IFX25001 INFINEON | Alldatasheet

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Technical content

Rev. 1.02, 2010-05-20 IFX25001 Low Dropout Voltage Regulator

IFX25001 ME V25 PG-SOT223-4 25001A IFX25001 ME V33 PG-SOT223-4 25001B IFX25001 TF V33 PG-TO252-3 2500133 IFX25001 TS V50 PG-TO220-3 25001V50 IFX25001TF V50 PG-TO252-3 2500150 IFX25001 TC V50 PG-TO263-3 25001V50 IFX25001 TS V85 PG-TO220-3 25001V85 IFX25001 TC V85 PG-TO263-3 25001V85 IFX25001 TS V10 PG-TO220-3 25001V10 IFX25001 TC V10 PG-TO263-3 25001V10 Data Sheet 2 Rev. 1.02, 2010-05-20 PG-TO252-3 PG-TO263-3 PG-TO220-3 PG-SOT223-4 Low Dropout Voltage Regulator 1O v e r v i e w

Features

  • Output Current up to 400 mA
  • Low Current Consumption
  • Wide Input Voltage Range up to 45V
  • Low Dropout Voltage
  • Output Current Limitation
  • Reverse Polarity Protection
  • Overtemperature Shutdown
  • Wide Temperature Range, -40 °C to 125 °C
  • Green Product (RoHS compliant)

Applications

  • Manufacturing Automation
  • Appliances
  • HDTV Televisions
  • Game Consoles
  • Network Routers For automotive and transportation applications, please refer to the Infineon TLE and TLF voltage regulator series.

Description

capable of supplying continuous output current up to 40 0 mA. A wide input voltage range up to 45V enables the IFX25001 to operate in a large variety of applications. The IFX25001 is also protected against overload, short circuit and overtemperature conditions.

Data Sheet 3 Rev. 1.02, 2010-05-20

2 Block Diagram

Ι AEB01959 GND Q Bandgap Reference Control Amplifier Sensor Temperature Buffer Saturation Control and Protection Circuit

Data Sheet 4 Rev. 1.02, 2010-05-20 IFX25001 Pin Configuration

3 Pin Configuration

3.1 Pin Assignment PG-SOT223-4, PG-T O252-3, PG-TO263-3, and PG-TO220-3

Figure 2 Pin Configuration (top view)

3.2 Pin Definitions and Functions PG-S OT223-4, PG-TO252-3, PG-TO263-3, and

Pin No. Symbol Function 1I Input connect Input pin to positive DC voltage source (e.g. battery); a small filter capacitor connected close to the Input pin and GND is recommended 2G N D Ground internally connected to heat slug pin 3Q Output connect a capacitor close to the Output pin and GND according to the values specified in “Functional Range” on Page 5 4 / Heat Slug GND Heat Slug internally connected to GND pin; connect to heatsink to improve thermal performance 3*72YVG *1' *1' 3*72YVG , *1' 4 *1' 3*72YVG *1' *1' 627 YVG , *1' 4 *1'

General Product Characteristics Data Sheet 5 Rev. 1.02, 2010-05-20

4 General Product Characteristics

4.1 Absolute Maximum Ratings

Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are not designed for continuous repetitive operation.

4.2 Functional Range

Note: Within the functional or operating range, the IC operates as described in the circuit description. The electrical characteristics are specified within the conditions given in the Electrical Characteristics table. Absolute Maximum Ratings1) Tj = -40 °C to 150 °C; all voltages with respect to ground, (unless otherwise specified) 1) not subject to production test, specified by design Pos. Parameter Symbol Limit Values Unit Test Condition Min. Max. Input I

4.1.1 Voltage VI -42 45 V –

4.1.2 Voltage

VQ -1 40 V – Temperature

4.1.3 Junction temperature Tj -40 150 °C–

4.1.4 Storage temperature Tstg -50 150 °C–

Pos. Parameter Symbol Limit Values Unit Remarks Min. Max. 4.2.1 Input voltage VI 4.7 40 V IFX25001 ME V25 IFX25001 ME V33 IFX25001 TF V33 4.2.2 VI 5.5 40 V IFX25001 TS V50 IFX25001TF V50 IFX25001 TC V50 4.2.3 VI 9.0 40 V IFX25001 TS V85 IFX25001 TC V85 4.2.4 VI 10.5 40 V IFX25001 TS V10 IFX25001 TC V10

4.2.5 Output Capacitor’s

Requirements for Stability CQ 22 – µF 1) 1) the minimum output capacitance requirement is appl icable for a worst case capacitance tolerance of 30%

4.2.6 ESR(CQ) –3 Ω 2)

2) relevant ESR value at f =1 0k H z

4.2.7 Junction temperature Tj -40 125 °C–

Data Sheet 6 Rev. 1.02, 2010-05-20 IFX25001 General Product Characteristics

4.3 Thermal Resistance

Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go to www.jedec.org. Pos. Parameter Symbol Limit Values Unit Conditions Min. Typ. Max. PG-TO252-3

4.3.1 Junction to Case 1)

1) Not subject to production test, specified by design. RthJC – 4 – K/W measured to heat slug

4.3.2 Junction to Ambient 1) RthJA –2 7 –K / W 2)

2) Specified RthJA value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The Product (Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm³ board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu). Where applicable a thermal via array under the exposed pad contacted the first inner copper layer.

4.3.3 RthJA – 57 – K/W 300 mm² heatsink

area3) 3) Specified RthJA value is according to Jedec JESD 51-3 at natural convection on FR4 1s0p board; The Product (Chip+Package) was simulated on a 76.2 × 114.3 × 1.5 mm3 board with 1 copper layer (1 x 70µm Cu).

4.3.4 RthJA – 42 – K/W 600 mm² heatsink

area3) PG-TO263-3

4.3.5 Junction to Case 1) RthJC – 4 – K/W measured to heat

4.3.6 Junction to Ambient 1) RthJA –2 2 –K / W 2)

4.3.7 RthJA – 42 – K/W 300 mm² heatsink

area3)

4.3.8 RthJA – 33 – K/W 600 mm² heatsink

area3) PG-TO220-3

4.3.9 Junction to Case 1) RthJC – 8 – K/W measured to

4.3.10 Junction to Case 1) RthJC – 25 – K/W measured to heat

4.3.11 Junction to Ambient 1) RthJA –5 1 –K / W 2)

4.3.12 RthJA – 75 – K/W 300 mm² heatsink

area3)

4.3.13 RthJA – 63 – K/W 600 mm² heatsink

area3)

Electrical Characteristics

Data Sheet 7 Rev. 1.02, 2010-05-20

5 Electrical Characteristics

5.1 Electrical Character istics Voltage Regulator

VI =13.5 V; Tj = -40 °C to 125 °C; all voltages with respect to ground (unless otherwise specified) Pos. Parameter Symbol Limit Va lues Unit Measuring Condition Min. Typ. Max. Output Q IFX25001 TC V10 5m A< IQ<4 0 0m A

11 V < VI <2 8V

5m A< IQ<4 0 0m A

9.5 V < VI <2 8V

5m A< IQ<4 0 0m A 6V< VI <2 8V IFX25001 TF V33 5m A< IQ<4 0 0m A

4.7 V < VI <2 8V

5m A< IQ<4 0 0m A

5.1.4 Dropout Voltage Vdr – 250 500 mV IFX25001 TS V50,

IFX25001TF V50, IFX25001 TC V50, IFX25001 TS V85, IFX25001 TC V85 IFX25001 TS V10, IFX25001 TC V10 IQ =2 5 0m A Vdr = VI – VQ 5.1.5 Dropout Voltage Vdr – 0.7 1.2 V IFX25001 ME V33, IFX25001 TF V33; IQ =3 0 0m A Vdr = VI – VQ 5.1.6 Dropout Voltage Vdr – 1.0 2.0 V IFX25001 ME V25, IQ =3 0 0m A Vdr = VI – VQ

Data Sheet 8 Rev. 1.02, 2010-05-20 IFX25001

5.1.7 Load Regulation ΔVQ, lo – 20 50 mV IFX25001 TS V50,

IFX25001TF V50, IFX25001 TC V50, IQ = 5 mA to 400 mA VI =6V

5.1.8 Load Regulation ΔVQ, lo – 20 50 mV IFX25001 TS V85,

IFX25001 TS V10, IFX25001 TC V10 IQ = 5 mA to 400 mA

5.1.9 Load Regulation ΔVQ, lo – 40 70 mV IFX25001 ME V33,

IFX25001 TF V33, IFX25001 ME V25 IQ = 5 mA to 300 mA VI =6V

5.1.10 Line Regulation ΔVQ, li – 1 02 5m V Vl = 12 V to 32 V

IQ =5m A

5.1.11 Output Current Limitation IQ 400 600 1100 mA 1)

5.1.12 Power Supply Ripple Rejection 2) PSRR –6 0 –d B fr =1 0 0H z ; Vr =0 . 5V p p 5.1.13 Temperature Ou tput Voltage Drift2) –0 . 5 –m V / K –

5.1.14 Overtemper ature Shutdown

Tj,sd 151 – 200 °C Tj increasing2) Current Consumption

5.1.15 Quiescent Current

Iq = II – IQ Iq –1 0 0 2 2 0 μA IQ =1m A

5.1.16 Current Consumption

Iq = II – IQ Iq –81 5 m A IQ =2 5 0m A

5.1.17 Iq – 2 03 0m A IQ =4 0 0m A

1) Measured when the output voltage VQ has dropped 100 mV from the nominal value obtained at VI = 13.5 V. 2) not subject to production test, specified by design VI =13.5 V; Tj = -40 °C to 125 °C; all voltages with respect to ground (unless otherwise specified) Pos. Parameter Symbol Limit Va lues Unit Measuring Condition Min. Typ. Max. dVQ

Data Sheet 9 Rev. 1.02, 2010-05-20

5.2 Typical Performance Characteristi cs Voltage Regulator (V50, V85, V10)

Dropout Voltage Vdr versus Output Current IQ Output Current IQ versus Input Voltage VI Current Consumption Iq versus Output Current IQ (High Load) Current Consumption Iq versus Output Current IQ (Low Load) AED01962 drV 200 400 600 mV 500 300 100 Tj = 125 ˚C QI 100 200 300 mA 400 = 25 ˚CTj AED01963 VQ = 0 V = 25 ˚CTj IV QI 10 20 30 40 50V 200 400 600 mA 800 AED02267 QI qI 100 200 300 400 600 mA IV = 13.5 V mA = 25 ˚CTj AED02268 QI qI 0.1 0.2 0.3 0.4 0.5 0.6 10 20 30 40 mA 60 mA IV = 13.5 V = 25 ˚CTj

Data Sheet 10 Rev. 1.02, 2010-05-20 IFX25001

5.2.1 Typical Performance Characteri stics Voltage Regulator (V50 Version)

Current Consumption Iq versus Input Voltage VI Output Voltage VQ versus Input Voltage VI Input Current II versus Input Voltage VI AED01966 -40 04 0 8 0 120 ˚C1604.8 jT QV 5.2 V VI = 13.5 V 4.9 5.0 5.1 mA AED02269 qΙ 10 20 30 V RL = 20 Ω V Ι T j = 25 C AED01968 0 246 8 V1 00 QV V VI = QV Tj = 25 ˚C LR = 20 Ω IV VQ AED01977 -50-2 IV II T = 25 ˚C LR = 8.2 k -25 0 25 50 0.5 1.0 1.5 2.0 2.5 3.0 3.5 mA V Ω j

Data Sheet 11 Rev. 1.02, 2010-05-20

5.2.2 Typical Performance Characteri stics Voltage Regulator (V85 Version)

Current Consumption Iq versus Input Voltage VI Output Voltage VQ versus Input Voltage VI Input Current II versus Input Voltage VI AED01970 -40 04 0 8 0 120 ˚C160 jT QV 8.4 8.6 V VI = 13.5 V 8.3 8.2 8.5 8.7 8.8 mA AED02270 qΙ 10 20 30 V RL = 20 Ω V Ι T j = 25 C 408 R T QV QV Ι = V V V1612 20 VΙ = 25 C = 34L j Ω AED01972 QV AED03051 -50-2 IV II T = 25 ˚C LR = 12 k -25 0 25 50 0.5 1.0 1.5 2.0 2.5 3.0 3.5 mA V Ω j

Data Sheet 12 Rev. 1.02, 2010-05-20 IFX25001

5.2.3 Typical Performance Characteri stics Voltage Regulator (V10 Version)

Current Consumption Iq versus Input Voltage VI Output Voltage VQ versus Input Voltage VI Input Current II versus Input Voltage VI AED01974 -40 04 0 8 0 120 ˚C1609.7 jT QV 9.9 10.1 10.3 V VI = 13.5 V 10.2 9.8 10.0 mA AED02270 qΙ 10 20 30 V RL = 20 Ω V Ι T j = 25 C AED01976 0 48 1 2 16 V2 00 QV V VI = QV Tj = 25 ˚C LR = 34 Ω IV VQ AED03048 -50-2 IV II T = 25 ˚C LR = 15 k -25 0 25 50 0.5 1.0 1.5 2.0 2.5 3.0 3.5 mA V Ω j

Data Sheet 13 Rev. 1.02, 2010-05-20

5.2.4 Typical Performance Characteristics Voltage Regulator (V33 and V25 Version)

Junction Temperature TJ (V33 Version) Output Voltage VQ versus Junction Temperature TJ (V25 Version) Input Current II versus Input Voltage V I (V33 Version) Input Current II versus Input Voltage V I (V25 Version) AED02288 -40 04 0 8 0 120 ˚C1602.9 jT QV 3.1 3.3 3.5 V VI = 6 V 3.2 3.4 3.0 AED02806 -40 04 0 8 0 120 ˚C1602.1 jT QV 2.3 2.5 2.7 V VI = 6 V 2.6 2.4 2.2 AED01969 -50-2 IV II IR = 3.3 k -25 0 25 50 0.5 1.0 1.5 2.0 2.5 3.0 3.5 mA V Ω T = 25 ˚Cj AED03016 -50-2 IV II IR = 3.3 k -25 0 25 50 0.5 1.0 1.5 2.0 2.5 3.0 3.5 mA V Ω T = 25 ˚Cj

Data Sheet 14 Rev. 1.02, 2010-05-20 IFX25001

5.2.5 Typical Performance Characteristics Voltage Regulator (V33 and V25 Version)

Current Consumption Iq versus Output Current IQ (Low Load) Current Consumption Iq versus Output Current IQ (High Load) Output Current IQ versus Input Voltage VI Region of Stability For Output Capacitor, CQ = 10 μF AED02268 QI qI 0.1 0.2 0.3 0.4 0.5 0.6 10 20 30 40 mA 60 mA IV = 13.5 V = 25 ˚CTj AED02267 QI qI 100 200 300 400 600 mA IV = 13.5 V mA = 25 ˚CTj 2001 0 mA 800 QΙ = 25 CTj 50V30 40 VΙ AED02287 200 400 600 = 0 VVQ 0.2 100 1012 10 mA QI 500 ESR Ω AED03050

Data Sheet 15 Rev. 1.02, 2010-05-20

6 Package Outlines

5.4 ±0.1 -0.106.5 +0.15 A ±0.59.9 6.22 -0.2 1 ±0.1 ±0.150.8 0.15 ±0.1 MAX. per side 0.75 2.28 4.57 +0.08 -0.040.9 2.3 -0.10 +0.05 B MIN.0.51 ±0.11 +0.08 -0.040.5 0...0.15 BA0.25 M 0.1 All metal surfaces tin plated, except area of cut. 3 x

Data Sheet 16 Rev. 1.02, 2010-05-20 IFX25001 Package Outlines Figure 4 PG-TO263-3 BA0.25 M 0.1 Typical ±0.2 GPT09362 8.5 1) 7.551) (15) ±0.29.25 ±0.31 0...0.15 5.08 2.54 0.75 ±0.1 1.05 ±0.11.27 4.4 B 0.5 ±0.1 ±0.32.7 4.7 ±0.5 0.05 0.1 All metal surfaces: tin plated, except area of cut. 2.4 Metal surface min. x=7.25, y=6.9 A 0...0.3 B 8˚ MAX.

Data Sheet 17 Rev. 1.02, 2010-05-20 Figure 5 PG-TO220-3 A BA0.25 M Typical 9.9±0.2 2.8 15.65±0.3 12.95 0...0.15 2.54 0.75±0.1 1.05 ±0.11.27 4.4 B 9.25±0.2 0.05 All metal surfaces tin plated, except area of cut. C ±0.2 17±0.3 8.51) 10±0.2 3.7-0.15 C 2.4 0.5±0.1 ±0.24.55 13.5±0.5 Metal surface min. x=7.25, y=12.3 0...0.3 2.4

Data Sheet 18 Rev. 1.02, 2010-05-20 IFX25001 Package Outlines Figure 6 PG-SOT223-4 Green Product (RoHS compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020). 0.25 ±0.10.7 4.6 M A 1 2 2.3 A ±0.1 6.5 ±0.2 DIN 6784 +0.2 acc. to ±0.04 0.25 0.5 MIN. M B 0.28 0.1 MAX. 15˚ 7 ±0.3 1.6 ±0.1 3.5 ±0.2 B MAX. For further information on packages, please visit our website: http://www.infineon.com/packages. Dimensions in mm

Revision History

Data Sheet 19 Rev. 1.02, 2010-05-20

7 Revision History

1.02 2009-05-20 Editorial change (fig. 2) 1.01 2009-10-02 Coverpage changed Overview page: Inserted reference statement to TLE/TLF series. 1.0 2009-04-28 Initial Release

81726 Munich, Germany

© 2010 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.