IFX2931_11 INFINEON | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 15

Technical content

Rev. 1.13, 2011-02-10 IFX2931 Low Dropout Linear Voltage Regulator IFX2931GV50 IFX2931GV33

IFX2931GV50 PG-DSO-8 IFX2931 IFX2931GV33 PG-DSO-8 2931V33 Data Sheet 2 Rev. 1.13, 2011-02-10 Low Dropout Linear Voltage Regulator IFX2931 1O v e r v i e w

Features

  • Very Low Quiescent Current
  • Output Current in Excess of 100mA
  • Input-Output Differential Less than 0.6V for 5V-Version
  • Reverse Battery Protection
  • Output Current Limitation
  • Overtemperature Shutdown
  • Mirror-Image Insertion Protection
  • Needs only small Output Capacitor COUT =1 0µ F
  • Green Product (RoHS compliant) For automotive and transportation applications, please refer to the Infineon TLE and TLF voltage regulator series. General Description The IFX2931 is a positive voltage regulator with a very low quiescent current of 1mA or less when supplying 10mA loads. The IFX2931GV50 also offers an extremely low dr opout voltage required for proper regulation: 0.2V for output currents of 10mA. Therefore the IFX2931 is the id eal supply for standby power systems. It is suitable for e.g. memory standby circuits, CMOS and other low power processor power supplies. It certainly can also be used for any system demanding as much as 100mA of output current. The IFX2931 is protected from reverse polarity condition and can withstand input voltages of 28 V cont inously. The IFX2931 cannot be harmed by temporary mirror-image insertion. Additional protection features such as output current limitation and overtemperature shutdown are also implemented. The IFX2931 comes in an 8-lead SMD package (PG-DSO-8).

Data Sheet 3 Rev. 1.13, 2011-02-10 IFX2931 Block Diagram

2 Block Diagram

2,3,6,7 8Input GND Output AEB01527 Circuit Amplifier Control Buffer

Data Sheet 4 Rev. 1.13, 2011-02-10

3 Pin Configuration

3.1 Pin Assignment

Figure 2 Pin Configuration

3.2 Pin Definitions and Functions IFX2931GV50, IFX2931GV33 (PG-DSO-8)

block to GND with a capacitor close to the IC terminals, respecting the values given for its capacitance COUT and ESR in “Typical Performance Characteristics” on Page 9 2,3,6,7 GND Ground 4,5 n.c. not connected 8I N Input for compensating line influences, a capacitor to GND close to the IC terminals is recommended IN n.c. GND GND OUT n.c. GND GND PINCONFIG _ DSO - 8 .VSD PG-DSO-8

Data Sheet 5 Rev. 1.13, 2011-02-10 IFX2931 General Product Characteristics

4 General Product Characteristics

4.1 Absolute Maximum Ratings

Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are not designed for continuous repetitive operation.

4.2 Functional Range

Note: Within the functional range the IC operates as described in the circuit description. The electrical characteristics are specified within the conditions given in the related electrical characteristics table. Absolute Maximum Ratings 1) Tj = -40 C to 125 C; all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) 1) Not subject to production test, specified by design. Pos. Parameter Symbol Limit Values Unit Conditions Min. Max. Input

4.1.1 Voltage

VI -30 28 V – Output 4.1.2 Voltage VOUT -0.3 28 V – Temperatures

4.1.3 Junction Temperature Tj -40 125 C–

4.1.4 Storage Temperature Tstg -55 150 C–

4.1.5 ESD Resistivity to GND VESD -2 2 kV HBM 2)

2) ESD susceptibility, HBM acco rding to EIA/JESD 22-A114B Pos. Parameter Symbol Limit Values Unit Conditions Min. Max.

4.2.1 Input Voltage VI 6 28 V IFX2931GV50

4.2.2 4.4 26 V IFX2931GV33

4.2.3 Junction Temperature Tj -40 125 C–

General Product Characteristics Data Sheet 6 Rev. 1.13, 2011-02-10

4.3 Thermal Resistance

Pos. Parameter Symbol Limit Values Unit Conditions Min. Typ. Max. IFX2931GV50, IFX2931GV33 (PG-DSO-8)

4.3.1 Junction to Soldering Point 1)

1) not subject to production test, specified by design RthJSP – 39 – K/W measured to group of pins 2, 3, 6, 7

4.3.2 Junction to Ambient 1) RthJA – 96 – K/W Footprint only 2)

2) Specified RthJA value is according to Jedec JESD51-2,-7 at natural convection on FR4 2s2p board; The Product (Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu). 4.3.3 – 67 – K/W 300mm 2 heatsink area on PCB2) 4.3.4 – 66 – K/W 600mm 2 heatsink area on PCB2)

Data Sheet 7 Rev. 1.13, 2011-02-10 IFX2931

Electrical Characteristics

5 Electrical Characteristics

5.1 Electrical Charact eristics IFX2931GV50

VI =1 4V , Tj = -40 C to 125 C, IOUT = 10 mA, all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Pos. Parameter Symbol Limit Values Unit Conditions Min. Typ. Max. 5.1.1 Output Voltage VOUT 4.75 5 5.25 V Tj =2 5° C 4.5 5 5.5 V –

5.1.2 Line Regulation VOUT,line –21 0 m V 9 V < VI <1 6V

5.1.3 – 4 30 mV 6 V < VI <2 6V

5.1.4 Load Regulation VOUT,load –- 1 4 - 5 0 m V 5 m A < IOUT <1 0 0m A

5.1.5 Output Impedance 1)

1) not subject to production test, specified by design ZOUT –2 0 0 –m  IOUT =1 0 0m ADC and IOUT =1 0m Arms

100 Hz - 10 kHz

5.1.6 Current Consumption Iq –0 . 4 1m A IOUT =1 0m A 6V< VI <2 6V 5.1.7 – 9 15 mA IOUT =1 0 0m A

5.1.8 Output Noise Voltage 1) Vnoise –5 0 0 –µ V rms 100 Hz - 10 kHz

COUT =1 0 0µ F

5.1.9 Long Term Stability 1) VOUT,1000h –2 0 –m V

/1000h

5.1.10 Ripple Rejection 1) PSRR –8 0 –d B fripple =1 2 0H z

5.1.11 Dropout Voltage 2)

2) obtained when the output voltage has dropped 100mV below the nominal value VDR –0 . 0 5 0 . 2 V IOUT =1 0m A 5.1.12 – 0.3 0.6 V IOUT =1 0 0m A

Data Sheet 8 Rev. 1.13, 2011-02-10

5.2 Electrical Charact eristics IFX2931GV33

VI =1 4V , Tj = -40 C to 125 C, IOUT = 10 mA, all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Pos. Parameter Symbol Limit Values Unit Conditions Min. Typ. Max. 2.97 3.3 3.63 V 4.4 V < VI <2 6V IOUT =1 0 0m A 5.2.2 Line Regulation VOUT,line –43 3 m V 4 . 4 V < VI <2 6V Tj =2 5° C

5.2.3 Load Regulation VOUT,load –- 1 0 - 5 0 m V 5 m A < IOUT <1 0 0m A

Tj =2 5° C

5.2.4 Output Impedance 1)

1) not subject to production test, specified by design ZOUT –2 0 0 –m  IOUT =1 0 0m ADC and IOUT =1 0m Arms 5.2.5 Current Consumption Iq –0 . 4 1m A IOUT =1 0m A

4.4 V < VI <2 6V

5.2.6 – 15 – mA IOUT =1 0 0m A

5.2.7 Output Noise Voltage 1) Vnoise –3 3 0 –µ V rms 10 Hz - 100 kHz

COUT =1 0 0µ F

5.2.8 Long Term Stability 1) VOUT,1000h –1 3 –m V

/1000h

5.2.9 Ripple Rejection 1) PSRR –8 0 –d B fripple =1 2 0H z

5.2.10 Dropout Voltage 2)

2) obtained when the output voltage has dropped 100mV below the nominal value VDR –0 . 8 5 1 . 1 V IOUT =1 0 0m A , Tj =2 5° C

Data Sheet 9 Rev. 1.13, 2011-02-10 IFX2931

5.3 Typical Performance Characteristics

Dropout Voltage VDR versus Output Current IOUT IFX2931GV50: Output Voltage VOUT versus Input Voltage VI IFX2931GV33: Output Voltage VOUT versus Input Voltage VI Load Transient Response DRV Ι Q AED01978 100 200 300 400 500 600 mV 800 50 100 mA 17575 125 = C125 25 C= 700 jT jT AED01984 VQ 24 6 10 V LR =5 0 Ω ΙV V 0,0 0,5 1,0 1,5 2,0 2,5 3,0 3,5 02468 1 V I [V] VQ [V] I Q 50 mA V33_IQ_VI.VSD -80 -60 -40 -20 V OUT [mV] C OUT = 100 µF ESR(C OUT) = 0.4  100 120 140 160 -10 0 10 20 30 40 50 60 70 80 90 t [µs] OUT [mA] LOADTRANSIENTRESPONSE.VSD

Data Sheet 10 Rev. 1.13, 2011-02-10 IFX2931GV50: Output Voltage VOUT versus Junction Temperature Tj IFX2931GV33: Output Voltage VOUT versus Junction Temperature Tj Output Current IOUT versus Input Voltage VI Current Consumption Iq versus Low Output Current IOUT 4.60 -40 AED01982 VQ 04 0 80 160 4.80 5.00 V 5.20 120 C 4.70 4.90 5.10 iV =1 3.5 V jT V33_VQ_TJ.VSD 2,90 3,00 3,10 3,20 3,30 3,40 3,50 -40 10 60 110 160 T j [°C] V Q [V] V I = 14 V AED01983 = C125 25 C= QΙ VΙ 10 20 304 0 50 100 150 200 mA V jT jT Ι Q AED01981 mA 3010 20 Ι q 0.5 1.0 1.5 2.0 mA 3.0 Vi =1 3.5 V 5 15 2.5

Data Sheet 11 Rev. 1.13, 2011-02-10 IFX2931 Current Consumption Iq versus Output Current IOUT Current Consumption Iq versus Input Voltage VI Ι Q AED01980 mA 15050 100 Ιq mA Vi =1 3.5 V 01 0 2 0 3 0 4 0 V I [V] Iq [mA] R L = 50  R L = 100  IQ_VI.VSD

Data Sheet 12 Rev. 1.13, 2011-02-10 Power Supply Ripple Rejection PSRR versus Frequency f IFX2931GV50: Output Capacitor’s Equivalent Series Resistance ESR(COUT) versus Output Current IOUT IFX2931GV33: Output Capacitor’s Equivalent Series Resistance ESR(COUT) versus Output Current IOUT 0,00 10,00 20,00 30,00 40,00 50,00 60,00 70,00 80,00 90,00 0,01 0,1 1 10 100 f [kHz] PSRR [dB] I OUT = 1 mA C OUT = 10 µF ESR(C OUT) = 0,02  I OUT = 10 mA I OUT = 100 mA PSRR_F.VSD 0,00 1,00 2,00 3,00 4,00 5,00 6,00 7,00 8,00 9,00 10,00 02 0 4 0 6 0 8 0 1 0 0 IOUT [mA] ESR(C OUT) [] C OUT = 10 µF Unstable Region Stable Region ESR_IOUT.VSD 0,00 1,00 2,00 3,00 4,00 5,00 6,00 7,00 8,00 9,00 10,00 0 2 04 06 08 0 1 0 0 I OUT [mA] ESR(C OUT) [] C OUT = 10 µF Unstable Region Stable Region V33_ESR_IOUT.VSD

Data Sheet 13 Rev. 1.13, 2011-02-10 IFX2931 Package Outlines

6 Package Outlines

Green Product (RoHS compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020). +0.06 0.19 0.35 x 45˚ 1)-0.24 C 8 MAX. 0.64 ±0.26 ±0.25 0.2 8xM C 1.27 +0.10.41

0.2 M A

-0.06 1.75 MAX. (1.45) ±0.070.175 B 8xB Index Marking 5-0.2 8 5 A 1) Does not include plastic or metal protrusion of 0.15 max. per side 2) Lead width can be 0.61 max. in dambar area GPS01181 0.1 For further information on alternative packages, please visit our website: http://www.infineon.com/packages. Dimensions in mm

Revision History

Data Sheet 14 Rev. 1.13, 2011-02-10

7 Revision History

1.13 2011-02-10 Editorial change on page 9 (Typo) 1.12 2010-02-23 Editorial change 1.11 2009-10-19 Coverpage changed Overview page: Inserted reference statement to TLE/TLF series. 1.1 2009-05-04 Version with 3.3V output voltage and all related description added Form Page 2 on on top right “IFX2931GV50” updated to “IFX2931” In “Features” on Page 2 “Input-Output Differential Less than 0.6V” updated to “Input-Output Differential Less than 0.6V for 5V-Version” In “General Description” on Page 2, all “IFX2931GV50” replaced by “IFX2931”; in line 2, “It” replaced by “The IFX2931GV50”; In “Pin Configuration” on Page 4 “, IFX2931GV33” added In “Functional Range” on Page 5 Item 4.2.2 added, in Item 4.2.1’s Condition “IFX2931GV50” added In Table 4.3 “Thermal Resistance” on Page 6 “, IFX2931GV33” added “Electrical Characteristics IFX2931GV50” on Page 7 updated: “IFX2931GV50” added in this heading Table 5.2 “Electrical Characteristics IFX2931GV33” on Page 8 added In “Typical Performance Characteristics” on Page 9 performance characteristics “IFX2931GV33: Output Voltage V OUT versus Input Voltage VI” on Page 9, “IFX2931GV33: Output Voltage VOUT versus Junction Temperature Tj” on Page 10 and “IFX2931GV33: Output Capacitor’s Equivalent Series Resistance ESR(COUT) versus Output Current IOUT” on Page 12 added; “IFX2931GV50” added in description of performance characteristics “IFX2931GV50: Output Voltage VOUT versus Input Voltage VI” on Page 9, “IFX2931GV50: Output Voltage VOUT versus Junction Temperature Tj” on Page 10 and “IFX2931GV50: Output Capacitor’s Equivalent Series Resistance ESR(COUT) versus Output Current IOUT” on Page 12 1.0 2008-04-21 final version data sheet

81726 Munich, Germany

© 2011 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.