Typical performance characteristics IM64A130A Datasheet Datasheet 9 Rev. 1.10 2024-04-19

5 Application information

Note: The following information is given as an example for the implementation of the device only and shall not be regarded as a description or warranty of a certain functionality, condition or quality of the device.

5.1 Use cases

  • Flat frequency response with very low LFRO (low frequency roll off point) and small group delay - Best performance for active noise cancellation systems (ANC, RNC, ...) - Excellent speech quality over full frequency range
  • Total harmonic distortion (THD) up to high sound pressure levels (SPL) - Clear speech in a wide dynamic range - Reliable voice commands even with high background noise - Improved ANC system performance in loud environments
  • High acoustic overload point (AOP) - Distortion less output signal even in loud environments
  • High signal to noise ratio (SNR) - Far field audio signal pick-up - Low volume audio and whispered voice capturing - Good performance with speech recognition algorithms - Microphone noise is no longer limiting the audio chain
  • Close sensitivity and phase matching - Good performance in audio beamforming - High and precise attenuation of background noise - Full utilization of voice algorithms capability

5.2 Typical application circuit

Application-circuit_AnalogSE.vsdx Microphone V DD C VDD OUT VDD to CODEC GND GND GND Figure 5 Typical application circuit Note: For best performance it is strongly recommended to place a 100nF (C VDD_typical) capacitor between VDD and ground. The capacitor should be placed as close to VDD as possible. Note: This figure is a simplified example of an application circuit. The function must be verified in the application. IM64A130A Datasheet Datasheet 10 Rev. 1.10 2024-04-19

6 Package information

This product is compliant to RoHS

6.1 Package outline

The drawing is in compliance with ISO 128-30, Projection Method 1 [ ]All dimensions are in units mmDrawing according to ISO 8015, general tolerances ISO 2768-mK Bottom view 3.35±0.08 2.5±0.08 (3.15) (2.3) 0.98±0.08 (0.25)Pcb thicknessincluding solder mask Seating plane 0.53±0.05 1.665 0.22±0.1 0.21±0.1Ø0.4±0.05 Ø1.55±0.05 0.73±0.05 Pin1 marking 0.77 1.55 0.6±0.05 Figure 6 Package outline drawing

6.2 Footprint and stencil recommendation

The acoustic port hole diameter in the PCB should be larger than the acoustic port hole diameter of the MEMS microphone to ensure optimal performance. A PCB sound port size of radius 0.3 mm (diameter 0.6mm) is recommended. The board pad and stencil aperture recommendations shown in the figure below are based on solder mask defined (SMD) pads. The specific design rules of the board manufacturer should be considered for individual design optimizations or adaptations. IM64A130A Datasheet Datasheet 11 Rev. 1.10 2024-04-19

All dimensions are in units mm copper solder maskstencil apertures All undimensioned radii are 0.1All pads are non-solder mask defined Pin1 0.773× 0.673× 1.090.575 1.090.575 0.7750.573× Ø0.5 Ø1.65 Ø0.91 120° 0.473× R0.475 R0.775 0.1 0.775 Figure 7 Footprint and stencil recommendation

6.3 Reflow soldering and board assembly

Infineon MEMS microphones are qualified in accordance with the IPC/JEDEC J-STD-020D-01. The moisture sensitivity level of MEMS microphones is rated as MSL1. For PCB assembly of the MEMS microphone the widely used reflow soldering, using a forced convection oven, is recommended. The soldering profile should be in accordance with the recommendations of the solder paste manufacturer to reach an optimal solder joint quality. The reflow profile shown in the figure below is recommended for board manufacturing with Infineon MEMS microphones. Figure 8 Recommended reflow profile IM64A130A Datasheet Datasheet 12 Rev. 1.10 2024-04-19

Table 9 Reflow profile limits Profile feature Symbol Pb-free assembly Sn-Pb Eutectic assembly Preheat temperature min. Tsmin 150°C 100°C Preheat temperature max. Tsmax 200°C 150°C Preheat time (Tsmin to Tsmax) ts 60-120 seconds 60-120 seconds Ramp-up rate (TL to TP) – 3°C/second max. 3°C/second max. Liquidous temperature TL 217°C 183°C Time maintained above TL tL 60-150 seconds 60-150 seconds Peak temperature TP 260°C +0°C/-5°C 235°C +0°C/-5°C Time within 5°C of actual peak temperature (see note below) tP 20-40 seconds 10-30 seconds Ramp-down rate – 6°C/second max. 6°C/second max. Time 25°C to peak temperature t 8 minutes max. 6 minutes max. Note: Tolerance for peak profile temperature (T p) is defined as a supplier minimum and a user maximum. The MEMS microphones can be handled using industry standard pick and place equipment. Care should be taken to avoid damage to the microphone structure as follows:

  • Do not pick the microphone with vacuum tools which make contact with the microphone acoustic port hole.
  • The microphone acoustic port hole should not be exposed to vacuum. This can destroy or damage the MEMS.
  • Do not blow air into the microphone acoustic port hole. If an air blow cleaning process is used, the port hole must be sealed to prevent particle contamination.
  • It is recommended to perform the PCB assembly in a clean room environment in order to avoid microphone contamination.
  • Air blow and ultrasonic cleaning procedures shall not be applied to MEMS Microphones. A no-clean paste is recommended for the assembly to avoid subsequent cleaning steps. The microphone MEMS can be severely damaged by cleaning substances.
  • To prevent the blocking or partial blocking of the sound port during PCB assembly, it is recommended to cover the sound port with protective tape during PCB sawing or system assembly.
  • Do not use excessive force to place the microphone on the PCB. The use of industry standard pick and place tools is recommended in order to limit the mechanical force exerted on the package. Note: For further information please consult the "General recommendation for assembly of Infineon packages" document, which is available on the Infineon Technologies web page. IM64A130A Datasheet

Datasheet 13 Rev. 1.10 2024-04-19

6.4 Packing

For shipping and assembly the Infineon microphones are packed in product specific tape-and-reel carriers. A detailed drawing of the carrier can be seen in the figure below. The drawing is in compliance with ISO 128-30, Projection Method 1 [ ]All dimensions are in units mm Pin1 marking 125.5 3.55 2.7 4 1.2 0.3 Figure 9 Tape dimensions More information can be found on the Infineon website: https://www.infineon.com/cms/en/product/packages/PG-TLGA/PG-TLGA-4-2/ IM64A130A Datasheet Datasheet 14 Rev. 1.10 2024-04-19

7 Reliability specifications

The microphone sensitivity after stress and over temperature does not deviate by more than +/- 3dB from the initial value. Table 10 Qualification tests according to AEC-Q103-003 Test Stress condition Standard Temperature humidity bias (THB) TA = +85°C, R.H. = 85%, VDD = 3.6V, cyclical bias, 1000 hours JESD22-A101 Temperature humidity storage (THS) TA = +85°C, R.H = 85%, 1000 hours JESD22-A101 Temperature cycling (TC) TA = -55°C ... +125°C, 30 min cycle time, 1000cycles JESD22-A104 High temperature storage life (HTSL) TA = +125°C, 1000 hours JESD22-A103 High temperature operating life (HTOL) TA = +125°C, VDD = 3.6V, 1000 hours JESD22-A108 Early life failure rate (ELFR) TA = +125°C, VDD = 3.6V, 48 hours AEC Q100-008 Mechanical shock (MS) 3 pulses, 0.1ms duration, 10,000g peak acceleration in x,y and z planes JESD22-B104 Variable frequency vibration (VFV) 20Hz to 2kHz to 20Hz (logarithmic variation) in 4 minutes, 4x in each orientation, 20g peak acceleration JESD22-B103 Package drop (DROP) 10x on each of 6 axes (60 drops total) from a height of 1.2m onto a concrete surface AEC Q103-003 Humidity and temperature cycle (HTC) 5 cycles (24h/cycle) AEC Q103-003 JESD22-A108, IEC 60068-2-38 Low temperature operating life (L TOL) TA = -40°C, VDD = 3.6V, 1000 hours JESD22-A108, IEC 60068-2-2, Test-AA Low temperature storage (L TS) TA = -40°C, 1000 hours JESD22-A119, IEC 60068-2-2, Test-AA Endurance life test (EL T) 96 hours at 130dB continuous signal, Read-out after stress at room temperature AEC Q103-003 Maximum pressure test (MPT) 160 dBSPL AEC Q103-003 Electrostatic discharge, Human body model (HBM) all pins, VESD = ±2000V AEC Q100-002 Electrostatic discharge, Charged device model (CDM) all pins, VESD = ±500V AEC Q100-011 Latch-up TA = 105°C, I = ±100mA AEC Q100-004 Electromagnetic compatibility (EMC) IC strip line radiated emissions SAE J1752/3 – Radiated Emissions (table continues...) IM64A130A Datasheet Datasheet 15 Rev. 1.10 2024-04-19

Table 10 (continued) Qualification tests according to AEC-Q103-003 Test Stress condition Standard Wire bond shear – AEC Q100-001, AEC Q003 Wire bond pull – MIL-STD883, AEC Q003 Die shear – MIL-STD-883 Solderability – JESD22-B102 Physical dimensions – JESD22-B100 and B108, AEC Q003 Acoustic characterization Measurement of acoustic parameters over full voltage and temperature range Table 11 Additional tests for use in automotive applications Test Stress condition Standard Electrostatic discharge, SL T - Contact discharge 3 contact discharges of ±6kV to lid while VDD is supplied according to the operational modes; VDD ground is separated from earth ground IEC-61000-4-2 Electrostatic discharge, SL T - Air discharge 3 air discharges of ±8kV to lid while VDD is supplied according to the operational modes; VDD ground is separated from earth ground IEC-61000-4-2 IM64A130A Datasheet Datasheet 16 Rev. 1.10 2024-04-19

8 Revision history

Date of release Description of changes 1.10 2024-04-19 • Extending the operating temperature to 105°C in Table 5

  • Editorial Changes 1.00 2024-01-25 • Initial release IM64A130A Datasheet

Datasheet 17 Rev. 1.10 2024-04-19

All referenced product or service names and trademarks are the property of their respective owners. Edition 2024-04-19 Published by Infineon Technologies AG

81726 Munich, Germany

© 2024 Infineon Technologies AG All Rights Reserved. Do you have a question about any aspect of this document? Email: erratum@infineon.com Document reference IFX-dkl1705073254640 Important notice The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications. The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. Warnings Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury.