IFX1117MEV

IFX1117_11 INFINEON | Alldatasheet

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Features

• Output voltage 3.3 V or adjustable  1.0 A output current  Low drop voltage < 1.2 V @ 800 mA  Short circuit protected  Overtemperature protected  Operating range up to 15 V  Industrial type  Green Product (RoHS compliant) For automotive and transportation applications, please refer to the Infineon TLE and TLF voltage regulator series. Functional Description The IFX1117 is a monolithic integrated fixed NPN type voltage regulator that can supply loads up to 1.0 A. The device is housed in the small surface mounted SOT223 package. The IC is equipped with additional protecti on against overload, short circuit and over- temperature. The IFX1117ME V33 supplies a regulated output voltage of 3.3 V ( ±2%). The IFX1117ME V supplies an output voltage with ±2% precision adjustable via an external voltage divider. The input voltage for the IFX1117ME V33 ranges from 4.5 V (= VQ+VDR) to 15 V for a load current of 800 mA, for the maximum load current of 1.0 A a minimum input voltage of 4.7 V is required. The drop voltage VDR ranges from 1.1 V to 1.4 V depending on the load current level. The device operates in the temperature range of Tj = 0 to 125 °C.

Protection; Overcurrent Protection I Q Internal Reference GND Data Sheet 2 Rev. 1.0, 2011-02-24 IFX 1117 Figure 1 Block Diagram for Fixed Ou tput Voltage IFX1117ME V33

AEP02868_1117_01 123 QGND I Q IFX 1117 Data Sheet 3 Rev. 1.0, 2011-02-24 Figure 2 Pin Configuration IFX1117ME V33 (top v iew) Table 1 Pin Definitions and Functions IFX1117ME V33 Pin No. Symbol Function

1 GND Ground

2 Q Output; Co nnect output pin to GND via a capacitor CQ ≥ 10 μF

with ESR ≤ 20 Ω (see also graph “Region of Stability”)

3 I Input

4 (TAB) Q Output; Connect to pin 2 and heatsink area on PCB

AEP02868_1117_02 123 QADJ I Q SOT223 Data Sheet 4 Rev. 1.0, 2011-02-24 IFX 1117 Figure 3 Pin Configuration IFX1117ME V (top view ) Table 2 Pin Definitions and Functions IFX1117ME V Pin No. Symbol Function

1 ADJ Adjust; defines output voltage level by external voltage divider

between Q, ADJ and GND. with ESR ≤ 20 Ω (see also graph “Region of Stability”). 4 (TAB) Q Output; Connect to pin 2 and heatsink area on PCB

Table 3 Absolute Maximum Ratings Parameter Symbol Limit Values Unit Test Condition Min. Max. Input - Output Voltage D ifference (variable device only) Voltage VI - VQ -0.3 20 V – Input Voltage (fixed voltage vers ion only) Voltage VI -0.3 20 V – Output Voltage VQ -0.3 20 V – Current IQ – – – Internally limited ESD Rating Electrostatic disch arge voltage VESD -2 2 kV Human Body Model Temperature Storage temperature Tstg -50 150 °C – Junction temperature Tj -40 150 °C – Table 4 Operating Range Parameter Symbol Limit Values Unit Remarks Min. Max. Input Voltage VI VQ + VDR 15 V – Junction temperature Tj 0 125 °C – Table 5 Thermal Resistance Junction ambient Rthja – 164 K/W PG-SOT223, footprint only. – 81 K/W PG-SOT223, 300 mm2 heat sink area Junction case Rthjc – 4 K/W – IFX 1117 Data Sheet 5 Rev. 1.0, 2011-02-24 Note: Stresses above those listed here ma y cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note: In the operating range, the functions given in the circuit description are fulfilled.

Characteristics 3.3 V Fixed Output Voltage Device IFX1117ME V33 0 °C < Tj < 125 °C; VI = 5 V, IQ = 10 mA; unless otherwise specified. Parameter Symbol Limit Values Unit Measuring Conditions min. typ. max. Output voltage VQ 3.23 3.300 3.36 V 0 mA ≤ IQ ≤ 800 mA

4.7 V ≤ VI ≤ 10 V

Output voltage VQ – 3.300 – V 0 mA ≤ IQ ≤ 1000 mA;

4.7 V ≤ VI ≤ 15V

Line regulation ΔVQ – 1 6 mV 4.7 V ≤ VI ≤ 15V Load regulation ΔVQ – 1 10 mV 0 mA ≤ IQ ≤ 800 mA;1) 1) Measured at constant junction temperature – 2 – mV 0 mA ≤ IQ ≤ 1.0 A1) Drop voltage VDR – 1.00 1.10 V IQ = 100 mA2) 2) Drop voltage measured when the output voltage has dropped 100 mV from the nominal value obtained at VI = 5.0 V. Drop voltage VDR – 1.05 1.15 V IQ = 500 mA2) Drop voltage VDR – 1.10 1.20 V IQ = 800 mA2) Drop voltage VDR – 1.30 1.40 V IQ = 1.0 A2) Current consumption; Iq = II – IQ Iq – 5 10 mA IQ = 10 mA Temperature stability ΔVQ – 16.5 – mV 3) 3) Specified by design; not subject to production test. Long Term Stability – – 0.3 – % 3) Current limit IQmax 1100 – 2250 mA VQ = 0.5 V RMS Output Noise – – 30 – ppm ppm of VQ, Tj = 25 °C

10 Hz ≤ f ≤ 10 kHz3)

PSRR 60 65 – dB fr = 120 Hz, Vr = 1 VPP Data Sheet 6 Rev. 1.0, 2011-02-24 IFX 1117

Characteristics Adjustable Output Voltage Device IFX1117ME V 0 °C < Tj < 125 °C; VI = 5 V, IQ = 10 mA; unless otherwise specified. Parameter Symbol Limit Values Unit Measuring Conditions min. typ. max. Reference voltage VQ 1.22 1.250 1.27 V 10 mA ≤ IQ ≤ 800 mA;

1.4 V ≤ (VI-VQ) ≤ 10 V

Output voltage VQ – 1.250 – V 10 mA ≤ IQ ≤ 1000 mA;

2.65 V ≤ VI ≤ 15 V

Line regulation ΔVQ – 0.035 0.2 %1) 1) Related to VQ 1.5 V ≤(VI-VQ)≤ 13.75 V Load regulation ΔVQ – 0.2 0.4 %1) 10 mA ≤ IQ ≤ 800 mA;2) 2) Measured at constant junction temperature Drop voltage VDR – 1.00 1.10 V IQ = 100 mA 3) 3) Drop voltage measured when the output voltage has dropped 100 mV from the nominal value obtained at VI = 5.0 V. Drop voltage VDR – 1.05 1.15 V IQ = 500 mA 3) Drop voltage VDR – 1.10 1.20 V IQ = 800 mA 3) Drop voltage VDR – 1.30 1.40 V IQ = 1.0 A 3) Minimum Load Current 4) 4) Minimum load current required to maintain regulation Iq – 1.7 5.0 mA VI = 15 V Adjust Current IADJ – 100 120 µA IQ = 10 mA Adjust Current Cha nge ΔIADJ – 2 5 µA 1.4 V ≤(VI-VQ)≤ 13.6 V; 10 mA ≤ IQ ≤ 800 mA Temperature stability ΔVQ – 0.5 – %1) 5) 5) Specified by design; not subject to production test. Long Term Stability – – 0.3 – %1) 5) Current limit IQmax 1100 – 2250 mA VQ = 0.5 V RMS Output Noise – – 30 – ppm ppm of VQ, Tj = 25 °C

10 Hz ≤ f ≤ 10 kHz 5)

PSRR 65 70 – dB fr = 120 Hz, Vr = 1 VPP 5) IFX 1117 Data Sheet 7 Rev. 1.0, 2011-02-24

Data Sheet 9 Rev. 1.0, 2011-02-24 Output The IFX1117 requires a 10 μF outpu t capacitor with ESR ≤ 20 Ω for the stability of the regulation loop. The use of a tantalum output capacitor is recommended. For the adjustable device IFX1117ME V the output voltage level can be defined by a voltag e divider between Q, ADJ and GND. The output voltage calculates: VQ VREF 1 R2 ⎛⎞× IADJ R2×+= (1) At the input of the regulator a capacitor is recommended to compensate line influences. As a minimum a 100 nF ceramic input capacitor should be used. If the regulator is used in an environment with long input lines an input capacitance of 10 μF is suggested. AES02815_1117 CI1 CI2 VI I CQ2 VQ Q ADJ R2 CADJ IFX1117ME V VQ - VADJ = VREF 3 2 IADJ Figure 6 Typical Applicatio n Circuit IFX11 17ME V

Data Sheet 10 Rev. 1.0, 2011-02-24 IFX 1117 Typical Performance Characteristics Output Voltage VQ versus Junction Temperature T j Tj [°C] 25 50 100 125 ΔV Q [%] VQ- TJ.VSD 0.0 -1.0 -2.0 1.0 07 5 IQ = 10 mA 150 Dropout Voltage Vdr versus Junction Temperature Tj Tj [°C] Vdr [mV] VDR- TJ.VSD 1000 900 800 1100 0 150 1300 25 100 7512550 IQ = 500 mA IQ = 800 mA IQ = 100 mA Dropout Voltage Vdr versus Output Current IQ IQ [mA] 400 600 Vdr [mV] VDR-IQ.VSD 1000 900 800 1100 200 800 1300 Tj = 125 °C Tj = 25 °C Maximum Output Current IQ versus Junction Temperature Tj Tj [°C] IQ [A] IQMAX- TJ.VSD 1.6 1.4 1.2 1.8 1.0 2.2 0 150 25 100 75 12550 VQ = 0.5 V

Data Sheet 11 Rev. 1.0, 2011-02-24 IFX 1117 Typical Performance Characteristics Adjust Pin Current IADJ versus Junction Temperature Tj Tj [°C] IADJ [µA] IADJ.VSD 0 25 100 75 12550 Region of Stability Version ME V33 V33_ESR-IQ.VSD 0.1 0.01 ESR CQ [Ω] IQ [mA] 80 12040 160 CQ = 10 µF Tj = 25°C Tj = 125 °C Stable Region Power Supply Ripple Rejection PSRR versus Frequency f f [Hz] 10k PSRR [dB] PSRR.VSD 100 1k 100k IFX1117ME V VI = 5 V VRIPPLE = 1 V IQ = 10 mA CQ = 10 µF Tantalum IFX1117 ME V33 VI = 5 V IFX1117 ME V33 VI = 8 V Region of Stability Version ME V V_ESR-IQ.VSD 0.1 0.01 ESR CQ [Ω] IQ [mA] 80 12040 160 CQ = 10 µF Tj = 25°C Tj = 125 °C Stable Region

Data Sheet 12 Rev. 1.0, 2011-02-24 IFX 1117 Typical Performance Characteristics Load Transient Response Version ME V33 t [µs] 40 60 ΔVQ [mV] V33_dVQ-dIQ.v s d -100 0.6 0.1 20 80 ΙQ [A] -50 VI = 5 V CQ = 10 µF Tantalum Load Transient Response Version ME V t [µs] 40 60 ΔVQ [%] V_dVQ-dIQ.v s d 0.6 0.1 20 80 ΙQ [A] VI - VQ = 3 V CQ = 10 µF Tantalum Line Transient Response Version ME V33 t [µs] 40 60 Δ VQ [mV] V33_dVQ-dVI.v s d 5.75 4.75 20 80 VI [V] -50 IQ = 100 mA CQ = 10 µF Tantalum Line Transient Response Version ME V t [µs] 40 60 ΔVQ [%] V_dVQ- dVI.vsd 3.5 2.5 20 80 VI - VQ [V] IQ = 100 mA CQ = 10 µF Tantalum

Data Sheet 13 Rev. 1.0, 2011-02-24 Package Outline SOT223-PO V04 12 3 ±0.1 ±0.04 0.5 MIN. 0.28 0.1 MAX. 6.5±0.2 A 4.6 2.30.7±0.1

0.25 M A

1.6±0.1 7±0.3 B0.25 M ±0.23.5 B 0...10˚ SOT223-FPW V04 1.7 4.8 1.7 0.91.4 3.5 SOT223-FPR V04 1.4 4.8 1.4 1.11.2 Footprint Wave SolderingFootprint Reflow Soldering Figure 7 Outline and footprint PG-SOT223 Green Product (RoHS-Compliant) To meet the world-wide customer requireme nts for en vironmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020). Y ou can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”: http://www.infineon.com/products. SMD = Surface Mounted Device Dimensions in mm

Revision History

Rev. 1.0 2011-02-24 Data Sheet

81726 Munich, Germany

© 2011 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. The Infineon Technologies component described in this Data Sheet may be used in life-support devices or systems and/or automotive, aviation and aerospace applications or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support automotive, aviation and aerospace device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.