ILC7071 FAIRCHILD | Alldatasheet
Document overview
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Technical content
Features
1% output voltage accuracy Low noise Only 90 µ A ground current at 100mA load Ripple rejection up to 75 dB at 1kHz Excellent line and load transient response Guaranteed to 100mA output current Industry standard five lead SOT-23 packages custom output voltage options
Applications
Battery powered portable electronics General Description The ILC7071 is an 100mA, Low Noise, Low Dropout (LDO) linear regulator, designed and processed in CMOS technology. This process combines the best CMOS features of low quiescent current, small size and low dropout voltage with the best bipolar features of high ripple rejection, low noise and power handling capability. The ILC7071 offers a quiescent current of less than 100µA, a logic level enable (regulator EN) pin, the size of the industry standard SOT-23 and a low dropout voltage of 25mV at 10mA. With better than 70 dB (1kHz) of ripple rejection, low noise of 40µ V RMS and 1% output voltage accuracy, the ILC7071 is ideally suited for communications and personal electronics applications. Block Diagram VIN CN EN GND VOUT Error Amplifier Voltage Reference Thermal Shut Down Trans- conductance Amplifier Figure 1. ILC7071 100mA SOT-23-5 Low Noise CMOS RF-LDO™ Regulator
ILC7071 PRODUCT SPECIFICATION REV. 1.0.2 7/16/03 Test circuit Figure 2. Pin Configuration Figure 3. Pin Definition Pin Number Pin Name Pin Function Description IN Supply voltage input
2 GND
Enable input. High level enables V OUT while Low level commands shutdown mode and discharge C OUT to GND 4C N Optional noise bypass capacitor OUT Voltage output . Regulated output voltage VIN CIN CN COUT RL VIN EN VOUT CNGND 12 3 VOUT GND ILC7071 VIN EN CN SOT -23-5
PRODUCT SPECIFICATION ILC7071 REV. 1.0.2 7/16/03 Absolute Maximum Ratings Absolute maximum ratings are the values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Recommended Operating Conditions Parameter Min. Max. Units Supply Voltage: 10 V EN Input Voltage -0.3 V IN + 0.3 V Output Voltage -0.3 V IN + 0.3 V Junction Temperature (T J ) 125, Internally limited °C Storage Temperature -40 150 °C Lead Soldering Temperature, 10 seconds 300 °C Power Dissipation (P D ) 150 mW Parameter Conditions Min. Typ. Max. Units Supply Voltage V DD V IN to GND V OUT DO V OUT +1 V OUT +4 V Peak Output Current I OUT to GND, tpw=2mS 150 mA Ambient Operating Temperature T A -40 85 C
ILC7071 PRODUCT SPECIFICATION REV. 1.0.2 7/16/03 Electrical Specifications V IN OUT +1V, I OUT =1mA, V EN =2V and T A = +25°C using circuit in Figure 2 with C IN OUT =1µF , C N =0, unless otherwise specified Notes: 1. For 2.5V < V OUT < 2.8V refer to diagram “Dropout Voltage vs.Output Voltage”. 2. Dropout Voltage is defined as the input to output differential voltage at which the output voltage drops 2% below the nominal value measured with 1V differential. Parameter Symbol Conditions Min. Typ. Max. Units Output Voltage V OUT 0.99 VOUTnom VOUT nom 1.01 VOUTnom V Ground pin Current I GND I OUT = 10mA 70 90 µ A I OUT = 100mA 90 110 Line Regulation V OUT V OUT V IN V OUT + 2V VIN V OUT + 1V 0.017 0.075 %/V Load Regulation V OUT V OUT I OUT =1 to 100mA 0.15 0.25 % Dropout Voltage. Notes 1and 2 V DO I OUT = 10mA, V OUT > 2.8V 25 30 mV I OUT = 20mA, V OUT > 2.8V 50 60 I OUT = 100mA, V OUT > 2.8V 275 320 Shutdown (OFF) current I OFF V EN = 0 10 40 nA EN Input Voltage V EN High = ON state Low = OFF state 0.6 V EN Input Current I EN V EN = 0.6V 0.3 µ A V EN = 2V 1 Output Noise Voltage eN BW = 300Hz to 50kHz C IN = C OUT = 2.2uF I OUT = 10mA, CN = 10nF µ V RMS Ripple Rejection PSRR C OUT = 4.7uF, f = 120Hz I OUT = 80mA 65 dB Dynamic Line Regulation V OUT (line) V IN = 1V,I OUT = 10mA, tr/tf = 2uS 10 mV Dynamic Load Regulation V OUT (load) I OUT = 100mA, tr < 5µS 20 mV Resistance Discharge in OFF state R DISC V EN = 0 1.5 k Ω
PRODUCT SPECIFICATION ILC7071 REV. 1.0.2 7/16/03 5 Typical Applications Diagrams Short Circuit Thermal Protection VIN = VOUTnom+1V Output to GND Load Transient Response VIN = VOUT+1V, CN=0 Line Transient Response ∆VIN = VOUT+1V to VOUT+2V Load=10mA, COUT=2.2µF ON/OFF Transient Response Load=80mA, COUT=1µF, CN=0 VOUT(AC) IOUT (0 to 100mA) VEN VOUT VIN VOUT(AC) IOUT (0.5A/div)
ILC7071 PRODUCT SPECIFICATION 6 REV. 1.0.2 7/16/03 120 80mA Load No Load 110 100 012345678 Ground Current Input Voltage (V) Ground Current (µA) 2.830 1mA Load 80mA Load 2.825 2.820 2.815 2.810 2.805 -40 -20 0 20 40 60 80 Output Voltage Temperature (C) Output Voltage (V) 300 85°C 25°C -40°C 250 200 150 100 02 04 0 6 08 0 1 0 0 Dropout Voltage Load Current (mA) Dropout Voltage (mV) ON/OFF Transient Response Load=10mA, COUT=1µF CN=10nF ON/OFF Transient Response Load=10mA, COUT=1µF, CN=0 VEN VOUT VEN VOUT 100 150 200 250 300 350 400 450 500 4.754.54.2543.75 100mA 10mA 3.53.2532.752.5 5 VOUT (V) Maximum VDO(mV) Dropout Voltage vs. Output Voltage
PRODUCT SPECIFICATION ILC7071 REV. 1.0.2 7/16/03 7 Ripple Rejection Load=10mA, COUT=4.7µF Ripple Rejection Load=80mA, COUT=4.7µF Spectral Noise Density and Output Voltage Noise CIN=COUT=2.2µF, CN=10nF, VIN=VOUT+1V, IOUT=10mA
ILC7071 PRODUCT SPECIFICATION 8 REV. 1.0.2 7/16/03
Application Information
In general, ceramic capacitors are preferred due to their superior ESR performance. Those with X5R dielectric offer the best temperature coefficient. An input capacitor of 1µF or greater, connected between Input and Ground, located in close proximity to the device will improve the transient response and the noise rejection. An output capacitor of at least 1µF is required to maintain regulator loop stability. Stable operation will be achieved with a wide variety of capacitors with ESR ranging from 10mΩ to 10Ω. An optional capacitor connected between the CN pin and ground can significantly reduce noise on the output.Values ranging up to 10nF can be used, depending upon the sensi- tivity to output noise in the application. Care should be taken to prevent noise from external sources to enter into the CN pin, which is a very sensitive, high impedance pin. Leakage currents into this pin will directly affect the regulator accu- racy and should be kept as low as possible. Control Functions Enable Pin Applying a voltage of 0.6V or less at the Enable pin will disable the output, reducing the quiescent output current to less than 1µA, while a voltage of 2V or greater will enable the device. If this shutdown function is not needed, the pin can simply be connected to the V IN pin. Allowing this pin to float will cause erratic operation. Thermal Protection The ILC7071 is designed to supply high peak output currents for brief periods, however this output load will cause the device temperature to increase and exceed maximum ratings due to power dissipation. During output overload conditions, when the die temperature exceeds the shutdown limit tem- perature of 125 °C, onboard thermal protection will disable the output until the temperature drops below this limit,at which point the output is then re-enabled. During a thermal shutdown situation the user may assert the power-down function at the Enable pin, reducing power consumption to the minimum level. Thermal Characteristics The ILC7071 is designed to supply up to 100mA at the specified output voltage with an operating die (junction) temperature of up to 125 °C. While the power dissipation is calculated from known electrical parameters, the thermal resistance is a result of the thermal characteristics of the compact SOT-23-5 surface-mount package and the surround- ing PC Board copper to which it is mounted. The relationship describing the thermal behavior of the pack- age is: where T J(max) is the maximum allowable junction tempera- ture of the die, which is 125 °C, and TA is the ambient operating temperature. Θ JA is dependent on the surrounding PC board layout and can be empirically obtained. While the Θ JC (junction-to-case) of the SOT-23-5 package is specified at 130 °C/W, the ΘJA of the minimum PWB footprint will be at least 235 °C/W. This can be improved upon by providing a heat sink of surrounding copper ground on the PCB. Depending on the size of the copper area, the resulting ΘJA can range from approximately 180 °C/W for one square inch, to nearly 130 °C/W for 4 square inches. The addition of backside copper with through-holes, stiffen- ers, and other enhancements can also aid in reducing this value. The heat contributed by the dissipation of other devices located nearby must be included in design consider- ations. Once the limiting parameters in the thermal relationship have been determined, the electrical design should be verified to ensure that the device remains within specified operating conditions. If overload conditions are not considered, it is possible for the device to enter a thermal cycling loop, in which the circuit enters a shutdown condition, cools, reenables, and then again overheats and shuts down repeatedly due to an unmanaged fault condition. PD max() TJm a x() TA– ΘJA
PRODUCT SPECIFICATION ILC7071 REV. 1.0.2 7/16/03 9 General PCB Layout Considerations To achieve the full performance of the device, careful circuit layout and grounding technique must be observed. Establish- ing a small local ground, to which the GND pin, the output and bypass capacitors are connected, is recommended, while the input capacitor should be grounded to the main ground plane. The quiet local ground is then routed back to the main ground plane using feedthrough vias. In general, the high frequency compensation components (input, bypass, and output capacitors) should be located as close to the device as possible. The proximity of the output capacitor is especially important to achieve optimal noise compensation from the onboard error amplifier, especially during high load conditions. A large copper area in the local ground will provide the heat sinking discussed above when high power dissipation signif- icantly increases the temperature of the device. Component-side copper provides significantly better thermal performance for this surface-mount device, compared to that obtained when using only copper planes on the underside.
ILC7071 PRODUCT SPECIFICATION 10 REV. 1.0.2 7/16/03 Mechanical Dimensions
5 Lead SOT-23-5
0.118 (3.00) 0.102 (2.60) 0.037 (0.95) BSC PIN 1 0.071 (1.80) 0.055 (1.40) 0.0059 (0.15) 0.0019 (0.05) 0.019 (0.50) 0.0138 (0.35) 0.057 (1.45) 0.035 (0.90) SEATING PLANE 10 ° 0°0.0078 (0.2) 0.0031 (0.08) 0.0217 (0.55) 0.0138 (0.35) 0.055 (1.40) 0.0393 (1.0) 0.122 (3.10) 0.106 (2.70)
ILC7071 PRODUCT SPECIFICATION 7/16/03 0.0m 002 Stock#DS30007071 2003 Fairchild Semiconductor Corporation LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
Ordering Information
Output Voltage Part Number Temperature Range Package