IL260E

IL260 ETC | Alldatasheet

Document overview

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Technical content

Features

• 3.3 V or 5 V CMOS/TTL Compatible
• 110 Mbps Data Rate
• 2500 VRMS Isolation (1 min)
• 2 ns Typical Pulse Width Distortion
• 4 ns Typical Propagation Delay Skew
• 10 ns Typical Propagation Delay
• 30 kV/ms Typical Transient Immunity
• 2 ns Channel to Channel Skew
• 0.3'' and 0.15'' 16–Pin SOIC Packages
• Extended Temperature Range (-40°C to +85°C)
• UL1577 Approval Pending
• IEC 61010-1 Approval Pending

Applications

• ADCs and DACs
• Multiplexed Data Transmission
• Data Interfaces
• Board-To-Board Communication
• Digital Noise Reduction
• Operator Interface
• Ground Loop Elimination
• Peripheral Interfaces
• Parallel Bus
• Logic Level Shifting
• Plasma Displays

Description

NVE's family of high-speed digital isolators are CMOS devices created by integrating active circuitry and our GMR- based and patented* IsoLoop® technology. The IL260 and IL261 are five channel versions of the world's fastest digital isolator with a 110 Mbps data rate. This device provides the designer with the most compact isolated logic devices yet available. All transmit and receive channels operate at 110 Mbps over the full temperature and supply voltage range. The symmetric magnetic coupling barrier provides a typical propagation delay of only 10 ns and a pulse width distortion of 2 ns achieving the best specifications of any isolator device. Typical transient immunity of 30 kV/µs is unsurpassed. High channel density make them ideally suited to isolating multiple ADCs and DACs, parallel buses and peripheral interfaces. Performance is specified over the temperature range of -40°C to +85°C without any derating. .

Parameters Symbol Min. Typ. Max. Units Test Conditions Storage Temperature T S -55 175 °C Ambient Operating Temperature T A -55 125 °C Supply Voltage V DD1 ,VDD2 -0.5 7 V Input Voltage V I -0.5 V DD+0.5 V Output Voltage V O -0.5 V DD+0.5 V Output Current I O -10 10 mA Drive Channel Lead Solder Temperature 280 °C 10 s ESD 2 kV Human Body Model Recommended Operating Conditions Parameters Symbol Min. Typ. Max. Units Test Conditions Ambient Operating Temperature(1) T A -40 85 °C Supply Voltage V DD1 ,VDD2 3.0 5.5 V 3.3/5.0 V Operation Supply Voltage V DD1 ,VDD2 4.5 5.5 V 5 V Operation Logic High Input Voltage V IH 2.4 V DD mA Logic Low Input Voltage V IL 0 0.8 V Minimum Input Signal Rise and Fall Times tIR, tIF 1 µ sec Insulation Specifications Parameters Symbol Min. Typ. Max. Units Test Conditions Creepage Distance (external) 0.15'' SOIC 4.026 mm 0.30'' SOIC 8.077 mm Leakage Current(5) 0.2 µARMS 240 VRMS Barrier Impedance (5) >10 14||7 Ω || pC Safety & Approvals IEC61010-1 TUV Certificate Numbers: Approval Pending Classification Model Package Pollution Degree Material Group Max. Working Voltage IL260, IL261 .30'' 16-pin SOIC II III 300 V RMS IL260-3, IL261-3 .15'' 16-pin SOIC II III 150 V RMS UL 1577 Component Recognition program. File #: Approval Pending Rated 2500VRMS for 1 minute (SOIC, PDIP), 1000VRMS for 1 minute (MSOP) Electrostatic Discharge Sensitivity This product has been tested for electrostatic sensitivity to the limits stated in the specifications. However, NVE recommends that all integrated circuits be handled with appropriate care to avoid damage. Damage caused by inappropriate handling or storage could range from performance degradation to complete failure.

1 IN 1 Input 1

2 GND 1 Ground Pins 2 and 8 connected internally

3 IN 2 Input 2

4 IN 3 Input 3

5 IN 4 Input 4

6 V DD1 Supply Voltage 1

7 IN 5 Input 5

8 GND 1 Ground Pins 2 and 8 connected internally

9 GND 2 Ground Pins 9 and 15 connected internally

10 OUT 5 Output 5

11 OUT 4 Output 4

12 OUT 3 Output 3

13 OUT 2 Output 2

14 OUT 1 Output 1

15 GND 2 Ground Pins 9 and 15 connected internally

16 V DD2 Supply Voltage 2

• Pins 2 and 8 internally connected ** Pins 9 and 15 internally connected IL260 Pin Connections

1 V DD1 Supply Voltage 1

3 IN 1 Input 1

4 IN 2 Input 2

5 IN 3 Input 3

6 IN 4 Input 4

7 OUT 5 Output 5

10 IN 5 Input 5

• Pins 2 and 8 internally connected ** Pins 9 and 15 internally connected

3.3 Volt Electrical Specifications

Electrical Specifications are Tmin to Tmax Parameters Symbol Min. Typ. Max. Units Test Conditions Input Quiescent Current IL260 IL261 IDD1 30 1.5 2.0 µA mA Output Quiescent Current IL260 IL261 IDD2 6.5 5.5 mA mA Logic Input Current I i -10 10 µA VDD-0.1 V DD IO = -20 µA, VI=VIH Logic High Output Voltage VOH 0.8*VDD V DD-0.5 V IO = -4 mA, VI=VIH 0 0.1 IO = 20 µA, VI=VIL Logic Low Output Voltage V OL 0.5 0.8 V IO = 4 mA, VI=VIL Switching Specifications Maximum Data Rate 100 110 Mbps C L = 15 pF Minimum Pulse Width PW 10 ns 50% Points, V O Propagation Delay Input to Output (High to Low) tPHL 12 18 ns C L = 15 pF, Propagation Delay Input to Output (Low to High) tPLH 12 18 ns C L = 15 pF, Pulse Width Distortion |tPHL-tPLH| (2) PWD 2 3 ns C L = 15 pF Propagation Delay Skew (3) t PSK 4 6 ns C L = 15 pF Output Rise Time (10-90%) t R 2 4 ns C L = 15 pF Output Fall Time (10-90%) t F 2 4 ns C L = 15 pF Common Mode Transient Immunity (Output Logic High to Logic Low)(4) |CMH|,|CML| 20 30 kV/µs VCN = 300 V Channel to Channel Skew 2 3 ns C L = 15 pF Dynamic Power Consumption(6) 200 240 µA/MHz per channel

5 Volt Electrical Specifications

Electrical Specifications are Tmin to Tmax Parameters Symbol Min. Typ. Max. Units Test Conditions Input Quiescent Current IL260 IL261 IDD1 30 2.5 3.0 µA mA Output Quiescent Current IL260 IL261 IDD2 10 mA mA Logic Input Current I i -10 10 µA VDD-0.1 V DD IO = -20 µA, VI=VIH Logic High Output Voltage VOH 0.8*VDD V DD-0.5 V IO = -4 mA, VI=VIH 0 0.1 IO = 20 µA, VI=VIL Logic Low Output Voltage V OL 0.5 0.8 V IO = 4 mA, VI=VIL Switching Specifications Maximum Data Rate 100 110 Mbps C L = 15 pF Minimum Pulse Width PW 10 ns 50% Points, V O Propagations Delay Input to Output (High to Low) tPHL 10 15 ns C L = 15 pF, Propagations Delay Input to Output (Low to High) tPLH 10 15 ns C L = 15 pF, Pulse Width Distortion |tPHL-tPLH| (2) PWD 2 3 ns C L = 15 pF Propagation Delay Skew (3) t PSK 4 6 ns C L = 15 pF Output Rise Time (10-90%) t R 1 3 ns C L = 15 pF Output Fall Time (10-90%) t F 1 3 ns C L = 15 pF Common Mode Transient Immunity (Output Logic High to Logic Low) |CMH|,|CML| 20 30 kV/µs VCN = 300 V Channel to Channel Skew 2 3 ns C L = 15 pF Dynamic Power Consumption(6) 280 340 µA/MHz per channel

Notes: (Apply to both 3.3 V and 5 V specifications.) 1. Absolute Maximum ambient operating temp erature means the device will not be damaged if operated under these conditions. It does not guarantee performance. 2. PWD is defined as | t PHL– tPLH |. %PWD is equal to the PWD divided by the pulse width. 3. t PSK is equal to the magnitude of the worst case difference in tPHL and/or tPLH that will be seen between units at 25°C. 4. CM H is the maximum common mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. CML is the maximum common mode input voltage that can be sustained while maintaining VO < 0.8 V. The common mode voltage slew rates apply to both rising and falling common mode voltage edges. 5. Device is considered a two terminal device: pins 1-8 shorted and pins 9-16 shorted. 6. Dynamic power consumption numbers are calculated per channe l and are supplied by the channel’s input side power supply.

Isoloop® devices achieve their low power consumption from the manner by which they transmit data across the isolation barrier. By detecting the edge transitions of the input logic signal and converting these to narrow current pulses, a magnetic field is created around the GMR Wheatstone bridge. Depending on the direction of the magnetic field, the bridge causes the output comparator to switch following the input logic signal. Since the current pulses are narrow, about 2.5ns wide, the power consumption is independent of mark- to-space ratio and solely dependent on frequency. This has obvious advantages over optocouplers whose power consumption is heavily dependent on its on-state and frequency. The approximate power supply current per channel for Power Supply Decoupling Both power supplies to these devices must be decoupled with low ESR 100 nF ceramic capacitors. For data rates in excess of 10MBd, use of ground planes for both GND1 and GND2 is highly recommended. Capacitors should be located as close as possible to the device. Signal Status on Start-up and Shut Down To minimize power dissipation, the input signals are differentiated and then latched on the output side of the isolation barrier to reconstruct the signal. This could result in an ambiguous output state depending on power up, shutdown and power loss sequencing. Therefore, the designer should consider the inclusion of an initialization signal in his start-up circuit. Initialization consists of toggling each channel either high then low or low then high, depending on the desired state. Data Transmission Rates The reliability of a transmission system is directly related to the accuracy and quality of the transmitted digital information. For a digital system, those parameters which determine the limits of the data transmission are pulse width distortion and propagation delay skew. Propagation delay is the time taken for the signal to travel through the device. This is usually different when sending a low-to-high than when sending a high-to-low signal. This difference, or error, is called pulse width distortion (PWD) and is usually in ns. It may also be expressed as a percentage: PWD% = Maximum Pulse Width Distortion (ns) x 100% Signal Pulse Width (ns) For example: For data rates of 12.5 Mb PWD% = 3 ns x 100% = 3.75% 80 ns This figure is almost three times better than for any available optocoupler with the same temperature range, and two times better than any optocoupler regardless of published temperature range. The IsoLoop® range of isolators will run at almost 35 Mb before reaching the 10% limit. Propagation delay skew is the difference in time taken for two or more channels to propagate their signals. This becomes significant when clocking is involved since it is undesirable for the clock pulse to arrive before the data has settled. A short propagation delay skew is therefore critical, especially in high data rate parallel systems, to establish and maintain accuracy and repeatability. The IsoLoop® range of isolators all have a maximum propagation delay skew of 6 ns, which is five times better than any optocoupler. The maximum channel-to-channel skew in the IsoLoop® coupler is only 3 ns which is ten times better than any optocoupler.

Package drawings, dimensions and specifications 0.15’’ 16-pin SOIC 0.3’’ 16-pin SOIC

Ordering information and valid part numbers.

An ISO 9001 Certified Company NVE Corporation is a high technology components manufacturer having the unique capability to combine leading edge Giant Magnetoresistive (GMR) materials with integrated circuits to make high performance electronic components. Products include Magnetic Field Sensors, Magnetic Field Gradient Sensors (Gradiometer), Digital Magnetic Field Sensors, Digital Signal Isolators and Isolated Bus Transceivers. NVE is a leader in GMR research and in 1994 introduced the world’s first products using GMR material, a line of GMR magnetic field sensors that can be used for position, magnetic media, wheel speed and current sensing. NVE is located in Eden Prairie, Minnesota, a suburb of Minneapolis. Please visit our Web site at www.nve.com or call 952-829- 9217 for information on products, sales or distribution. NVE Corporation

11409 Valley View Road

Eden Prairie, MN 55344-3617 USA Telephone: (952) 829-9217 Fax: (952) 829-9189 Internet: www.nve.com e-mail: isoinfo@nve.com The information provided by NVE Corporation is believed to be accurate. However, no responsibility is assumed by NVE Corporation for its use, nor for any infringement of patents, nor rights or licenses granted to third parties, which may result from its use. No license is granted by implication, or otherwise, under any patent or patent rights of NVE Corporation. NVE Corporation does not authorize, nor warrant, any NVE Corporation product for use in life support devices or systems or other critical applications. The use of NVE Corporation’s products in such applications is understood to be entirely at the customer’s own risk. Specifications shown are subject to change without notice. ISB-DS-001-IL260/1-A January 17, 2005